VanEck HIP Sustainable Muni ETF (BATS:SMI)

SHANGHAI, May 24, 2019 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC" or the "Company"; NYSE: SMI; SEHK: 981) today announced that the Company has notified the New York Stock Exchange ("NYSE") on May 24, 2019 (Eastern Time in the U.S.) that it will apply for the voluntary delisting of its American depositary shares ("ADSs") from the NYSE and the deregistration of such ADSs and underlying ordinary shares under the U.S. Securities Exchange Act of 1934, as amended (the "Exchange Act"). The Board of Directors of SMIC approved the delisting of its ADSs from NYSE and the deregistration of such ADSs and the underlying ordinary shares under the Exchange Act due to a number of considerations, including the limited trading volume of its ADSs relative to its worldwide trading volume, and the significant administrative burden and costs of maintaining the listing of the ADSs on the NYSE, the registration of the ADSs with the United States Securities and Exchange Commission (the "SEC") and complying with the periodic reporting and related obligations of the Exchange Act.

As such, SMIC intends to file a Form 25 with the SEC on or about June 3, 2019 to de-list its ADSs from the NYSE. The delisting of the ADSs from the NYSE is expected to become effective ten days thereafter. The last day of trading of the ADSs on the NYSE will be on or about June 13, 2019. From and after that, SMIC will no longer list its ADSs evidenced by American Depositary Receipts ("ADRs") on the NYSE.

Once the delisting has become effective and SMIC has met the criteria for deregistration, SMIC intends to file a Form 15F with the SEC on or about June 14, 2019 to deregister its ADSs and the underlying ordinary shares under the Exchange Act. Thereafter, all of SMIC's reporting obligations under the Exchange Act will be suspended unless the Form 15F is subsequently withdrawn or denied. Deregistration with the SEC and termination of SMIC's reporting obligations under the Exchange Act are expected to become effective 90 days after its filing of Form 15F with the SEC. Once the Form 15F is filed, SMIC will publish the information required under Rule 12g3-2(b) of the Exchange Act on its website, www.smics.com. SMIC will also continue to comply with its financial reporting and other obligations as a listed-issuer under the Rules Governing the Listing of Securities on The Stock Exchange of Hong Kong Limited (the "Listing Rules").

After delisting its ADSs from the NYSE, SMIC remains committed to serve its investor and intends to maintain its ADR program as a Level I program, which will enable American investors and current holders of SMIC ADSs to continue to hold and trade SMIC ADSs in the US over-the-counter market. As a result of the delisting of the ADSs, the trading of SMIC's securities will be concentrated on SMIC's primary market (The Stock Exchange of Hong Kong Limited).

SMIC reserves its rights in all respect to delay or withdraw the aforementioned filings prior to their effectiveness and will issue any further announcement if required under the Listing Rules or other applicable laws.

SMIC has filed with the SEC its annual report on Form 20-F for the year ended December 31, 2018.  The annual report is available on its website at www.smics.com.  SMIC will provide hard copies of the annual report, free of charge, to its shareholders and ADS holders upon request.

Fourth Quarter 2018 Financial Results

• Revenue was $787.6 million in 4Q18, compared to $850.7 million in 3Q18 and $787.2 million in 4Q17.
• Gross profit was $134.1 million in 4Q18, compared to $174.5 million in 3Q18 and $148.5 million in 4Q17.

First Quarter 2019 Guidance

The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

Revenue to decrease by 16% to 18% QoQ.
Gross margin to range from 20% to 22%.
Non-GAAP operating expenses, excluding the effect of employee bonus accrual, government funding, impairment loss of tangible and intangible assets, gain or loss on the disposal of machinery and equipment and gain from the disposal of living quarters, to range from $250 million to $255 million.
Non-controlling interests of our majority-owned subsidiaries to range from positive $10 million to positive $12 million (losses to be borne by non-controlling interests).
Dr. Zhao Haijun and Dr. Liang Mong Song, SMIC's Co-Chief Executive Officers commented, "With the support of our customers and colleagues, 2018 annual revenue grew 8.3%, which was the fourth consecutive year of growth, and represents a record high. Q4 2018 revenue was flat year over year; meanwhile, China revenue grew 12% YoY. Looking into 2019, our full year core business revenue growth target is in line with the foundry industry growth rate; however, based on current visibility, Q1 revenue is guided to fall 16%~18% QoQ, estimated as the trough of this year."

Dr. Zhao said, "The 2019 macro environment has a lot of uncertainties, and we are actively seeking growth opportunities through steady progress in expanding our customer base, enriching mature and specialty technology product mix and applications, and exploring value added opportunities."

Dr. Liang said, "We are working hard to establish advanced technology total solutions, with particular focus on the fundamentals of FinFET technology, platform development, and customer engagement. At present, SMIC's first generation of 14nm FinFET technology has already entered customer product verification; product reliability and yields have readily improved. Meanwhile, 12nm process development achieved breakthrough. Through our research and development's continuous innovation, optimized production, strengthening design, and pursuit of potential markets, we are confident in our future opportunities."

Third Quarter 2018 Financial Results

• Revenue was $850.7 million in 3Q18, compared to $890.7 million ($837.9 million, excluding technology licensing revenue) in 2Q18 and $769.7 million in 3Q17.
• Gross profit was $174.5 million in 3Q18, compared to $217.8 million ($165.0 million, excluding technology licensing revenue) in 2Q18 and $177.3 million in 3Q17.
• Gross margin was 20.5% in 3Q18, compared to 24.5% (19.7%, excluding technology licensing revenue) in 2Q18 and 23.0% in 3Q17.

Fourth Quarter 2018 Guidance

The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

Revenue to decrease by 7% to 9% QoQ.
Gross margin to range from 15% to 17%.
Non-GAAP operating expenses, excluding the effect of employee bonus accrual, government funding, impairment loss of machinery and equipment, gain or loss on the disposal of machinery and equipment and gain from the disposal of living quarters, to range from $226 million to $230 million.
Non-controlling interests of our majority-owned subsidiaries to range from positive $20 million to positive $22 million (losses to be borne by non-controlling interests).
Dr. Zhao Haijun and Dr. Liang Mong Song, SMIC's Co-Chief Executive Officers commented, "With the support of our customers and the efforts of our colleagues, our third quarter performance was in line with guidance. When excluding revenue from technology licensing, revenue from our China region continued to grow 40% year over year, and 5% quarter over quarter. Wireless communications, power management and fingerprint IC applications were the major growth drivers. Looking at the full year, our annual revenue target remains unchanged.

Looking at the fourth quarter, although the industry has entered a period of seasonal adjustment, we continue to carry out customer engagement and verification on our advanced technology platforms, so as to gather strength for future growth.

Throughout this year, many changes have taken place both in the industry and market. At present, the most important task for SMIC is to seize the opportunities in the market and in new applications, and actively enhance the quality of products and customer service. In terms of technology research and development, we will continue to put in our utmost effort to focus on the planning and development of mainstream and advanced technology platforms, and maintain long-term and stable partnership with our customers. As China's preferred foundry partner, we believe that together with our customers, employees and shareholders, we will benefit from the growth opportunities of China's IC market."

SHANGHAI, Aug. 30, 2018 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) one of the leading semiconductor foundries in the world, announces the unaudited interim results of operations of the Company and its subsidiaries for the six months ended June 30, 2018.

FINANCIAL HIGHLIGHTS

Revenue was US$1,721.8 million for the six months ended June 30, 2018, an increase of 11.5% from US$1,544.3 million for the six months ended June 30, 2017. Excluding the recognition of technology licensing revenue, revenue was US$1,561.3 million for the six months ended June 30, 2018, compared to US$1,544.3 million for the six months ended June 30, 2017.
Gross profit was US$438.0 million for the six months ended June 30, 2018, an increase of 5.6% from US$415.0 million for the six months ended June 30, 2017. Excluding the recognition of technology licensing revenue, gross profit was $277.6 million for the six months ended June 30, 2018, compared to $415.0 million for the six months ended June 30, 2017.
Gross margin was 25.4% for the six months ended June 30, 2018, compared to 26.9% for the six months ended June 30, 2017. Excluding the recognition of technology licensing revenue, gross margin was 17.8% for the six months ended June 30, 2018, compared to 26.9% for the six months ended June 30, 2017.
Revenue from China-region customers grew to 56.3% of total revenue excluding technology licensing for the six months ended June 30, 2018, compared to 46.0% for the six months ended June 30, 2017, representing a revenue growth of 23.9%.
The net debt to equity ratio remained low at 9.7% as of June 30, 2018.

Second Quarter 2018 Financial Reports

• Revenue was $890.7 million in 2Q18, an increase of 7.2% QoQ from $831.0 million in 1Q18 and an increase of 18.6% YoY from $751.2 million in 2Q17.
• Earnings per ADS (2)Basic and Diluted was $0.05 vs. last years same quarter of $0.04.

Dr. Zhao Haijun and Dr. Liang Mong Song, SMIC's Co-Chief Executive Officers commented, "SMIC is in a period of transition and preparation. We are making encouraging progress in advancing our technology, building up our technology platforms, and forging partnerships. At the same time, we are on track to grow high-single digits annual revenue as demand and utilizations recovered in the second quarter. In the second quarter, our revenue from the China region when excluding the technology license revenue grew 14% sequentially and 38% year over year. As the preferred foundry partner in China, we are positioned to benefit from the growth opportunities of the China IC market.

We are pleased to say that we have achieved significant progress on our 14nm FinFET development. The R&D of our first version of FinFET technology is now ready for business engagement. In addition to our 28nm PolySiON and HKC, our HKC+ technology development is now complete. Our 28nm HKC continues to ramp up, as its yield meets industry benchmark. Moreover, we will continue to expand and enhance both our mature and advanced technology platforms to provide comprehensive and competitive services."

First Quarter 2018 Financial Results

• Revenue was $831.0 million, and $723.4 million excluding the recognition of the technology licensing revenue in 1Q18 (the "Licensing Revenue"), compared to $787.2 million in 4Q17 and $793.1 million in 1Q17.
• Gross profit was $220.2 million, and $112.6 million excluding the effect of the Licensing Revenue in 1Q18, compared to $148.5 million in 4Q17 and $220.8 million in 1Q17.

Second Quarter 2018 Guidance

The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

• Revenue to increase by 7% to 9% QoQ, including the forecast to recognize the technology licensing revenue estimated at $56 million.
• Gross margin to range from 23% to 25%.
• Non-GAAP operating expenses, excluding the effect of employee bonus accrual, government funding, gain or loss on the disposal of machinery and equipment and gain from the disposal of living quarters, to range from $227 million to $233 million.
• Non-controlling interests of our majority-owned subsidiaries to range from positive $17 million to positive $19 million (losses to be borne by non-controlling interests).

Dr. Zhao HaiJun and Dr. Liang Mong Song, SMIC's Co-Chief Executive Officers commented, "SMIC is undergoing a period of transition. We are confronting many challenges; however, through the efforts of the past quarter, we are pleased that things are looking better than originally expected, with customer demand picking up, utilizations rebounding, and encouraging progress on R&D and business platform development.

Our revenue in the first quarter from the China region grew 28% sequentially and 40% year over year, and when excluding the technology license revenue, the China region grew 2% sequentially and 11% year over year. We work to develop our business platforms into comprehensive service offerings in areas that are aligned with meaningful opportunities stemming from the China market.

Meanwhile, we accelerate the development of our technology, aiming to build up complete technology platforms, which integrate competitive technology, ready-to-use IP, and comprehensive design services, in order to increase competitiveness and capture the needs of customers."

SHANGHAI, March 29, 2018 /PRNewswire/ -- Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) ("SMIC" or the "Company"), one of the leading semiconductor foundries in the world, announced the audited annual results of operations of the Company for the year ended December 31, 2017.

HIGHLIGHTS

Revenue was a record high of US$3,101.2 million in 2017, compared to US$2,914.2 million in 2016, representing an increase of 6.4%.
Gross profit was US$740.7 million in 2017, compared to US$849.7 million in 2016.
Gross margin was 23.9% in 2017, compared to 29.2% in 2016.
Revenue from 28nm grew to a record high of 8.0% of total wafer revenue in 2017, representing a revenue increase of 4.4 times compared to 2016.
Net cash generated from operating activities was a record high of US$1,080.7 million in 2017, compared to US$977.2 million in 2016, representing an increase of 10.6%.
The net debt to equity ratio remained low at 11.8% as of December 31, 2017.

SHAOXING, China, March 1, 2018 /PRNewswire/ -- SMIC, Shaoxing Government, and Shengyang Group together announced today the founding of the Semiconductor Manufacturing Electronics (Shaoxing) Corporation (planned) with joint capital contributions. The signing of the joint venture agreement marks the start of a project to bring the manufacture of MEMS and power devices to Shaoxing. The Secretary of the Shaoxing Municipal Party Committee, Mr. Ma Weiguang, the Deputy Secretary and Deputy Mayor, Mr. Sheng Yuechun, the Member of the Standing Committee and Secretary General, Mr. Zhong Hongjiang, the Chairman of SMIC, Dr. Zhou Zixue, the Chief Financial Officer of SMIC, Dr. Gao Yonggang, and Senior Vice President of Strategic Development at SMIC, Ms. Ge Hong, attended the signing ceremony.

Application fields such as Artificial Intelligence, mobile communications, the Internet of Things, automotive electronics, and industrial controls are thriving and growing in pace with the growth of our intelligent society. Specialty MEMS technologies are at the core of the intelligentization of our industry and society, while the advanced manufacturing base for MEMS and power device chips is still relatively weak in China's domestic semiconductor ecosystem. The investment of this signed joint venture amounts to ¥5.88 Billion RMB. The joint venture will focus on the fields of MEMS and power devices with a wafer and module foundry that will continue to grow and develop with sustained R&D investment. A comprehensive foundry for specialty technologies will be achieved to win leadership in China's domestic market.

The Chairman of SMIC, Dr. Zhou Zixue indicated in his speech, "SMIC has worked on the specialty technologies of MEMS and power devices for almost ten years. This joint venture project with Shaoxing meets our strategic objectives to build an advanced manufacturing industrial cluster in the Yangtze River Delta region. We have confidence that we will create a leading first-class semiconductor corporation focused on specialty technologies."

The Secretary of the Shaoxing Municipal Party Committee, Mr. Ma Weiguang said, "In the 1980s, Shaoxing used to be one of the most important towns for China's IC manufacturing industry. After 40 years the smooth landing of this project will accelerate the transformation and upgrading of the phrase 'Made in Shaoxing' into 'Intelligent Manufacturing in Shaoxing'. Meanwhile, seizing the opportunity to cooperate with SMIC will help to build the IC industry for specialty technologies in Shaoxing and make contributions to Intelligent Manufacturing in China."

Fourth Quarter 2017 Financial Results

• Revenue was $787.2 million in 4Q17, an increase of 2.3% QoQ from $769.7 million in 3Q17 and a decrease of 3.4% YoY from $814.8 million in 4Q16.
• Earnings per ADS(2) Basic was $0.05 vs. last years $0.12.

First Quarter 2018 Guidance:

The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

Revenue to increase by 7% to 9% QoQ, including the forecast to recognize the technology licensing revenue estimated at $150 million.
Gross margin to range from 25% to 27%.
Non-GAAP operating expenses, excluding the effect of employee bonus accrual, government funding, gain or loss on the disposal of machinery and equipment and gain from the disposal of living quarters, to range from $212 million to $218 million.
Non-controlling interests of our majority-owned subsidiaries to range from positive $15 million to positive $17 million (losses to be borne by non-controlling interests).
Dr. Zhao HaiJun and Dr. Liang Mong Song, SMIC's co-Chief Executive Officers commented, "Looking back at 2017, we increased annual revenue 6.4% YoY, in line with the foundry industry growth rate. We also successfully ramped up our 28nm technology portfolio and have seen more than 10% revenue contribution in the fourth quarter of 2017. Meanwhile, we have continued to enrich our technology offerings to diversify our revenue streams; for example, our auto and industrial revenue doubled in 2017 compared to 2016.

SMIC is in transition to align to customers' fast technology migration in today's dynamic foundry environment, and we have great opportunities in front of us as the largest and most advanced foundry in China. At the same time, the overall industry dynamic has become more volatile with increased competition and pricing pressure. However, we are confident in our team's capability to utilize this time to prepare, develop and recalibrate our technology, to create greater value for the future."

SHANGHAI and SANTA CLARA, Calif., Dec. 13, 2017 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC") (NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, and Efinix™ , an innovator in programmable products platforms and technologies, today jointly announced that Efinix has received silicon product samples for its first Quantum™ accelerated programmable product platform built on SMIC's 40nm process. A milestone was achieved with record breaking efficiency -- going from product development using SMIC's Physical Design Kit (PDK) to system validation of the samples in less than six months.

"This is the first time Efinix has worked with SMIC, and I am impressed by the strong support they provided. SMIC's business and technical engagement with us created a strong foundation for our development success," said Sammy Cheung, co-founder, CEO, and president of Efinix.  "Now we can focus on our 2018 production milestones and swiftly deploy our first Quantum-accelerated product line to serve high-volume markets worldwide."

Efinix's Quantum programmable technology delivers a 4X Power-Performance-Area advantage over traditional programmable technologies. This disruptive advantage enables Efinix's silicon products to compete in high-growth markets such as custom logic, deep learning, and compute acceleration.

"SMIC's 40nm Low Leakage platform has already been in mass production for over 5-years. It has more than 220 products. We are excited to be working with Efinix to develop the Quantum programmable technology on our advanced and reliable platform," said Sunny Hui, senior vice president of Worldwide Marketing at SMIC. "FPGA programmable products are technically challenging to develop, but Efinix's Quantum technology made it straightforward.  We look forward to working with Efinix to deliver its first product line to production and to support joint development in the near future."

"This is the first time in our industry that I have seen this level of efficiency in programmable product development," said Bill Hata, former senior vice president of Worldwide Operations and Engineering at Altera Corporation (now part of Intel). Hata has more than 30 years of semiconductor industry experience and serves on Efinix's Advisory Board. "This efficiency is made possible by the silicon process agnostic nature of the Quantum architecture.  Unlike leading FPGAs, this technology does not require special silicon process recipes to boost performance and logic element (LE) density."

Efinix is currently working with a few enabling customers.  Details of the first phase of Quantum- accelerated product line will be released in the first quarter of 2018.

SHANGHAI, Nov. 29, 2017 /PRNewswire/ -- Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) ("SMIC," the "Company," or "our"), one of the leading semiconductor foundries in the world, announces

(1) PLACING OF NEW SHARES UNDER GENERAL MANDATE

(2) PROPOSED ISSUE OF US$65 MILLION PERPETUAL SUBORDINATED CONVERTIBLE SECURITIES

(3) PRE-EMPTIVE RIGHT OF DATANG

(4 PRE-EMPTIVE RIGHT OF CHINA IC FUND AND

(5) PRE-EMPTIVE RIGHT OF COUNTRY HILL

PLACING OF NEW SHARES UNDER GENERAL MANDATE

The Board is pleased to announce that on 29 November 2017, the Company entered into the Placing Agreement with the Joint Placing Agents whereby the Company conditionally agreed to place, through the Placing Agents, 241,418,625 Placing Shares to not less than six independent Placees at a price of HK$10.65 per Placing Share. The Placing Shares will be allotted and issued pursuant to the General Mandate and will rank pari passu in all respects with the Shares. The issue of the Placing Shares is not subject to the approval of the Shareholders.

Assuming 241,418,625 Placing Shares are successfully placed, the Placing Shares represent (i) approximately 5.17% of the existing issued share capital of the Company as at the date of this announcement; and (ii) approximately 4.92% of the issued share capital of the Company as enlarged by the issue of the Placing Shares (assuming that there will be no change in the issued share capital of the Company between the date of this announcement and completion of the Placing save for the issue of such Placing Shares).

The Placing Price represents (i) a discount of approximately 4.91% to the Closing Price of HK$11.20 per Share as quoted on the Stock Exchange on 28 November 2017, being the last full Trading Day immediately before the execution of the Placing Agreement; (ii) a discount of approximately 9.59% to the average Closing Prices of approximately HK$11.78 per Share as quoted on the Stock Exchange for the last five consecutive Trading Days up to and including 28 November 2017; and (iii) a discount of approximately 8.74% to the average Closing Prices of approximately HK$11.67 per Share as quoted on the  Stock Exchange for the last ten consecutive Trading Days up to and including 28 November 2017.

The gross proceeds of the Placing will be approximately HK$2.57 billion and the net  proceeds of the Placing (after deduction of fees, commissions and expenses) will amount to approximately HK$2.55 billion. The net proceeds raised upon completion of the Placing will be approximately HK$10.56 per Placing Share. The aggregate nominal value of the Placing Shares will be HK$7,535,544.

An application will be made to the Stock Exchange for the listing of, and permission to deal in, the Placing Shares.

Completion of the Placing is subject to the satisfaction or waiver of the conditions precedent in the Placing Agreement. Please refer to the section headed ''The Placing Agreement'' below for further information.

PROPOSED ISSUE OF US$65 MILLION PERPETUAL SUBORDINATED CONVERTIBLE SECURITIES

On 29 November 2017, the Company and the Joint Managers entered into the Placed PSCS Subscription Agreement, pursuant to which each of the Joint Managers has agreed to subscribe and pay for, or to procure subscribers to subscribe and pay for the Placed PSCS to be issued by the Company in an aggregate principal amount of US$65 million.

Based on the initial Conversion Price of HK$12.78 and assuming full conversion of the Placed PSCS at the initial Conversion Price, the Placed PSCS will be convertible into approximately 39,688,654 Placed Conversion Shares, representing (i) approximately 0.85% of the issued share capital of the Company on the Last Trading  Day (ii)  approximately 0.81% of the issued share capital of the Company as enlarged by the Placing Shares (assuming that there is no change in the issued share capital of the Company, save for the issue of the Placing Shares); and (iii) approximately 0.80% of the issued share capital of the Company as enlarged by the Placing Shares and assuming the full conversion of the Placed PSCS at the initial Conversion Price (assuming that there is no change in the issued share capital of the Company, save for the issue of the Placing Shares and Placed Conversion Shares).

The Placed Conversion Shares will be allotted and issued pursuant to the General Mandate and will rank pari passu in all respects with the Shares then in issue on the relevant conversion date. The issue of the Placed PSCS is not subject to the approval of the Shareholders.

An application will be made to the Stock Exchange for the listing of, and permission to deal in, the Placed Conversion Shares. An application will be made to the Singapore Exchange for the listing and quotation of the Placed PSCS.

Completion of the Placed PSCS Subscription Agreement is subject to the satisfaction or waiver of the conditions precedent in the Placed PSCS  Subscription Agreement. In addition, the Placed PSCS Subscription Agreement may be terminated in certain circumstances. Please refer to the section headed ''The Placed PSCS Subscription Agreement'' below for further information.

PRE-EMPTIVE RIGHT OF DATANG

Reference is made to the Company's announcement dated 10 November 2008 in relation to the Datang Purchase Agreement.

Pursuant to the Datang Purchase Agreement, in case of any issue of new Shares or securities convertible into Shares, subject to certain exceptions, Datang has a pre-emptive right to subscribe for (i) a pro rata portion of such new securities being issued equivalent to the percentage of the issued share capital of the Company then owned by Datang immediately prior to the issue of such securities; or (ii) should such issue of new Shares or securities convertible into Shares result in a single investor or investor group acting in concert beneficially owning more Shares than Datang and its wholly-owned subsidiary, one Share more than the number of Shares proposed to be beneficially owned by such prospective largest shareholder of the Company. Datang's pre-emptive right is applicable to the issue of the Placing Shares and the Placed PSCS, the China IC Fund Pre-emptive Subscription, the China IC Fund Further Subscription and any Country Hill Pre-emptive Subscription. Pursuant to the Datang Purchase Agreement and the Listing Rules, completion of any such issue of the Datang Subscription Securities to, and subscription of the Datang Subscription Securities by, Datang upon exercise of its pre-emptive right will be further subject to the receipt of any required regulatory approvals and the approval of the independent Shareholders.

Any exercise by Datang of its pre-emptive right to subscribe for the Datang Pre-emptive Securities in connection with the issue of the Placing Shares and the Placed PSCS, the China IC Fund Pre-emptive Subscription and any Country Hill Pre-emptive Subscription will be at a price equivalent to the Placing Price (in the case of the Datang Pre-emptive Shares) and/or the issue price of the Placed PSCS (in the case of the Datang Pre-emptive PSCS).

The Company has notified Datang in accordance with the terms of the Datang Purchase Agreement in respect of the issue of the Placing Shares and the Placed PSCS, the China IC Fund Pre-emptive Subscription, the China IC  Fund Further Subscription and the Country Hill Pre-emptive Subscription. Pursuant to the Datang Purchase Agreement, Datang is deemed to have elected not to exercise its pre-emptive right if it does not respond to  the notice within ten (10) business days following the date of the notice.

As at the date of this announcement, the Company has been informed by Datang in a non-legally binding letter of intent that it intends to  exercise its pre-emptive right in relation to the issue of the Placing Shares and the Placed PSCS, the China IC Fund Pre-emptive Subscription, the China IC Fund Further Subscription and any Country Hill Pre-emptive Subscription, up to the amount it is entitled to under the Datang Purchase Agreement based on terms and conditions that are substantially the same as the Placing and the issue of the Placed PSCS. The Company will make such further announcement as is necessary under the Listing Rules in relation thereto.

Datang has also indicated to the Company that it intends to subscribe for the Datang Further PSCS, in addition to the Datang Pre-emptive PSCS, based on terms and conditions that are substantially the same as the issue of the Placed PSCS, for a principal amount (for the Datang Further PSCS only) of approximately US$100 million (subject to adjustment).

The Company will make such further announcement as is  necessary under the Listing Rules in relation thereto.

PRE-EMPTIVE RIGHT OF CHINA IC FUND

Reference is made to the Company's announcement dated 12 February 2015 in relation to the China IC Fund Purchase Agreement.

Pursuant to the China IC Fund Purchase Agreement, in case of any issue of new Shares or securities convertible into Shares, subject to certain exceptions, China IC Fund has a pre-emptive right to subscribe for a pro rata portion of such new securities being issued equivalent to the percentage of the issued share capital of  the Company then owned by China IC Fund immediately prior to the issue of such securities. China IC Fund's pre-emptive right is applicable to the issue of the Placing Shares and the Placed PSCS, the Datang Pre-emptive Subscription, the Datang Further Subscription and any Country Hill Pre-emptive Subscription. Pursuant to the China IC Fund Purchase Agreement and the Listing Rules, completion of any such issue of the China IC Fund Subscription Securities to, and subscription of the China IC Fund Subscription Securities by, China IC Fund upon exercise of its pre-emptive right will be further subject to the receipt of any required regulatory approvals and the approval of the independent Shareholders.

Any exercise by China IC Fund of its pre-emptive right to subscribe for the China IC Fund Pre-emptive Securities in connection with the issue of the Placing Shares and the Placed PSCS, the Datang Pre-emptive Subscription and any Country Hill Pre-emptive Subscription will be at a price equivalent to the Placing Price (in the case of the China IC Fund Pre- emptive Shares) and/or the issue price of the Placed PSCS (in the case of the China IC Fund Pre-emptive PSCS).

The Company has notified China IC Fund in accordance with the terms of the China IC Fund Purchase Agreement in respect of the issue of the Placing Shares and the Placed PSCS, the Datang Pre-emptive Subscription, the Datang Further Subscription and the Country Hill Pre-emptive Subscription. Pursuant to the China IC Fund Purchase Agreement, China IC Fund is deemed to have elected not to exercise its pre-emptive right if it does not respond to the notice within ten (10) business days following the date of the notice.

As at the date of this announcement, the Company has been informed by China IC Fund in a non-legally binding letter of intent that it intends to exercise its pre-emptive right in relation to the issue of the Placing Shares and the Placed PSCS, the Datang Pre-emptive Subscription, the Datang Further Subscription and any Country Hill Pre-emptive Subscription, up to the amount it is entitled to under the China IC Fund Purchase Agreement based on terms and conditions that are substantially the same as the Placing and the issue of the Placed PSCS.

China IC Fund has also indicated to the Company that it intends to subscribe for the China IC Fund Further PSCS, in addition to the China IC Fund Pre-emptive PSCS, based on terms and conditions that are substantially the same as the issue of the Placed PSCS, for an aggregate principal amount (for the China IC Fund Further PSCS and China IC Fund Pre- emptive PSCS) amounting up to an aggregate of approximately US$300 million.

The Company will make such further announcement as is necessary under the Listing Rules in relation thereto.

PRE-EMPTIVE RIGHT OF COUNTRY HILL

Reference is made to the Company's announcement dated 18 April 2011 in relation to the Country Hill Subscription Agreement.

Pursuant to the Country Hill Subscription Agreement, in case of any issue of new Shares or securities convertible into Shares, subject to certain exceptions, Country Hill has a preemptive right to subscribe for a pro rata portion of such new securities being issued equivalent to the percentage of the issued share capital of the Company then owned by Country Hill immediately prior to the issue of such securities. Country Hill's pre-emptive right is applicable to the issue of the Placing Shares and the Placed PSCS, the Datang Pre- emptive Subscription, the Datang Further Subscription, the China IC Fund Pre-emptive Subscription and the China IC Fund Further Subscription. Pursuant to the Country Hill Subscription Agreement, completion of any such issue of the Country Hill Pre-emptive Securities to, and subscription of the Country Hill Pre-emptive Securities by, Country Hill upon exercise of its pre-emptive right will be further subject to the receipt of any required regulatory approvals.

Any exercise by Country Hill of its pre-emptive right to subscribe for the Country Hill Pre-emptive Securities in connection with the issue of the Placing Shares and the Placed PSCS, the Datang Pre-emptive Subscription and the China IC Fund Pre-emptive Subscription will be at a price equivalent to the Placing Price (in the case of the Country Hill Pre-emptive Shares) and/or the issue price of the Placed PSCS (in the case of the Country Hill Pre- emptive PSCS).

The Company has notified Country Hill in accordance with the terms of the Country Hill Subscription Agreement in respect of the issue of the Placing Shares and the Placed PSCS, the Datang Pre-emptive Subscription, the Datang Further Subscription, the China IC Fund Pre-emptive Subscription and the China IC Fund Further Subscription. Pursuant to the Country Hill Subscription Agreement, Country Hill is deemed to have elected not to exercise its pre-emptive right with respect to the Country Hill Pre-emptive Securities if it does not respond to the notice within ten (10) business days following the date of the notice.

As at the date of this announcement, the Company has not been notified by Country Hill whether it intends to exercise its pre-emptive right in relation to the issue of the Placing Shares and the Placed PSCS, the Datang Pre-emptive Subscription, the Datang Further Subscription, the China IC Fund Pre-emptive Subscription and the China IC Fund Further Subscription. The Company will make such further announcement as is necessary under the Listing Rules in relation thereto.

SHAREHOLDER LOCK-UP UNDERTAKINGS BY DATANG HK AND XINXIN HK

Reference is made to the information of the Shareholder lock-up undertakings by Datang HK and Xinxin HK as set out in the Company's announcement dated 28 November 2017 in relation to, among other things, the potential exercise of pre-emptive rights by Datang and China IC Fund.

Each of Datang HK and Xinxin HK has given a lock-up undertaking in relation to the Shares held by it directly (or through nominees) for a period of 90 days to facilitate an orderly marketing, distribution and trading of the Placing Shares and the Placed PSCS.

Each of Datang HK and Xinxin HK has also given a lock-up undertaking in relation to the Shares to be issued to it (or its nominees) upon exercise of pre-emptive right by each of Datang (in the case of Datang HK) and China IC Fund (in the case of Xinxin HK) in connection with the Placing for a period of 90 days in order to further facilitate an orderly marketing, distribution and trading of the Placing Shares.

USE OF PROCEEDS

The gross proceeds from the issue of the Placing Shares and the Placed PSCS will be approximately US$394 million.

The net proceeds (net of fees, commissions and expenses) from the issue of the Placing Shares and the Placed PSCS will be approximately US$391 million.

It is estimated that, assuming Datang and China IC Fund each exercise their respective preemptive right, in accordance with their respective letters of intent, the net proceeds (net of fees, commissions and expenses) from the issue of the Placing Shares, the Placed PSCS, the Datang Subscription Securities and the China IC Fund Subscription Securities would be approximately US$969 million.

The Company intends to use the net proceeds (net of fees, commissions and expenses) from the issue of the Placing Shares, the Placed PSCS, the Datang Subscription Securities and the China IC Fund Subscription Securities for the Company's capital expenditure for capacity expansion and other general corporate purposes.

LISTING RULES IMPLICATIONS

As each of  Datang and China IC  Fund is a  substantial shareholder of the Company and thus a connected person of the Company, the Datang Pre-emptive Subscription, the China IC Fund Pre-emptive Subscription, the Datang Further Subscription or the China IC Fund Further Subscription (including any issue of Shares on conversion of the Datang Pre-emptive PSCS, the China IC Fund Pre-emptive PSCS, the Datang Further PSCS and the China IC Fund Further PSCS) will constitute a connected transaction of the Company and will be subject to independent Shareholders' approval under the Listing Rules. As at the date of this announcement, the Company has been informed by each of Datang and China IC Fund in a non-legally binding letter of intent that it intends to fully exercise its pre-emptive right it is  entitled to under the Datang Purchase Agreement (in the case of Datang) or the China IC Fund Purchase Agreement (in the case of China IC Fund) and to subscribe for the Datang Subscription Securities and the China IC Fund Subscription Securities respectively, based on terms and conditions that are substantially the same as the issue of the Placing Shares and/or the Placed PSCS. The Company will make such further announcement as is necessary if any agreement(s) is/are entered into by the Company with Datang or China IC Fund regarding the above matters.

Shareholders and potential investors should note that the completion of the Placing and the completion of the issue of the Placed PSCS are subject to the fulfilment of the conditions under the Placing Agreement and the Placed PSCS Subscription Agreement, respectively. As the Placing, the issue of the Placed PSCS, the Datang Pre-emptive Subscription, the China IC Fund Pre-emptive Subscription, the Datang Further Subscription, the China IC Fund Further Subscription and the Country Hill Pre-emptive Subscription may or may not proceed, Shareholders and potential investors are reminded to exercise caution when dealing in the Shares.

Third Quarter 2017 Financial Results

• Revenue was $769.7 million in 3Q17, an increase of 2.5% QoQ from $751.2 million in 2Q17 and a decrease of 0.7% YoY from $774.8 million in 3Q16.
• EPS diluted $0.03 vs. last years same quarter of $0.12.

Dr. Haijun Zhao and Dr. Liang Mong Song, SMIC's co-Chief Executive Officers commented, "Our third quarter revenue was in line with guidance and grew 2.5% quarter over quarter. The sequential growth came largely from the broad-based recovery in smartphone related shipments. By process node, 28nm wafer revenue grew 38.9% quarter over quarter, and 0.18um grew 33.8% quarter over quarter.

In the three years preceding 2017, SMIC had grown revenue and profitability on high utilizations, and in these two years, we have entered a period of transition as we prepare our technology and facilities for the next stage of growth. In the near-term, our growth drivers include: 28nm, flash memory, fingerprint sensors, and power management ICs. In the long-term, we work to speed up execution and focus our resources on key technology platforms, in which we strive to be the foundry-of-choice.

We believe in the importance of focusing our investment into strategic areas that support the long-term growth, profitability, and viability of our business. With our strengthened team, focused direction, and strong position in China, SMIC is well positioned to execute on our targets and benefit from the opportunities in the IC market. We work hard to grow the sustainable value of the company for all our stakeholders."

Fourth Quarter 2017 Guidance:

The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

• Revenue to increase by 1% to 3% QoQ.
• Gross margin to range from 18% to 20%.
• Non-GAAP operating expenses, excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters, to range from $204 million to $210 million.
• Non-controlling interests of our majority-owned subsidiaries to range from positive $48 million to positive $50 million (losses to be borne by non-controlling interests).

SHANGHAI, Sept. 28, 2017 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, and Sanechips Technology Co., Ltd. (previously named ZTE Microelectronics Technology Co., Ltd.), a global leader in telecommunications and information technology, jointly announced the launch of RoseFinch7100 which is the first commercial NB-IoT (Narrow Band Internet of Things) chip designed and manufactured by Mainland Chinese firms independently. Based on SMIC's 55nm ULP+RF+eFlash (Ultra Low Power+ Radio Frequency +embedded Flash) technology, the chip can be extensively used in wireless meters, shared bikes, smart appliances, smart city, smart agriculture, and in other IoT fields.

The SMIC 55nm ULP+RF+eFlash technology platform is focused for use on ultra-low-power IoT applications. The process and performance improvements are based on the stable 55nm logic and mix-signal technologies. The nominal operating voltage can be lowered 30%, and the device will reduce 45% of dynamic power consumption, and 70% of static power consumption, as well as lowering the SRAM leakage. Furthermore, the platform is compatible with RF and eFlash technologies and has complete IP solutions. Compared with other technology nodes, SMIC 55nm ULP+RF+eFlash technology is a reliable platform for low power IoT SoC design; it can meet the strict requirements of NB-IoT for low stand-by power consumption and small package size.

Based on SMIC's complete 55nm ultra low power technology platform and Sanechips' powerful design capabilities, the NB-IoT SoC RoseFinch7100 is specially designed for extensive low power IoT applications. Its sleep power is 2uA which accounts for 16% of its total power consumption while sending and receiving message once per day. In addition, RoseFinch7100 uses single chip design with minimum peripherals and supports R14 full band with integrated cloud-chip security performance as well as open application architecture.

"I am very glad to work closely with Sanechips to promote the design, manufacturing and commercialization of NB-IoT chips in Mainland China. This achievement fills the gap in the China market and conforms to SMIC's consistent IoT technology development strategy as well," said Mr. Mike Rekuc, Executive Vice President of Worldwide Sales & Marketing, SMIC. "By integrating ULP, RF and embedded flash technologies, SMIC's 55nm platform is highly suitable for NB-IoT and other IoT chip products and can meet customers' demands for power and performance."

"SMIC's strong manufacturing capabilities effectively guaranteed the commercialization of Sanechips' new generation of NB-IoT chip, RoseFinch7100, on time. According to the test results, the chip's function and performance all met the expected requirements and achieved leading industry benchmarks in several core indicators of IoT related applications, including sleep power consumption, cut-off voltage, and peripheral interface quantity, with the obvious advantages of low cost and low power consumption," said Mr. Long Zhijun, Vice President of Sanechips. "The chip will further revolutionize the IoT industry. Other NB-IoT commercial products will meanwhile be launched by collaborating with several partners. This world-leading chip is catching up to the launch schedules of China's big three telecomm operators and can help customers seize the best time to enter the market."

Second Quarter 2017 Financial Results

• Revenue was $751.2 million in 2Q17, a decrease of 5.3% QoQ from $793.1 million in 1Q17 and an increase of 8.8% YoY from $690.2 million in 2Q16.
• Gross profit was $194.1 million in 2Q17, compared to $220.8 million in 1Q17 and $217.8 million in 2Q16.

Dr. Haijun Zhao, SMIC's Chief Executive Officer, commented, "Our second quarter revenue grew 8.8% year over year and declined 5.3% quarter over quarter. Most of our year over year growth, by application, came from automotive and industrial, and by device, from CMOS image sensors, NOR flash, application processors and power IC.

This year our team continues to ramp up 28nm, which will be one of our primary growth drivers. 28nm grew 12-fold year over year and 24.8% quarter over quarter, and is on track to reach high single-digits contribution by Q4 this year. In addition, we are happy to see that fingerprint sensors have begun to pick up strongly. We also see continued growth in flash memory and collaborate closely with our clients to capture opportunities in new handset models, IOT, automotive, and industrial segments.

Our sustainable profitability strategy remains: to fully utilize existing assets, differentiate technology, and advance technology to serve the migration of our customers' products. First, we must work to expand our cooperation with existing customers. Second, we aim for excellence in mature technology. Third, we aim to improve specialty platforms in which we already hold good market share, such as CIS, special MCU, flash memory and others.

Although the near-term outlook is not as seasonally expected, we work diligently to maintain our position as the foundry-of-choice in China. Through deepening cooperation with customers, enhancing product quality/service/and offerings, SMIC is in a great position to benefit from the broad-based growth in the semiconductor market."

Third Quarter 2017 Guidance:

The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

Revenue to be flat to up by 3% QoQ.
Gross margin to range from 22% to 24%.
Non-GAAP operating expenses, excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters, to range from $179 million to $185 million.
Non-controlling interests of our majority-owned subsidiaries to range from zero to positive $3 million (losses to be borne by non-controlling interests).

First Quarter 2017 Financial Results

• Revenue was $793.1 million in 1Q17, a decrease of 2.7% QoQ from $814.8 million in 4Q16 and an increase of 25.0% YoY from $634.3 million in 1Q16.
• Net profit for the period attributable to SMIC was $69.8 million in 1Q17, as compared to $104.0 million in 4Q16 and $61.4 million in 1Q16.

Second Quarter 2017 Guidance:

The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

• Revenue to decline by 3% to 6% QoQ.
• Gross margin to range from 25% to 27%.
• Non-GAAP operating expenses, excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters, to range from $178 million to $184 million.
• Non-controlling interests of our majority-owned subsidiaries to range from positive $6 million to positive $8 million (losses to be borne by non-controlling interests).

Dr. Haijun Zhao, SMIC's Chief Executive Officer, commented, "Our team delivered a good quarter with year-on-year growth, improved operating income, and strong EBITDA in Q1 2017. Revenue grew 25.0% year over year, representing a sequential decline of 2.7%. Operating profit grew 17.0% YoY and 57.9% QoQ. EBITDA was a record high of $312.4 million, an increase of 42.8% YoY and 13.9% QoQ and representing an EBITDA margin of 39.4%.

In the first half of 2017, we are confronting the challenges of customer changes in market positioning, seasonal inventory adjustments, and overall muted handset market growth in China; however, we have actively pursued new incremental revenue from a variety of customers and markets to mitigate the impact of such headwinds. We believe we are in a great position, both strategically and financially to weather this cyclical downturn and are positioned to benefit from some exciting future trends, including automotive, industrial, internet of things, and others.

Our 28nm is ramping up and reached 5.0% of wafer revenue in Q1, representing a growth of 39.0% QoQ. We continue to work with our customers on 28nm new tape outs for a diverse set of applications. 55nm wafer revenue sequentially grew 29.1% YoY and 9.1% QoQ. We continue to ramp 28nm, 55nm and numerous products on 8-inch; and from a device-perspective, we are pursuing growth in areas in which we are seeing meaningful demand such as NOR flash, RF/connectivity, Power IC, and others."

SHANGHAI and SAN JOSE, Calif., March 15, 2017 /PRNewswire/ -- Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) ("SMIC"), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a technology transfer and license agreement for Invensas' Direct Bond Interconnect (DBI®) technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufacturing customers. Invensas is a wholly owned subsidiary of Xperi Corporation (XPER) ("Xperi").

"As one of the leading foundries, SMIC delivers advanced semiconductor manufacturing processes to device makers around the world, and we are pleased to integrate DBI technology into our capabilities," said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC. "This technology is a key enabler for the fabrication of 3D stacked image sensors, and by working closely with Invensas, we will accelerate the development and commercialization of a new generation of imaging products for our customers."

DBI technology is a low temperature hybrid wafer bonding solution that allows wafers to be bonded with exceptionally fine pitch 3D electrical interconnect without requiring bond pressure. DBI 3D interconnect can eliminate the need for thru silicon vias (TSVs) reducing die size and cost while providing a roadmap to pixel level interconnect for future generations of image sensors.

"We are thrilled to enter into this licensing agreement with SMIC, one of the largest and most respected semiconductor foundries in the world," said Craig Mitchell, president of Invensas. "SMIC recognizes the significant benefits of DBI technology for customers worldwide. We look forward to working closely with SMIC to integrate this enabling platform into their world-class design and manufacturing environment."

Fourth Quarter 2016 Financial Results

• Revenue was a record high of $814.8 million in 4Q16, an increase of 5.2% QoQ from $774.8 million in 3Q16 and an increase of 33.5% YoY from $610.1 million in 4Q15.
• Net profit for the period attributable to SMIC was $104.0 million in 4Q16, as compared to $113.6 million in 3Q16 and $38.6 million in 4Q15.

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director, commented, "We just finished another record year in 2016 with great performance and significant business accomplishments. We recorded historical high revenue of $2.9 billion and annual revenue growth of 30.3% in 2016, outpacing the foundry industry growth rate by almost 3 times. Operating profit reached an all-time high of $339.2 million, representing 12% operating margin. Net margin was a high of 11% and net profit attributable to SMIC reached a record high of $376.6 million. EBITDA surpassed $1 billion for the first time, and we achieved an improved annual ROE of 9.6% from 7.6% in the prior year. In 2016, we successfully acquired LFoundry S.r.l. ("LFoundry", the Company's majority-owned subsidiary in Avezzano, Italy), thus securing a significant foothold in the auto IC market. I am also proud of the team's quick ramp up of our Beijing JV fab and Shenzhen fab, while maintaining high overall utilization of 97.5% last year. In addition, SMIC exemplified productivity improvement with an 8.9% increase in revenue per headcount in 2016 compared to 2015.

We achieved our 8th consecutive quarter of record high revenue: $814.8 million, representing a growth of 33.5% year over year and 5.2% quarter over quarter. Our Q4 gross margin was 30.2% and annualized ROE maintained double digit at 10.1%.

We experienced great demand from 40nm in 2016, and in 2017 we begin to transition some of our 28/40nm flexible capacity towards 28nm. Other growth drivers in 2017 include a more diverse variety of mature technologies.

We reiterate our target of 20% compounded annual growth from 2016 to 2019, and for 2017, we target revenue growth of 20% year over year, gross margin of mid to high-20's% and EBITDA margin of high-30's%.

We have an advantageous position here in China, and we continue to work hard to seize opportunities for the benefit of our stakeholders."

First Quarter 2017 Guidance:

The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

Revenue to decline by 2% to 4% QoQ.
Gross margin to range from 25% to 28%.
Non-GAAP operating expenses, excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters, to range from $158 million to $164 million.
Non-controlling interests of our majority-owned subsidiaries to range from positive $6 million to positive $8 million (losses to be borne by non-controlling interests).

SHANGHAI, Jan. 19, 2017 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC" or the "Company") (NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world, announces today that it reaffirms its 2016 fourth quarter revenue and gross margin guidance for the three months ended December 31, 2016, which was originally released by the Company in its results for the three months ended September 30, 2016 on November 7, 2016. SMIC narrows its fourth quarter 2016 revenue growth from 5-7% quarter over quarter to 5-6% quarter over quarter, and gross margin range from 28-30% to 29-30%.

Dr. Tzu-Yin Chiu, Chief Executive Officer commented, "Since the release of our third quarter earnings, we have increased clarity on the near-term business environment. Based on current expectation, revenue for the first quarter of 2017 is expected to grow on a year over year basis and decline mildly quarter over quarter. We target an annual revenue growth of around 20% in 2017, outperforming the foundry industry average growth. Furthermore, we maintain our target to grow at 20% compounded annually from 2016 to 2019."

The Company is still in the process of finalizing its results for the three months ended December 31, 2016. The information contained in this press release is only a preliminary assessment by the management of the Company based on the latest unaudited consolidated management accounts of the Company for the three months ended December 31, 2016, which have not been confirmed nor audited by the Company's auditors and may be subject to adjustments.

SHANGHAI, Dec. 8, 2016 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China announces a 10 for 1 reverse split of all outstanding common stock has taken effect, after the approval by the Board of Directors and majority of shareholders. SMIC stockholders approved the share consolidation in an Extraordinary General Meeting held on December 6, 2016.

SMIC's ticker: 0981 is temporarily suspended until December 21, 2016, while SMIC's old share certificates can continue trading on the temporary trading counter under stock code: 02920 from December 7 to January 13, 2017. Only new consolidated share certificates may resume trading on December 21, 2016 under stock code: 0981. The reverse stock split has reduced the number of shares of SMIC's common stock issued and outstanding from 42,508,409,019 shares of common stock to 4,250,840,901 shares of common stock.

From December 7, 2016 to January 17, 2017, shareholders may exchange old share certificates for new consolidated certificates at SMIC's Share Registrar, Computershare Hong Kong Investor Services Limited, 1712–1716, 17th Floor, Hopewell Centre, 183 Queen's Road East, Wanchai, Hong Kong, at the expense of SMIC. After January 17, 2017 any exchange will require a processing fee. Computershare Hong Kong will also provide matching services for sale and purchase of odd lots of the consolidated shares.

Third Quarter 2016 Financial Results

• Revenue was a record high of $774.8 million in 3Q16, an increase of 12.3% QoQ from $690.2 million in 2Q16 and an increase of 36.0% YoY from $569.9 million in 3Q15.
• Earnings per ordinary share Diluted 0.12 vs. last years same quarter of 0.10

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director commented, "SMIC is seeing robust demand across the board and we reiterate our growth target of 20% compounded annual growth from 2016 to 2019. In 2016, SMIC is growing in excess of 28% YoY. We are forecasting growth for both 4Q16 and 1Q17 given current visibility. We are on track to achieve another record year of revenue and net profit attributable to SMIC.

We had a fantastic third quarter, achieving our 7th consecutive quarter of revenue growth and 18th consecutive quarter of profit. Our revenue was a record high of $774.8 million, representing a growth of 36.0% YoY and 12.3% QoQ. Our net profit attributable to SMIC was also a record high of 113.6 million, a growth of 37.4% YoY and 16.3% QoQ. This marks the first time our quarterly net profit exceeds $100 million, and the second consecutive quarter to exceed 10% ROE.

We are still experiencing robust demand from various regions, applications, and nodes, and we are addressing the demand opportunities by laying the foundation for continued growth with prudent expansion to meet customers' needs. In the last month, we announced several new fab construction projects to address our diverse demand. Actual production capacity will only be executed with careful planning to meet overlapping conditions of assured customer demand, technological readiness, and sustained profitability."

Fourth Quarter 2016 Guidance:

• The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:
• Revenue to increase by 5% to 7% QoQ.
• Gross margin to range from 28% to 30%.
• Non-GAAP operating expenses, excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters to range from $179 million to $184 million.
• Non-controlling interests of our majority-owned subsidiaries to range from positive $37 million to positive $39 million (losses to be borne by non-controlling interests).

SHENZHEN, China, Nov. 3, 2016 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world, and the largest and most advanced foundry in Mainland China, announces the official launch of a 12-inch integrated circuit (IC) production line at SMIC's Shenzhen facility. It will be the very first 12-inch fab in South China.

In order to meet the large demand for IC chips in the IoT era, SMIC Shenzhen is building the new 12-inch IC production line in an existing building. The new line will manufacture mainstream mature technology. Construction is planned to start by the end of 2016. Some second-hand equipment for the new line has already been secured. The early production is expected to begin by the end of 2017.The total designed capacity is 40,000 12-inch wafers per month; capacity ramp will be based on customer needs.

Located in Pingshan New District, Shenzhen, SMIC Shenzhen opened the first 8-inch IC production line in South China in December 2014. Its capacity is currently 30,000 wafers per month, and it will continue to expand based on market demand.

The Chairman of SMIC, Dr. Zixue Zhou, said, "Shenzhen has the largest electronic information industrial base in China, comprising hundreds of IC design, system and equipment companies. Thanks to the attention given to the IC industry from the Shenzhen Municipal Government, SMIC Shenzhen steadily operates an 8-inch production line. By launching the new 12-inch production line, SMIC will further improve our capacity, better serve our customers, and facilitate the development of Shenzhen's IC ecosystem."

MOUNTAIN VIEW, Calif., Oct. 26, 2016 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, and Synopsys, Inc. (SNPS) today jointly announced that SMIC has adopted Synopsys' StarRC™ product as the standard solution for signoff parasitic extraction for its 28-nanometer (nm) process technology. This standardization is a result of a growing collaboration between SMIC and Synopsys to provide best-in-class solutions to mutual customers to meet their increasing needs for accuracy, performance and efficiency at advanced nodes. The StarRC solution delivered silicon-accurate extraction and productivity validated by SMIC for its 28-nm process. The qualified StarRC technology files are available as the default in SMIC's 28-nm process design kits (PDKs) for both digital and custom designs.

The StarRC product, an integral part of the Synopsys Galaxy™ Design Platform signoff solution, is the market leader and industry gold standard for gate-level and transistor-level parasitic extraction. It achieves superior performance and efficiency with its ultra-scalable multi-core architecture, simultaneous multi-corner (SMC) extraction and fast ECO capabilities, while maintaining industry-standard golden accuracy. The StarRC product provides extraction capabilities across a wide range of applications, from 100+ million instance digital system-on-chip (SoC) designs to custom memory, IP, standard cell and analog designs. Integration with Synopsys IC Compiler™ II place and route and PrimeTime® static timing analysis allows designers to achieve even faster ECO design closure, while reducing disk space and processor core resources. In custom design environments, designers can cross-probe between parasitic and schematic views, annotate schematics with parasitics and perform visual debug. Significantly faster simulation runtimes and reduced disk space resources are realized through highly optimized extraction tuned for performance. The result of the collaboration between SMIC and Synopsys delivers qualified StarRC technology files in SMIC's 28-nm PDK that enable mutual customers to use a silicon-accurate and efficient extraction solution for their designs targeting SMIC's 28-nm node.

"Continuing to build on the momentum of our 28-nm process technology, a favorite node for semiconductor companies, is a priority for us, and the availability of qualified design tools is critical to support our expanding global customer base," said Anderson Huang, senior director of technology development at SMIC. "The partnership with Synopsys represents an enduring commitment to providing customers with the high-quality technologies and standards for use with our world-class manufacturing process. The deployment of StarRC in our 28-nm PDKs bolsters the resources available to our mutual customers through StarRC's proven silicon accuracy and comprehensive capabilities for both digital and custom designs, allowing them to develop advanced designs with increased confidence and productivity."

"Meeting customers' increasing needs to address complexity and accelerate design and analysis cycles are critical to propel them to silicon success at advanced process technologies," said Bijan Kiani, vice president of marketing for the Design Group at Synopsys. "SMIC's standardization on StarRC for parasitic extraction for its 28-nm process technology highlights the strong trust in our industry-leading technology to deliver on these important requirements and supports the innovations being driven by our mutual customers."

SHANGHAI, Oct. 13, 2016 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, today held the groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs.

China's Ministry of Industry and Information Technology (MIIT) and the Shanghai Government have placed a high value on and provided strong support for the new project. Guests and leaders from the IC industry and investment funds attended the ceremony. The Chairman of SMIC, Dr. Zixue Zhou, and the CEO and Executive Director of SMIC, Dr. Tzu-Yin Chiu, together laid the foundation stone for the new project.

SMIC has 8-inch and 12-inch wafer fabs in Beijing, Shanghai, Shenzhen, Tianjin and Italy, and the company's revenue has continued to hit record highs recently. SMIC booked record revenue of US $1.3245 billion in the first half of 2016 (a year-on-year increase of 25.4%). SMIC has achieved 17 consecutive quarters of profit and is close to full production capacity. Revenue is expected to maintain rapid growth of 20% annually over the next three to four years. SMIC will manage production capacity and arrange facility expansions based on customer and market demand.

The Chairman of SMIC, Dr. Zixue Zhou, said: "The start of our new 12-inch wafer fab in SMIC Shanghai will not only help to meet our growing customer demand for advanced production, but also further strengthen and expand SMIC itself."

Second Quarter 2016 Financial Results

Revenue was a record high of $690.2 million in 2Q16, an increase of 8.8% QoQ from $634.3 million in 1Q16 and an increase of 26.3% YoY from $546.6 million in 2Q15.

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director commented, "Q2 was another excellent quarter: with record-high revenue, gross profit, and operating profit, marking our 17th consecutive quarter of profitability. Revenue reached a historical high of $690.2 million, growing 26.3% YoY and 8.8% QoQ. Gross and operating profits hit all-time highs, growing 23.5% and 90.2% YoY and 41.7% and 74.5% QoQ, respectively. On a quarterly basis, our Q2 return on equity reached 10% and our utilization was 98%. In 2015, our EBITDA margin was around 35%; we now target EBITDA margin to increase for the full year of 2016 compared to 2015.

Wafer revenue from 40nm grew 92% YoY and 27% QoQ. Our revenue from China grew 28.7% YoY and 20.1% QoQ. There are 3 components to this large growth from China. 1) Chinese system houses are winning end-product market share, 2) Chinese fabless growth is robust, and 3) SMIC is increasing market share. With our technology readiness, being the preferred foundry partner in China, and strong China positioning, SMIC has effectively captured many opportunities.

We are guiding another strong quarter of growth in Q3. We target continued growth in Q4, contrary to seasonality, and another record year for 2016. Demand continues to be exceedingly strong. With this great demand and our recent acquisition of LFoundry, we now raise our annual revenue growth percentage target to mid-to-high 20's this year.

All-in-all, we are doing our best to expand shareholder value, through profitable growth, cash generation, and careful funding selection. We are witnessing strength across the board, with robust growth, strong cash position, advantageous market positioning, enormous demand, and great opportunities. We are working hard to balance our profitability, growth, building shareholder value, and serving our customers for the benefit of all stakeholders."

BEIJING, June 22, 2016 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, announces that the Snapdragon™ 425 processor and MDM9x07 has passed customer qualification and begun mass production in Beijing, after the successful technology transfer from SMIC's Shanghai 12-inch fab to SMIC's majority owned joint venture fab in Beijing. The successful production of 28nm Snapdragon™ products in Beijing represents an important step for SMIC's 28nm technology.

This achievement is a result of close collaboration between Qualcomm and SMIC's Beijing and Shanghai teams. SMIC's successful 28nm production demonstrates its continued leadership in Mainland China and enhanced global competitiveness in advanced node technology.

The Qualcomm Snapdragon™ 425 processor is redefining the entry-point of mid-tier processors. With 802.11ac Wi-Fi, a 64-bit CPU, and a 16 megapixel dual image sensor processor, the Snapdragon 425 is making cutting-edge experiences more accessible with advanced computing, smooth graphics and remarkable camera quality. SMIC's Beijing fab is located in the Beijing Economic Development Zone and is capable of manufacturing 28nm and above process technology nodes.

"The successful mass production of Snapdragon™ 28nm in the Beijing fab represents a major achievement for SMIC in expanding our production at 28nm," said Dr. Haijun Zhao, Chief Operating Officer and Executive Vice President of SMIC. "Through parallel production of 28nm at both Shanghai and Beijing fabs, SMIC is able to expand our 28nm services to Qualcomm and global customers and to continue our progress in advanced node technology production."

MOUNTAIN VIEW, Calif. and SHANGHAI, June 8, 2016 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry and one of the world's largest foundries, and Synopsys, Inc. (SNPS) today announced immediate availability of their joint 28-nanometer (nm) RTL-to-GDSII reference design flow. Developed through deep engineering collaboration between Synopsys and SMIC on the 28-nm High-K Metal Gate (HKMG) process technology, the flow is based on Synopsys' Galaxy™ Design Platform using key features from the IC Compiler™ II place and route solution, Design Compiler® Graphical synthesis, StarRC™ extraction solution, PrimeTime® signoff solution and IC Validator physical verification.

Already deployed on hundreds of designs, IC Compiler II addresses today's hypersensitive time-to-market needs by delivering superior quality of results and significant productivity gains with 10X faster design planning, 5X faster implementation and 2X more capacity. ''The reference flow features support for low-power techniques such as power-aware clock tree synthesis, power gating and physical optimization, enabled by industry standard IEEE-1801 UPF (Unified Power Format) power intent. Use of the reference flow allows designers to gain performance, power efficiency and chip density advantages while achieving predictable design closure.

The Lynx technology plug-in for the SMIC 28-nm HKMG process extends the reference flow to accelerate design setup and closure with Synopsys' Lynx Design System, a full-chip design environment providing innovative automation and visualization capabilities. This plug-in includes additional process technology information and representative flow and tool settings that help reduce the time it takes to get to optimized design results.

"Designers require a reference flow that addresses both high-performance and low-power requirements," said Tianshen Tang, senior vice president of Design Service at SMIC. "With the release of the SMIC-Synopsys 28-nanometer reference flow, we are enabling IC designers to accelerate release of their designs into manufacturing through the combination of SMIC's 28-nanometer High-K Metal Gate process technology and Synopsys' technology-leading design and IP solutions."

"Our mutual customers have always been at the forefront of innovation," said Bijan Kiani, vice president of marketing for the Design Group at Synopsys, Inc. "Through our collaboration with SMIC, we are delivering a proven high-performance, low-power reference flow and Lynx technology plug-in that utilize our industry-leading tools, including IC Complier II to accelerate design closure and tapeout readiness for SMIC's 28-nanometer manufacturing process."

SHANGHAI, June 8, 2016 /PRNewswire/ --Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981)

(1) PROPOSED ISSUE OF US$450 MILLION ZERO COUPON CONVERTIBLE BONDS DUE 2022

(2) PRE-EMPTIVE RIGHTS OF DATANG, COUNTRY HILL AND CHINA IC FUND

ISSUE OF THE PLACED BONDS

On 7 June 2016, the Company and the Manager entered into the Bond Subscription Agreement, pursuant to which the Manager has agreed to subscribe and pay for, or to procure subscribers to subscribe and pay for the Placed Bonds to be issued by the Company in an aggregate principal amount of US$450 million.

Based on the initial Conversion Price of HK$0.9250 and assuming full conversion of the Placed Bonds at the initial Conversion Price, the Placed Bonds will be convertible into approximately 3,778,881,081 Shares, representing (i) approximately 8.96% of the issued share capital of the Company on the Last Trading Day and (ii) approximately 8.22% of the issued share capital of the Company as enlarged by the issue of the Conversion Shares (assuming the full conversion of the Conversion Shares at the initial Conversion Price).

The Conversion Shares will be allotted and issued pursuant to the general mandate of the Company granted to the Directors at the annual general meeting held on 26 June 2015 and will rank pari passu in all respects with the Shares then in issue on the relevant conversion date. The issue of the Placed Bonds is not subject to the approval of the Shareholders.

An application will be made to the Hong Kong Stock Exchange for the listing of, and permission to deal in, the Conversion Shares. An application will be made to the Singapore Exchange for the listing of the Placed Bonds.

Completion of the Bond Subscription Agreement is subject to the satisfaction or waiver of the conditions precedent therein. In addition, the Bond Subscription Agreement may be terminated in certain circumstances. Please refer to the paragraph headed ''The Bond Subscription Agreement'' under the section ''Issue of the Placed Bonds'' below for further information.

POTENTIAL EXERCISE OF PRE-EMPTIVE RIGHTS OF DATANG

Reference is made to the Company's announcements dated 10 November 2008, 16 August 2010, 6 May 2011, 24 October 2013, 18 December 2013, 22 August 2014 and 12 June 2015 in relation to the Datang Subscription Agreement.

Pursuant to the Datang Subscription Agreement, in case of any issue of new Shares or securities convertible into Shares, subject to certain exceptions, Datang has a pre-emptive right to subscribe for a pro rata portion of such new securities being issued equivalent to the percentage of the issued share capital of the Company then owned by Datang immediately prior to the issue of such securities. Datang's pre-emptive right is applicable to the issue of the Placed Bonds, any China IC Fund Further Subscription and any Country Hill Further Subscription. Pursuant to the Datang Subscription Agreement, completion of any such issue of the Datang Pre-emptive Bonds to Datang upon exercise of its pre-emptive right will be further subject to the receipt of any required regulatory approvals.

The Company has notified Datang in accordance with the terms of the Datang Subscription Agreement in respect of the issue of the Placed Bonds and the possibility of the China IC Fund Further Subscription and the Country Hill Further Subscription. Pursuant to the Datang Subscription Agreement, Datang is deemed to have elected not to exercise the preemptive right with respect to the Datang Pre-emptive Bonds if it does not respond to the final notice within ten (10) business days following the date of the final notice. As at the date of this announcement, the Company has not been notified by Datang whether it intends to exercise its pre-emptive rights in relation to the proposed issue of the Placed Bonds.

PRE-EMPTIVE RIGHTS OF COUNTRY HILL

Reference is made to the Company's announcements dated 18 April 2011, 24 October 2013, 18 December 2013, 22 August 2014 and 12 June 2015 in relation to the Country Hill Subscription Agreement.

Pursuant to the Country Hill Subscription Agreement, in case of any issue of new Shares or securities convertible into Shares, subject to certain exceptions, Country Hill has a preemptive right to subscribe for a pro rata portion of such new securities being issued equivalent to the percentage of the issued share capital of the Company then owned by Country Hill immediately prior to the issue of such securities. Country Hill's pre-emptive right is applicable to the issue of the Placed Bonds, any Datang Further Subscription and any China IC Fund Further Subscription. Pursuant to the Country Hill Subscription Agreement, completion of any such issue of the Country Hill Pre-emptive Bonds to Country Hill upon exercise of its pre-emptive right will be further subject to the receipt of any required regulatory approvals.

The Company has notified Country Hill in accordance with the terms of the Country Hill Subscription Agreement in respect of the issue of the Placed Bonds and the possibility of the Datang Further Subscription and China IC Fund Subscription. Pursuant to the Country Hill Subscription Agreement, Country Hill is deemed to have elected not to exercise the preemptive right with respect to the Country Hill Pre-emptive Bonds if it does not respond to the final notice within ten (10) business days following the date of the final notice. As at the date of this announcement, the Company has not been notified by Country Hill whether it intends to exercise its pre-emptive rights in relation to the proposed issue of the Placed Bonds.

PRE-EMPTIVE RIGHTS OF CHINA IC FUND

Reference is made to the Company's announcements dated 12 February 2015 and 8 June 2015 in relation to the China IC Fund Subscription Agreement.

Pursuant to the China IC Fund Subscription Agreement, in case of any issue of new Shares or securities convertible into Shares, subject to certain exceptions, China IC Fund has a preemptive right to subscribe for a pro rata portion of such new securities being issued equivalent to the percentage of the issued share capital of the Company then owned by China IC Fund immediately prior to the issue of such securities. China IC Fund's preemptive right is applicable to the issue of the Placed Bonds, any Datang Further Subscription and any Country Hill Further Subscription. Pursuant to the China IC Fund Subscription Agreement, completion of any such issue of the China IC Fund Pre-emptive Bonds to China IC Fund upon exercise of its pre-emptive right will be further subject to the receipt of any required regulatory approvals.

The Company has notified China IC Fund in accordance with the terms of the China IC Fund Subscription Agreement in respect of the issue of the Placed Bonds and the possibility of the Datang Further Subscription and the Country Hill Further Subscription. Pursuant to the China IC Fund Subscription Agreement, China IC Fund is deemed to have elected not to exercise the pre-emptive right with respect to the China IC Fund Pre-emptive Bonds if it does not respond to the final notice within ten (10) business days following the date of the final notice. As at the date of this announcement, the Company has not been notified by China IC Fund whether it intends to exercise its pre-emptive rights in relation to the proposed issue of the Placed Bonds.

USE OF PROCEEDS

The gross proceeds from the Placed Bonds will be approximately US$450 million.

The net proceeds (net of fees, commissions and expenses) from the issue of the Placed Bonds will be approximately US$441 million.

The Company intends to use the net proceeds (net of fees, commissions and expenses) from the issue of the Placed Bonds for capital expenditure for capacity expansion and other general corporate purposes.

SHANGHAI, May 18, 2016 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry and one of the world's largest foundries, University of California, Riverside ("UCR"), and Shanghai Research Institute of Microelectronics, Peking University ("SHRIME/PKU"), jointly announced the opening of "the SMIC-UCR-SHRIME/PKU Joint Center For ESD Protection Design" ("ESD Center"). Prof. Yangyuan Wang, an Academician of the Chinese Academy of Sciences (CAS) and former Chairman of the Board of Directors of SMIC, and Dr. Tzu-Yin Chiu, the SMIC CEO, jointly inaugurated the ESD Center at its opening ceremony. Dr. Tianshen Tang, Senior VP of SMIC, Prof. Albert Wang, Director of the Integrated Circuit and System Laboratory at UCR, Prof. Yuhua Cheng, Dean of SHRIME/PKU and other guests from the industry participated in the opening ceremony.

Utilizing the complementary and collective strengths of SMIC, UCR and SHRIME/PKU, the ESD Center aims to develop advanced ESD protection design methodologies, and provide reliable and cost-effective ESD protection solutions for customers through industrial-academic and international collaboration. The ESD Center consists of three sites, located at SMIC, UCR and SHRIME/PKU, which will be jointly managed by three Co-Directors: Dr. Tianshen Tang, Prof. Albert Wang and Prof. Yuhua Cheng, respectively. The ESD Center has an Advisory Board formed by Dr. Tzu-Yin Chiu, Prof. Michael Pazzani (Vice Chancellor of Research and Economic Development of UCR) and Prof. Yangyuan Wang. In addition to the existing collaboration, SMIC will invest at least US$1.5M annually in the next three years including IC fabrication, equipment, engineering resource and funding to support the research activities at the ESD Center, particularly the R&D efforts for on-chip ESD protection for advanced FinFET technologies and RF ICs for wireless communications.

"The semiconductor industry is facing mounting technical challenges, which call for international collaboration to ensure technology advances. Such industrial-academic collaboration will serve to bridge the gap in R&D activities between the academia and the industry and speed-up technology transfers", stated Prof. Yangyuan Wang, who also noted that he highly values the model of international collaboration, and hopes to take advantage of complementary expertise to lead ESD protection R&D activities and accelerate commercialization of the research outcomes. Dr. Tzu-Yin Chiu also highly praised the collaboration efforts. Dr. Chiu said that "one of our missions is to drive technology advancement and provide excellent services to our customers. ESD protection has become so complicated that we must collaborate with the academia at international scale to address the technical challenges. Prof. Albert Wang and Prof. Yuhua Cheng are IEEE Fellows, and Dr. Tang is an industry veteran. I am confident that they will lead the Center to success."

Dr. Tianshen Tang, Prof. Albert Wang and Prof. Yuhua Cheng echoed on the urgent need for comprehensive collaboration in ESD protection designs. Dr. Tang said, "ESD is one of the key factors in the IC design ecosystem. We must continuously invest heavily to provide the better ESD solutions to our customers." With a brief review on global status of ESD protection research activities, Prof. Wang stated that "ESD protection design involves complex multiple coupling effects at process, device, circuit, layout and system levels, which requires comprehensive co-design efforts." Prof. Yuhua Cheng summarized the prior collaboration achievements and outlined the further plan for the ESD Center. He concluded that "Our previous joint work has resulted in encouraging outcomes in ESD protection designs at 28nm technology. We will continue to leverage complementary expertise to develop optimized solutions of ESD protections for future process technologies."

First Quarter 2016 Financial Results

• Revenue was a record high of $634.3 million in 1Q16, increased by 4.0% QoQ from $610.1 million in 4Q15 and increased by 24.4% YoY from $509.8 million in 1Q15.
• Net profit for the period attributable to SMIC was $61.4 million in 1Q16, as compared to $38.6 million in 4Q15 and $55.5 million in 1Q15.

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director commented, "We had another quarter with record-high revenue, continued demand strength and continued high utilizations. Purchase orders from our customers continue to be robust and are being driven by our diversified product and customer exposure, which continues to drive our utilizations high. Our customers are expanding their market share and we now target to grow revenue more than 20% this year given the great demand.

The first quarter of 2016 was another great quarter for SMIC; we surpassed the industry's revenue growth and grew more than 24% YoY. Overall utilization was 98.8% in the first quarter, in which even our newly ramping fabs experienced strong customer demand. Last quarter marks our 16th consecutive profitable quarter and we continue to target sustained profitability.

Overall, we believe SMIC is strategically building competitiveness globally and further optimizing our position as the preferred foundry provider in mainland China. We expect growth again in the second quarter, but remain constrained by the pace of our capacity growth. SMIC is optimistic in the long-term given our strategy, strong customer partnerships, and execution track record."

Fourth Quarter 2015 Financial Results

• Revenue was a record high of $610.1 million in 4Q15, increased by 7.1 % QoQ from $569.9 million in 3Q15 and increased by 25.6% YoY from $485.9 million in 4Q14.
• Net profit for the period attributable to SMIC was $38.6 million in 4Q15, as compared to $82.6 million in 3Q15 and $28.4 million in 4Q14.
  

First Quarter 2016 Guidance:

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

Revenue to increase by 1% to 3% quarter over quarter.
Gross margin to range from 22% to 25%.
Non-GAAP operating expenses excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters to range from $121 million to $126 million.
Non-controlling interests of our majority-owned subsidiaries to range from positive $16 million to positive $18 million (losses to be borne by non-controlling interests).
Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director commented, "In the fourth quarter of 2015 we achieved record-high revenue of $610.1 million, a growth of 25.6% year over year and 7.1% quarter over quarter, surpassing our original expectations and guidance. On an annual basis our revenue hit a record high of $2.24 billion, a growth of 13.5% compared to 2014. In 2015 we also achieved historical highs on all measures of profitability: gross margin, operating profit, and net profit. Despite the inventory correction in the industry during the year, we maintained full utilizations throughout 2015.

To address our 28nm status, we started to book minor 28nm revenue contribution in Q3 2015 and Q4 2015. We are pleased to have announced earlier this week that our high-k metal gate ("HKMG") technology is ready for commercialization with a purchase order from our customer, Leadcore. We target to reach double digit revenue contribution from 28nm in Q4 2016. We believe 28nm will be a long-lived node and is strategic for the long-term growth of SMIC. Our flexible 28nm and 40nm capacity has enabled us to best utilize our capacity and address our customers' needs.

To meet the strong customer demand and address the high utilization, we continue to improve operational efficiency and grow our capacity. By the end of this year we target to increase our Shenzhen fab capacity to approximately 30K 8" wafers per month, our Beijing joint-venture fab to 15K 12" wafers per month, and our Shanghai 12" fab to 20K 12" wafers per month.

Regionally, our China revenue contribution has grown more than 25% YoY in 2015 compared to 2014. Eurasia revenue contribution has grown more than 50% year over year. Meanwhile, North America has declined 9.3% year over year but has begun to recover in the second half of 2015.

With the large opportunities presented to us being in China, we strive to capture the attractive prospects with profitability as our underlying objective. In order to address many of the opportunities at hand, SMIC plans to grow through both organic and inorganic means.

We are optimistic about 2016 given our strategy and execution track record. So far the first half of 2016 looks strong and we stay committed to maintaining sustainable profitability and increasing value for all stakeholders."

SHANGHAI, Dec. 10, 2015 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981), the largest and most advanced pure-play foundry provider in China, and M31 Technology Corporation, a professional silicon intellectual property (IP) provider jointly announced today that SMIC will expand its IP portfolio with M31's differentiated high speed interface IP solutions. The technology will target solid-state drive (SSD), Universal Flash Storage (UFS), and USB applications markets, and roll out a variety of IP solutions for storage controller applications. Based on SMIC's logic processes from 110nm to 28nm, the storage controller application platform is capable of providing products with low power consumption, high performance, and compact die size to customers; while at the same time bring more differentiated applications to SMIC's technology platforms.

SMIC has used M31 Technology's new generation PCIe 3.0 physical layer silicon IP on its 40nm low leakage process to provide leading edge products for the SSD market, and it has been tested with various controllers to demonstrate compliance with PCI-SIG specifications. In order to cope with the demand of various bandwidths, this IP provides 1 lane, 2 lane, and 4 lane options so that customers can develop chips for supporting PCIe 3.0 SSD. Furthermore, SMIC has decided to implement M31's PCIe 3.0 physical layer silicon IP on its 28nm advanced process. This IP solution will provide customers with higher-speed and more power-saving options for their products.

Since Universal Flash Storage (UFS 2.0) will become the mainstream specification for embedded memory devices, SMIC is using M31's MIPI M-PHY physical layer IP on its 55LL process to fulfill the market needs. This IP is designed for high bandwidth and low power consumption, with silicon verified on controller blocks from various partners, in compliance with UFS 2.0 systems. In addition, M31 plans to develop MIPI M-PHY physical layer IP on 28nm HK and 40nm LL process technologies as a next step. This IP will not only support dual channel technology but also has an exceptional power-saving sleep mode, a feature suitable for the new generation of mobile devices.

As for USB applications, M31's BCK (Built-in-Clock) technology provides a crystal-less solution for mobile applications. This solution, developed on 55nm/110nm processes, can help customers shorten the time to mass production. The new generation of BCK technology not only supports the traditional USB 1.1 / 2.0 / 3.0 devices, but also supports the input frequency 32.768KHz. It expands BCK technology to USB host applications and also meets the needs of IoT applications with its low power consumption.

With the popularity of Type-C interface, M31 Technology has developed USB3.1 / USB3.0 PHY IP on SMIC's 28nm and 40nm process. This solution also builds the external high-speed switch into the PHY IP based on customers' needs. This built-in technology supports non-directional plug-and-play and the detection of different configurations of VBUS, and has been successfully implemented in customers' SoC design.

"By focusing on the development of advanced technologies, SMIC is also committed to developing specialty technologies and differentiated products," said Dr. Tianshen Tang, Senior Vice President of SMIC's Design Service Center: "In the field of storage controller products, SMIC's logic process technologies and years of accumulated IPs have matured and gone into mass production. We can provide customers with differentiated solutions to meet the needs of big data storage for controller products with high performance and low power consumption. M31 is one of SMIC's important IP suppliers with outstanding capabilities of providing diversified high speed interface IP solutions to customers. We are looking forward to working closely and having a win-win situation in the future".

SAN JOSE, CA--(Marketwired - Sep 13, 2015) - eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced that the GDSII Explorer tool now provides support for registered users specifying Semiconductor Manufacturing International Corporation ("SMIC") (NYSE: SMI) (SEHK: 981) as their foundry of choice.

GDSII Explorer, from eSilicon, is part of the eSilicon STAR (self-service, transparent, accurate,real-time) design virtualization platform. With easy-to-use online menus, registered users can specify manufacturing process information along with requirements for packaging, testing and delivery required for their completed GDSII design. An executable quotation from eSilicon is then provided online in seconds, which includes non-recurring engineering (NRE) pricing and volume production unit pricing for the user's device.

"GDSII Explorer from eSilicon allows customers to quickly and easily determine the best options from SMIC to tapeout their GDSII designs," said Sunny Hui, senior vice president of marketing, SMIC. "With GDSII Explorer, users can create a fully customizable quote online in minutes that is fully backed by eSilicon."

"eSilicon continues to see steady adoption of all the STAR platform tools, including GDSII Explorer," said Mike Gianfagna, eSilicon's vice president of marketing. "Expanding GDSII Explorer to include SMIC as a foundry option increases flexibility and choices for our STAR registered users."

Second Quarter 2015 Financial Results

• Revenue was a record high of $546.6 million in 2Q15, increased 7.2% QoQ from $509.8 million in 1Q15 and increased 6.9% YoY from $511.3 million in 2Q14.
• Earnings per ADS ^{Diluted was $0.10 vs. last years same quarter of $0.09.}

Third Quarter 2015 Guidance:

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

• Revenue to increase by 1% to 3% quarter over quarter.
• Gross margin to range from 28% to 30%.
• Non-GAAP operating expenses excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters to range from $134 million to $139 million.
• Non-controlling interests of our majority-owned subsidiaries to range from positive $11 million to positive $13 million (losses to be borne by non-controlling interests).

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director, commented, "SMIC has achieved two quarters of consecutive growth in 2015 and we are guiding an additional quarter of growth for the third quarter. With some customers undergoing inventory adjustments, SMIC has successfully ramped up new products keeping our fabs well utilized.

The second quarter of 2015 was our best quarter to date with record-high revenue of $546.6 million and gross margin of 32.3%. In the second quarter shipments and utilization exceeded our expectations, resulting in 7.2% quarter over quarter revenue growth. We achieved a profit attributable to SMIC of $76.7 million, an increase of 38.3% quarter over quarter and 35.0% year over year.

Our China revenue share has continued to increase in the past quarters and in Q2 China-region revenue contributed more than half our revenue for the first time. SMIC is in a key position as the largest and most advanced foundry in China to capture the many opportunities stemming from China."

SHANGHAI, Aug. 10, 2015 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry and one of the world's largest foundries, today announced its 28nm process technology that is used for manufacturing Qualcomm� Snapdragon� 410 processors, has been successfully adopted into mainstream smartphones. This marks a significant step in the commercial usage of 28nm core chips, and a new era of advanced mobile phone chip manufacturing in China. This is another major breakthrough in the company's collaboration on 28nm, following SMIC's announcement of successfully fabricating Qualcomm Technologies' processors at the end of last year.

Qualcomm Snapdragon 410 processors, with integrated 4G LTE, offer an abundant feature set for high-volume smartphones. Compared with 40nm technologies, processors manufactured on 28nm process technology have twice the logic density, are 20 to 30 percent faster, and consume 30 to 50 percent less power.

Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC said: "The first batch that used SMIC's 28nm node performed well, achieving recognition from Qualcomm Technologies and mobile phone manufacturers. This is an important moment for the industry's entire ecosystem, because for the first time, China's mainland manufacturers can now introduce mainstream smartphones which is a result of the close collaboration between SMIC and Qualcomm Technologies. This marks the start of a new era of 28nm advanced mobile phone chip manufacturing in China. In the future, with the development of 28nm technologies, we are looking forward to providing more advanced processing and extensive technical support to Qualcomm Technologies and other global customers."

Derek Aberle, president of Qualcomm Incorporated said: "The Snapdragon 410 processor, manufactured using SMIC 28nm process technology, is a leading chipset designed for the latest generation of high-volume smartphones and tablets. Achieving commercial usage in mainstream smartphones with these chipsets demonstrates the significant progress made by Qualcomm Technologies and SMIC in our advanced process node and wafer fabrication cooperation."

SHANGHAI, June 2, 2015 /PRNewswire/ -- Brite Semiconductor, an emerging ASIC design services firm headquartered in Shanghai, China, announced today the collaborative development of a design platform roadmap with key industry partners, including Semiconductor Manufacturing International Corporation ("SMIC"). The platform is designed to support Internet-of-Things ("IoT") IC's addressing the China market's emerging needs for smart devices, wirelessly-connected to Cloud infrastructure.

Brite is developing its China IoT ASIC Platform based on SMIC's 55nm low-leakage (LL) and ultra-low-power (ULP) process roadmap, which includes embedded flash (eFlash) memory. Over the design platform's lifetime, these processes can significantly reduce operating voltages to lower both active power and standby power consumption, which will be the best choice for IoT devices including smart home and wearable products.

"An early leader in custom design services in China, Brite is uniquely positioned to work with SMIC foundry services in providing rapid and optimized IoT device realization for China's emerging market opportunities," stated Dr. Charles Zhi, President and CEO of Brite Semiconductor, "Key to IoT applications is wireless connectivity and our CEVA platform cooperation assures seamless connectivity at the periphery of the Cloud."

"SMIC is constantly developing advanced technologies. Based on ULP technology platform, we have taken the lead in offering ULP foundation IP library, commercial Bluetooth and BLE IPs, and modularized embedded non-volatile memory (eNVM) to form a comprehensive IoT based technology platform," stated Dr. TianShen Tang, Senior VP of SMIC Design Service. "We're glad to see Brite has collaborated with other strategic partners to develop the IoT ASIC platform together. We believe that the cooperation between SMIC and Brite in IoT can help make China's rapidly developing infrastructure the smartest in the world."

CEVA, already a Brite and SMIC IP partner, is collaborating with Brite on Bluetooth baseband and DSP platform integration into the China IoT ASIC platform. CEVA's Bluetooth IP consists of a hardware baseband coupled with a controller software stack up to HCI. Compliant with all versions up to Bluetooth Smart Ready 4.2 (dual mode), its innovative low power architecture makes it an ideal fit for wireless combo, microcontroller and application processors to address a wide range of embedded applications. For IoT applications requiring local intelligent processing, the CEVA DSPs can be integrated into the platform to enable applications such as voice activation, speech recognition, sensor fusion, face detection and fingerprint recognition. Benefits include reduced latency for time-critical applications, increased privacy, lower data transfer overhead and lower overall power consumption.

"We are pleased to partner with Brite Semi in offering their ASIC platform customers world-class connectivity and processing capabilities for their customized wireless IoT devices," said Eran Briman, Vice President, Marketing at CEVA. "Our Bluetooth IP delivers the lowest power consumption for both Bluetooth Smart and Smart Ready devices, while our DSP platforms bring the capability to handle the intelligence processing directly on the device, where required."

In April of this year, The National Center for Advanced Packaging Co., Ltd., a company dedicated to developing and commercializing advanced packaging and system integration technologies, joined with Brite to announce a research and development (R&D) collaboration targeting single and multi-die Systems-on-Chip (SoCs ) and System-in-Package (SiPs ). This collaboration will include support for the China IoT ASIC Platform roadmap and SoC integration into multi-die packaging which will be a key to successful IoT solutions that integrate sensors, MCUs, and radios into a single package. 

Come see Brite Semiconductor at our joint booth with SMIC at the annual Design Automation Conference (DAC), Booth 2803, Moscone Center, San Francisco, California, USA the week of June 8th and learn more about this exciting new development and our collaborative partnerships.

First Quarter 2015 Financial Results

• Revenue was $509.8 million in 1Q15, increased 4.9% QoQ from $485.9 million in 4Q14 and increased 13.0% YoY from $451.1 million in 1Q14.
• Profit for the period attributable to SMIC was $55.5 million in 1Q15, compared to $28.4 million in 4Q14 and $20.3 million in 1Q14.

Second Quarter 2015 Guidance: 

The following statements are forward looking statements which are basedon current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects:

• Revenue to increase by 2% to 5% quarter over quarter.
• Gross margin to range from 27% to 29%.
• Non-GAAP operating expenses excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters to range from $120 million to $125 million.
• Non-controlling interests of our majority-owned subsidiaries to range from positive $5 million to positive $7 million (losses to be borne by non-controlling interests).

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director, commented, "Last year we successfully taped out new products for a broad range of applications for 65nm and 40nm, and as a result, in Q1 we had growth and in Q2 we are guiding additional growth.

In the first quarter, our revenue grew to $509.8 million, historically our highest Q1. Gross margin was a ten-year high of 29.4% and we achieved our twelfth consecutive profitable quarter. Revenue from 40nm and 65nm grew more than 25% quarter-over-quarter and more than 58% year-over-year.

To address our technology progress, we continue to work on 28nm product qualification. We are pleased to report that we have already received a purchase order and will begin risk production in Q2.

Revenue from China has continued to be over 40% of our total revenue in the past 8 quarters and accounted for 47% of our total revenue in Q1 2015. As the largest and most advanced foundry in China, we believe we are well-positioned to benefit from an overall growing IC ecosystem in China."

SHANGHAI, March 9, 2015 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry, has been selected as a constituent of the Hang Seng Mainland 100 (HSML 100) Index.  SMIC's inclusion in the index will be effective as of today.

Established in 2000, the HSML 100 Index comprises one hundred of the largest companies (by revenue) for which more than 50% of sales revenue derives from mainland China.  The index offers a comprehensive benchmark to gauge the mainland China sector of the Hong Kong stock market and is reviewed on a quarterly basis.

"HSML 100 Index is one of the important indices in the international capital market. We are honored to be included in the HSML 100 composite and would like to thank our investors, stakeholders and others for their long-term support," said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC. "Being selected as a constituent demonstrates the capital market's confidence in SMIC's operational performance and capability to maintain sustainable profitability. We will continue to work hard to continue improving our business performance and work to repay our investors trust and support."

SHANGHAI, Feb. 27, 2015 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC") (NYSE: SMI; SEHK: 981) the largest and most advanced pure-play foundry provider in China, and Cista System Corp. a fabless semiconductor company that specializes in CMOS Image Sensors (CIS) and System on Chip (SoC) designs, have jointly announced the achievement of mass production for two CIS-BSI products, of 1.3MP resolution with 1.75-micron pixel and 8MP resolution with 1.4-micron pixel, respectively. Both sensors are based on SMIC's independently developed 0.13-micron BSI technology platform.

Back-Side Illumination (BSI) CMOS Image Sensor technology increases the amount of light captured by the sensor, and thus enables image sensors with improved low-light performance. SMIC's 0.13-micron CIS-BSI technology is independently developed and offers competitive performance. Based on a low leakage process, it only uses three aluminum metal layers for reduced cost and supports pixel sizes down to 1.4-micron for 8MP resolution CIS. SMIC also provides full in-house turn-key service which includes CIS wafer fabrication, color filter & micro-lens processing, TSV-CSP and testing to help customers shorten the supply chain with fast cycle time and low cost.

"Through working with our partner, Cista System Corp., we are very pleased with the achievement of the production phase for BSI technology," said Dr. Shiuh-Wuu Lee, Executive Vice President of Technology Development of SMIC. "Tests on the two sensors have shown great performance which demonstrates our readiness in 0.13-micron BSI technology platform. SMIC is also developing 1.1-micron pixel BSI for 13MP resolution and above, and 3D stacked BSI for high-end applications. With these new sets of products, we hope to provide high-quality CMOS Image Sensors to our customers at a competitive price."

"We are excited to partner with SMIC on launching the CIS-BSI sensors," said Wilson Du, CEO and President of Cista System Corp. "This partnership draws us one step closer to our goal of becoming more integrated with domestic industry resources in developing the image sensor sector. As we move forward, we hope to see more of our designs used in wider applications such as consumer electronics, telecommunications, medical equipment, automotive industry, automation and other applications."

SHANGHAI, Feb. 12, 2015 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981) China's largest and most advanced semiconductor foundry today announced an investment agreement from China Integrated Circuit Industry Investment Fund Co., Ltd., (CICIIF), the national fund established to promote the IC industry in China. Under the agreement, CICIIF will acquire 4.7 billion new shares at a subscription price of 0.6593 HKD per share.

The gross proceeds will be used for SMIC's capital expenditure, debt repayment and general corporate purposes. Under the agreement CICIIF is entitled to nominate one member to SMIC's board of directors.

CICIIF was established in September 2014 to support the growth of the IC industry and enable the integration of the IC supply chain's ecosystem in China.

"We are happy to receive CICIIF's recognition and investment. This shows SMIC's important role in the China semiconductor ecosystem," said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC. "Partnering with CICIIF further supports  SMIC's long term goals of gaining a stronger foothold in China and playing a more important role in the global IC market."

The agreement between SMIC and CICIIF is subject to customary conditions and regulatory approvals.

Fourth Quarter 2014 Financial Results

• Revenue was $485.9 million in 4Q14, compared to $521.6 million in 3Q14 and $491.8 million in 4Q13.
• Profit for the period attributable to SMIC was $28.4 million in 4Q14, compared to $47.5 million in 3Q14 and $14.7 million in 4Q13. China-region revenue grew to 45.6% of overall revenue as the largest contributor by region to revenue in 4Q14.

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director, commented, "As a management team, our first target had been to bring SMIC into sustainable profitability, and we have accomplished that. In Q4 2014, we achieved our eleventh consecutive profitable quarter and maintained a healthy utilization of 93%. We continue to aim for sustained profit as we enter our next stage of growth. 2014 was marked with achievements in development of technology and operations in preparation for growth in 2015 and beyond. We made progress in 28nm development, differentiated technology development, the development of new fab operations, and various new partnerships to expand business and opportunities in China and internationally.

2014 was also marked by the formation of several new partnerships, which display SMIC's leading role in the strengthening China semiconductor ecosystem.

Revenue from China has continued to be over 40% of our total revenue in the past 6 quarters and accounts for more than 45% of our total revenue in Q4 2014. As the largest and most advanced foundry in China, we are looking forward to benefiting from an overall growing IC ecosystem in China.

With a better than expected guidance for Q1 and encouraging feedback on 28nm, we continue to be optimistic about the future as we ramp up new 8-inch capacity in Shenzhen and 28nm capacity in both Shanghai and Beijing. We continue to have confidence in the China market, mobile products, smart consumer products, coming IoT("Internet of Things"), and our strategy to capture growth opportunities in China. We stay committed to sustainable profitability and building value for all stakeholders."

First Quarter 2015 Guidance: 

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below.

• Revenue is expected to increase by 2% to 5% quarter over quarter.
• Gross margin is expected to range from 27% to 29%.
• Non-GAAP operating expenses excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters are expected to range from $123 million to $128 million.

SHANGHAI, Jan. 5, 2015 /PRNewswire/ -- MEMSensing Microsystems Co., Ltd. ("MEMSensing"), a pioneer in MEMS sensor design and products development in China, and Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981) jointly announced the launch of the world's smallest 3-axis accelerometer MSA330, which utilizes SMIC's CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies.

By vertically integrating the 3-axis accelerometer device with CMOS ASIC into a single package of 1.075x1.075x0.60mm3(LxWxH), MSA330 achieves about 30% shrink in footprint and 70% reduction in the total size compared to the latest commercial products. It is also the thinnest of its kind, only 0.5mm after SMT and 0.6mm in total height including 0.2mm solder balls. MSA330 would be competitive not only in overall fabrication costs through all wafer level fabrication and packaging but also in miniaturization particularly for mobile and wearable applications.

"The success in MSA330 signifies SMIC the major breakthrough achieved in its fabrication of CMOS integrated MEMS devices and TSV-based wafer level packaging technologies, which is expected to enter commercial production within 2015. Such accomplishment would further benefit SMIC in broadening its manufacturing capabilities and foundry services into fabricating MEMS devices and wafer level packaging open to global MEMS customers," said Dr. Shiuh-Wuu Lee, Executive Vice President of Technology Development of SMIC.

"MEMSensing is SMIC's 1st domestic MEMS customer, and also one of its earliest customers worldwide which can be dated back to as early as 2009. MSA330 is the world's 1st MEMS accelerometer enabled by WLCSP (Wafer Level Chip Scale Packaging), which is based on WLP and TSV technology. This approach belongs to the latest generation for MEMS accelerometer fabrication while other competitors are still lagging one step behind. The success for MSA330 product development proves that MEMSensing has now broadened its MEMS sensor product portfolio beyond the existing MEMS microphone and pressure sensors. We plan to allocate more resources to cooperate with SMIC to develop other advanced products and make an effort to further enrich China's domestic MEMS industry chain," said Dr. Li Gang, CEO of MEMSensing.

SHANGHAI, Dec. 18, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation (SMIC; NYSE: SMI; SEHK: 981) and Qualcomm Incorporated (QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., and SMIC have achieved a major milestone in fabrication of 28nm Qualcomm® Snapdragon™ 410 processors. This milestone comes six months after SMIC and Qualcomm Technologies announced their initial plans to collaborate on 28nm wafer production. Snapdragon 410 is a leading-edge processor designed to enable a new class of smartphones and tablets at the high-volume tier through offering integrated LTE, high-performance graphics and imaging, 1080P HD display, 64-bit capable processing and a range of advanced modem features. This milestone represents an important step for SMIC in their 28nm process maturity as they become one of the first Chinese foundries to produce high-performance, low-power mobile processors at one of the industry's most advanced process nodes. This achievement builds on a longstanding wafer supply relationship between SMIC and Qualcomm Technologies that was recently extended in July to collaborate at the 28nm process node.

"The successful yield of 28nm process technology on high-performance, low-power Snapdragon mobile processors represents a major milestone for SMIC in increasing our competitiveness in the global foundry landscape," said Dr. Tzu-Yin Chiu, chief executive officer and executive director, SMIC. "Our collaboration with Qualcomm Technologies has been key in helping us to accelerate our 28nm technology development and achieve this key milestone within six months from the commencement of the collaboration. The maturity of our 28nm process represents a significant long-term growth driver for SMIC in support of Qualcomm Technologies and our customers globally."

"We're extremely pleased with the tremendous progress made by SMIC in achieving a critical milestone in 28nm process technology with the successful yield of Snapdragon 410 processors," said Murthy Renduchintala, executive vice president, Qualcomm Technologies, Inc., and co-president, QCT. "SMIC plays an important role in Qualcomm Technologies' supply chain in allowing us to expand our manufacturing footprint in China to better address the growing need for high- performance and low-power mobile devices with customers in the region and around the world".

SHANGHAI, Oct. 27, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) the largest and most advanced pure-play foundry provider in China,  and ASML Holding N.V. ("ASML"), the world's leading provider of lithography systems, announce the signing of a volume purchase agreement (VPA) that will provide SMIC with lithography systems from ASML. The VPA which is worth approximately 450 million Euros and is part of a strategic partnership between the companies that will help facilitate the timely expansion of SMIC's advanced technology capacities.

Lithography is a critical step in the manufacturing of semiconductors and helps to create complex structures that make up the transistors on a wafer. Under the agreement ASML will provide lithography tools such as the TWINSCAN NXT system designed for volume production of 300mm wafers at the 32nm node and beyond. Some of the specific benefits include increased productivity, unprecedented overlay performance and maximum image performance for each wafer.

"SMIC is the most advanced wafer foundry in China and ASML is the leading provider for lithography systems, and we believe that this partnership will complement both sides" said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC. "We chose ASML as our provider due to their world-class products and services, and this cooperation will facilitate and strengthen the development of our advanced technologies."

"ASML is always committed to provide services that match the needs of our customers," said Peter Wennink, President and Chief Executive Officer of ASML. "We are pleased to have SMIC as one of our customers, and the purchase of our lithography systems shows SMIC's recognition and trust in our technology. China is an important market for us and through this agreement, we hope to increase our presence and gain a stronger foothold with the Chinese customers. We believe this is a win-win solution where both parties can benefit from the deal." 

Lilianne Ploumen, the Dutch Minister for Foreign Trade and Development Cooperation, accompanied by members of the Dutch Consulate, attended the signing ceremony as part of an economic mission to strengthen economic ties between the Netherlands and China.

At the ceremony, Minister Ploumen said, "China is an important market that continues to grow. The signing ceremony between SMIC and ASML marks the increasing high-tech cooperation between China and the Netherlands, and I sincerely hope that this continues to develop further."

SHANGHAI, Oct. 23, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI, SEHK: 981) and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm Low Leakage (LL) logic process. This IP has now been integrated into one of SMIC customers' product tape-out.

The silicon proven Bluetooth RF IP is the result of a collaborative effort between SMIC and Maxscend and marks a significant milestone in SMIC RF IP platform setup. It has achieved a leading edge position in the industry and will provide mutual customers an excellent IP solution for the booming IoT market, as well as the prosperous mobile and tablet markets.

Dr. Tianshen Tang, Senior Vice President of SMIC Design Service Center commented, "We are pleased to be working with Maxscend. This important breakthrough will enable SMIC to offer leading 55nm RF IP solutions and secure SMIC's leading position in China's semiconductor foundry industry. We are confident that we can provide top quality solutions and design services for the customer."

"It is really exciting to see that our Bluetooth and BLE RF IP has been silicon proven on SMIC 55nm platform," said Zhihan Xu, Chief Executive Officer of Maxscend. "Besides the current huge demand of smart-phones, tablets, Bluetooth Audio and other areas of traditional Bluetooth technologies, there is tremendous interest coming from low-power Bluetooth in the IoT field. With the wide adoption of Bluetooth low energy technology, smart devices will become ubiquitous in everyday life: wearables, smart-home, smart-medical, smart-sports and many more. By partnering with SMIC, we are confident we have the capabilities to support global customers with superior Bluetooth technology and professional technical services."

SHANGHAI, Sept. 26, 2014 /PRNewswire/ --  Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) ("SMIC" or "the Company") one of the leading semiconductor foundries in the world, announces that on 25 September 2014, SMIC and the Joint Lead Managers (Deutsche Bank and J.P. Morgan) entered into the Bond Subscription Agreement, pursuant to which each of the Joint Lead Managers has agreed to subscribe and pay for, or to procure subscribers to subscribe and pay for the Bonds to be issued by the Company in an aggregate principal amount of US$500 million.

Approval in-principle has been received for the listing and quotation of the Bonds on the SGX-ST. The SGX-ST assumes no responsibility for the correctness of any statements made or opinions expressed in this announcement. The approval in-principle granted for the listing and quotation of the Bonds on the SGX-ST is not to be taken as an indication of the merits of the Company or the Bonds.

Completion of the Bond Subscription Agreement is subject to the satisfaction or waiver of the conditions precedent therein and is expected to take place on 7 October 2014.  In addition, the Bond Subscription Agreement may be terminated in certain circumstances. Please refer to the paragraph headed ''The Bond Subscription Agreement'' under the section ''Issue of the Bonds'' below for further information.

USE OF PROCEEDS

The gross proceeds from the issue of the Bonds will be approximately US$494.82 million. The net proceeds (net of fees, commissions and expenses) from the issue of the Bonds will be approximately US$491 million.

The Company intends to use the net proceeds (net of fees, commissions and expenses) from the issue of the Bonds for (i) the Company's debt repayment and (ii) capital expenditure in relation to capacity expansion associated with 8-inch and 12-inch manufacturing facilities and general corporate purposes.

Shareholders and potential investors should note that completion of the issue of the Bonds is subject to the fulfilment of the conditions under the Bond Subscription Agreement. As the issue of the Bonds may or may not proceed, Shareholders and potential investors are reminded to exercise caution when dealing in the securities of the Company.

SHANGHAI, Sept. 10, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) announced the readiness of 38nm NAND Flash process technology, making it the only foundry to manufacture NAND products for its customers. This process platform has been independently developed in its entirety by SMIC. With this offering, SMIC leads the way in serving the growing demand in specialty memory fabless customers with high-quality low-density NAND Flash products.

NAND Flash is the fastest growing non-volatile memory (NVM) product in recent years. The 38nm NAND Flash technology targets diversified high volume specialty applications, such as embedded products, mobile computing, TV and STB (Set-top Box). Customers are also leveraging this technology to address SPI (Serial Peripheral Interface) NAND market as well as the increasing usage of IoT related products. SMIC's successful launch of 38nm NAND Flash technology helps customers to meet the growing demands of this market both in China and globally.

"SMIC has developed a series of specialty NOR flash platform from 130nm down to 65nm in the past. Through the dedicated and methodical effort of SMIC's R&D team, we have achieved an important diversification in offering 38nm NAND. This will serve as a solid foundation for us to move forward on the development of more advanced nodes such as 2x/1xnm and 3D NAND Flash process technology. SMIC is committed to drive advanced NAND Flash for fabless customers that meet high quality standards," said Dr. Shiuh-Wuu Lee, Executive Vice President of Technology Development of SMIC.

"This important milestone has great strategic significance not only to SMIC, but also to our specialty memory customers and partners. For our customers, SMIC solidifies the commitment and capabilities on advanced non-volatile memory technology development. In addition, it demonstrates SMIC's capability to establish a leading position in selective market segments," said Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC.

SHANGHAI, Aug. 28, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) one of the leading semiconductor foundries in the world, announces the unaudited interim results of operations of the Company and its subsidiaries for the six months ended June 30, 2014.

FINANCIAL HIGHLIGHTS

• Sales was US$962.4 million for the six months ended June 30, 2014, compared to US$1,042.9 million for the six months ended June 30, 2013. The decrease was primarily because there had been no wafer shipments from Wuhan Xinxin Semiconductor Manufacturing Corporation ("Wuhan Xinxin") since the first quarter of 2014.
• Gross profit was a record high of US$239.2 million for the six months ended June 30, 2014 representing an increase of 2.4% compared to US$233.5 million for the six months ended June 30, 2013.
• Gross margin improved to 24.9% for the six months ended June 30, 2014 from 22.4% for the six months ended June 30, 2013.
• Profit from operations was US$87.8 million for the six months ended June 30, 2014 (of which US$7.6 million came from the gain on disposal of property, plant and equipment and assets classified as held-for-sale), compared to US$130.5 million for the six months ended June 30, 2013 (of which US$53.3 million came from the gain on disposal of property, plant and equipment and assets classified as held-for-sale and gain on disposal of subsidiaries).

SHANGHAI, Aug. 8, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) the largest and most advanced pure foundry provider in China; and Jiangsu Changjiang Electronics Technology Co., Ltd. ("JCET", SSE: 600584), the largest packaging service provider inChina, jointly announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China.

By setting up in Jiangyin National High-Tech Industrial Development Zone, the joint venture can benefit from Jiangyin's unique location and mature industrial environment to quickly set up the 12-inch wafer bumping and CP testing production line (Middle-End-Of-Line). Meanwhile, the joint venture can also utilize JCET's nearby advanced back-end packaging production line, which includes Flip-Chip to support advanced Back-End-Of-Line production for 40/45nm, 28nm and below. Together with SMIC's 12-inch front-end advanced chip production line in development, this will be China's first-ever domestic 12-inch advanced IC manufacturing supply chain. This supply chain will shorten the overall manufacturing cycle time. More importantly, its close proximity to China'sconsumer electronic industry and the world's largest end-market, will allow our customers to respond with a shorter time-to-market window, and therefore better serve the fast changing consumer electronic market.

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director commented, "The Yangtze River Delta is regionally the strongest, largest, and most developed ecosystem in China's IC industry. Jiangyin is located in the center of Yangtze River Delta's 'Golden Triangle' comprised of Suzhou, Wuxi and Changzhou, and is only 180km from Shanghai. Furthermore, Jiangyin has good transportation infrastructure and is a hub of human talents. With our strategic partner JCET located in Jiangyin, our joint venture will rely on JCET's existing manufacturing base and established facilities, thus, the mid and back-end lines will be constructed nearby to increase its dominance in the area, shorten its lead-time, and provide a one-stop service for customers. The initiation and implementation of the project will benefit SMIC's ramp up of 28nm mass production and will help increase the capability of China's semiconductor industry."

Mr. Xinchao Wang, Chairman of JCET stated, "SMIC and JCET's joint venture in Jiangyin will combine our companies' strengths and enhance our long-term relationship; furthermore, the joint venture will focus on upgrading the domestic 3D IC industry chain to world-class standards."

Jian Shen, Mayor of Jiangyin and Director of Jiangyin High-Tech Zone said, "SMIC and JCET are the most prominent companies in China's semiconductor industry. The joint venture will help Jiangyin to become an important component of China's most advanced semiconductor ecosystem. The Jiangyin municipal government gives its full support to this project in order to establish Jiangyin as one of the leading integrated circuit manufacturing bases, and to accelerate the growth and development of China's semiconductor industry."

Second Quarter 2014 Financial Results

• Revenue was $511.3 million in 2Q14, an increase of 13.4% quarter over quarter.
• Profit for the period attributable to SMIC was $56.8 million in 2Q14

Third Quarter 2014 Guidance: 

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below.

• Revenue is expected to increase 1% to 5% quarter over quarter.
• Gross margin is expected to range from 24% to 26%.

Non-GAAP operating expenses excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters are expected to range from $96 million to $101 million.

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director, commented, "Excluding Wuhan's contribution, SMIC achieved record high revenue in the second quarter, which is our ninth consecutive profitable quarter. We reached a gross margin of 28%--our highest since 2005.

Compared to Q1 2014, utilization was up more than 10 percentage points; while revenue increased 13.4% sequentially. When comparing Q2 2014 to Q1 2014, gross margin increased 6.7 percentage points, profit from operations nearly doubled, and net profit tripled. We continue to emphasize the priority of sustained profitability and carefully planned growth. Overall, we are optimistic about 2015 as we prepare our capacity and technology for many new and exciting opportunities.

One of our growth drivers for 2015 will be 28nm. We are happy to work with our long-time customer as we ramp up this new technology. We are on track to have production ramp up in 2015. We are also working with other customers who are targeting to capture the LTE handset IC market in China, AP for tablets, and RF applications on 28nm.

Our other growth driver for this year and more so in 2015 is our differentiated product offering. SMIC continues to experience high demand for 8-inch production capacity for PMIC, CIS, e-NVM, and sensors. Our effort in 12-inch specialty process development has recently yielded the industry's leading 55nm embedded NVM solution. Our customer has entered into high volume production based on this technology.

The strong IC demand in China is continuing to drive our growth. For the first time in SMIC's history, our China revenue has exceeded all other regions in the second quarter. Revenue from China now accounts for more than 44% of our total revenue.

The second quarter recovery ended with strong financials and profitability for SMIC. We are optimistic about 2015 as we prepare for growth on 8-inch and 28nm. We continue to have confidence in our strategy to capture growth opportunities in China."

SHANGHAI, Aug. 4, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) and CEC Huada Electronic Design Co., Ltd. ("HED") jointly announced today that HED has launched China's first 55nm smart card chip based on SMIC's 55nm LL (low leakage) eFlash (embedded flash) platform. With the benefits of being smaller in size, lower power consumption and faster performance, it has been put into mass production and is being widely recognized by customers.

SMIC's 55nm LL eFlash platform offers high-performance and low-cost solutions to customers. The platform has complete logic compatibility and all of our extensive 1.2V logic library IPs can be applied to this embedded platform. The lower logic voltage of the 1.2V core device reduces the chips' power consumption and maximizes their performance. In addition, the performance and reliability has been made more efficient with the use of Cu-BEoL (Back-end of Line). This allows a higher electric current density in the existing design by having a lower electrical resistance caused by Copper's electro-migration. The surface area of the chips has shrunk significantly and the smaller cell size allows the application of large flash memory possible. As the flash cell continues to shrink, the chip area will be further optimized to make it more economical. At present, the technology platform has passed the product reliability test and can meet the application requirements of standard smart cards. Based on this platform, HED has successfully launched China's first advanced 55nm smart card chip to market.

"HED is committed to exploring new technologies and applications, such as 55nm analog circuit design and system design technologies, and 12" wafer testing and dicing technologies. The research results have been applied to product development and allow new products to be launched into market more quickly. " said Mr. Dong Haoran, General Manager of HED, "the successful cooperation with SMIC on 55nm smart card chip further strengthens our leading position in this field in China, and also demonstrates SMIC's efforts on developing advanced technologies. We're impressed with SMIC's stable and complete technology platform and believe we can work together to offer customers products that are low-cost, power efficient, highly reliable and durable."

"SMIC focuses on providing differentiated products and high-quality services to customers and meet their needs with highly integrated advanced technology platforms and high-efficient solutions," said Dr. Tzu-Yin Chiu, chief executive officer and executive director of SMIC. "HED has been a driver in China's smart card chip technologies. We are pleased to become its partner and help launch its leading smart card chip product. With the rapid growth of China's smart card market, SMIC will continue to collaborate with HED and help customers expand the market and obtain more shares with advanced technology platforms and world class services."

SHANGHAI, July 20, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC" or the "Company") (NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world, announces today an upward revision of its Q2 gross margin guidance for the three months ended June 30, 2014, which was originally released by the Company in its results for the three months ended March 31, 2014 on April 28, 2014. Gross margin for the three months ended June 30, 2014 is guided to be 27% to 29% compared to the original guidance of 22% to 24%. 

Dr. Yonggang Gao, Chief Financial Officer commented, "Since the release of our second quarter gross margin guidance, we have seen an increase in utilization and improved expense control, exceeding our earlier expectations. Therefore, we are now revising up our second quarter gross margin. Meanwhile, we maintain our original revenue and non-GAAP operating expenses for the second quarter of 2014." 

As originally guided, revenue in the second quarter of 2014 was expected to increase 12% to 15% quarter over quarter, and non-GAAP operating expenses (excluding the effect of employee bonus accrual, funding of R&D contracts from the government and gain from the disposal of living quarters) were expected to range from$89 million to $93 million.

The Company is still in the process of finalizing its results for the three months ended June 30, 2014. The information contained in this press release is only a preliminary assessment by the management of the Company based on the latest unaudited consolidated management accounts of the Company for the three months ended June 30, 2014, which have not been confirmed nor audited by the Company's auditors and may be subject to adjustments. 

The Company's actual results for the three months ended June 30, 2014 and the Company's guidance for the three months ended September 30, 2014 will be published on August 6, 2014.

Shareholders and potential investors are advised to exercise caution when dealing in the shares of the Company.

SAN DIEGO, July 3, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) and Qualcomm Incorporated (NASDAQ: QCOM), have announced that SMIC and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, are working together in connection with 28nm process technology and wafer manufacturing services in China to manufacture Qualcomm� Snapdragon� processors. Qualcomm Technologies' Snapdragon processors are purpose built for mobile devices. SMIC is one of China's largest and most advanced semiconductor foundries, and Qualcomm Technologies is one of the world's largest fabless semiconductor vendors and a world leader in 3G, 4G and next-generation wireless technologies. This collaboration will help accelerate SMIC's 28nm process maturity and capacity, and will also make SMIC one of the first semiconductor foundries in China to offer production locally for some of Qualcomm Technologies' latest Snapdragon processors on 28nm node, both PolySiON (PS) and high-K dielectrics metal gate (HKMG).

Previously, SMIC has supported Qualcomm Technologies on power management, wireless and connectivity related IC products at various process nodes. With this new collaboration involving 28nm technology and wafer manufacturing services, SMIC is further strengthening its strategic relationship with Qualcomm Technologies. SMIC will work with Qualcomm Technologies in bringing new 28nm design-ins and products for the growing mobile communication industry. Going forward, SMIC will also extend its technology offerings on 3DIC and RF front-end wafer manufacturing in support of Qualcomm Technologies as its Snapdragon product portfolio continues to expand.

"We are delighted to enter this collaboration with Qualcomm Technologies since this marks a significant milestone on the readiness and competitiveness of SMIC's 28nm process technologies," said Dr. Tzu-Yin Chiu, chief executive officer and executive director, SMIC. "This step forward demonstrates SMIC's capabilities and commitments on bringing up the needed advanced node technologies for addressing customers' demands and product roadmaps. With Qualcomm Technologies' support, we are confident that our 28nm technologies will become one of the most important growth drivers for the company. We expect that the 28nm product life cycle longevity will exceed previous nodes, which will help better position SMIC to service the needs of Qualcomm Technologies, as well as others."

"SMIC is an important supplier to Qualcomm Technologies, and we are pleased to be working with SMIC, whose capabilities and technology offerings are growing to meet our demanding product needs," said Murthy Renduchintala, executive vice president, Qualcomm Technologies, Inc., and co-president, QCT. "We look forward to working with SMIC on bringing up its 28nm production in China and executing on our regionalsupply chain strategy. With SMIC becoming a more important supplier in our global operations, this collaboration will help further our manufacturing footprint and services in China, one of the world's largest mobile consumer opportunities."

Fourth Quarter 2013 Financial Results:

• Revenue including wafer shipments from Wuhan Xinxin was $491.8 million in 4Q13, an increase of 1.2 % year over year, and down 7.9% quarter over quarter
• Earnings per ADS (basic and diluted) 0.02 vs. last years of 0.07

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director, commented, "2013 was another record-breaking year for SMIC. Based on our unaudited financial statements for the full year of 2013, revenue in 2013 reached a record high, of $2.07B, an annual growth of 21.6% when compared to 2012. If we remove the Wuhan Xinxin revenue contribution, SMIC revenue growth rate was a robust 27%. Our net profit attributable to owners of the Company also reached a historical high of $173.2 million compared to $22.8 million in 2012, an increase of 6.6 times. Our monthly capacity at year-end grew 6.7% year over year, to 234 thousand wafers per month compared to the end of 2012.

"I'm happy to announce that our 28nm High-K Metal Gate (HKMG) and PolySiON processes are both process frozen successfully, and are in Multi Project Wafer stage. We target modest revenue from 28nm process technology at the end of 2014 and more significant ramp up in 2015.

"China continues to be a leading source of high growth for SMIC. In 2013, China revenue accounted for 40.4% of our revenues, with a noteworthy growth rate of 44.9% compared to 2012.

"In the long-run, we have confidence in our strategy and capability to capture growth opportunities, especially those in the China IC market. And we continue to work with our new and existing customers to capture opportunities in 2014 and onward."

HSINCHU, Dec. 30, 2013 /PRNewswire/ -- eMemory, the global leader in embedded non-volatile memory (eNVM) and Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry, today announced that they plan to expand the deployment of their current collaboration on SMIC's eNVM platform development. The platform covers both One Time Programmable (OTP) and Multiple Times Programmable (MTP) eNVM technologies, such as NeoBit, NeoFuse, NeoEE and NeoMTP, across a wide range of technology nodes ranging from 0.35um to 40nm.

eMemory and SMIC have been collaborating since 2004. SMIC's processes that apply eMemory's eNVM solutions include logic, HV, analog, and BCD processes; with applications ranging from digital set-top box (STB), multimedia players, power management IC, microcontrollers, Bluetooth controller IC and Radio Frequency Identification (RFID) IC�etc.

The two companies recently teamed up to provide an OTP solution based on SMIC's 0.18um and 0.13um processes which offer customers high reliability and cost effective power management solutions. These solutions can benefit analog and power management clients to gain tactical advantages for serving the vast Smartphone, Tablet PC, and the emerging wearable devices market.

On the other hand, eMemory and SMIC are also actively developing eNVM solutions for applications that require high endurances and security features. The offered solution is capable of meeting a myriad of client requirements including low cost, superior performance and reliability. eMemory and SMIC expect continued success as the consumer electronics market in China flourishes.

eMemory received the Best IP Partner Award in Specialty NVM IP area at SMIC's 13^th Technology Symposium; alongside the world's leading IP companies including ARM and Synopsys. This honor is in recognition of eMemory's outstanding abilities in excellent silicon IP products, highly integrated technical support and design services. The achievement demonstrates eMemory's leading position in the global eNVM industry.

"eMemory is our trusted IP partner who has consistently demonstrated excellence in IP quality, reliability and its customer service since we began our collaboration in 2004," said Dr. Tianshen Tang, Senior Vice President of SMIC Design Service. "Our partnership with eMemory further strengthens the quality of our products so we can provide our customers highly competitive products with smaller sizes and better performance at lower costs. We look forward to forging a closer relationship with eMemory on our future high-end products."

eMemory President Rick Shen commented, "Mainland China, as one of our major target markets, has the greatest purchasing power in the world for consumer electronics. eMemory is honored to receive the first Best IP Partner Award from SMIC. This award represents not only the recognition of our capabilities of technical support and design service, but also indicates a stronger bond between the two companies to jointly expand market share in Mainland China in the future. eMemory and SMIC will continue to broaden the collaboration scope to establish comprehensive eNVM technology and silicon IP product portfolios and to provide customers with more competitive process platforms. Our ultimate goal is to create an all-win situation for eMemory, SMIC, and our mutual customers."

SHANGHAI, Oct. 24, 2013 /PRNewswire/ --

SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION 
(Incorporated in the Cayman Islands with limited liability)
 (NYSE: SMI; SEHK: 981)

(1)  PROPOSED ISSUE OF US$200 MILLION ZERO COUPON CONVERTIBLE BONDS DUE 2018
(2)  PRE-EMPTIVE RIGHT OF DATANG AND
(3)  PRE-EMPTIVE RIGHT OF COUNTRY HILL

ISSUE OF THE PLACED BONDS

On 24 October 2013, the Company and the Joint Managers entered into the Bond Subscription Agreement, pursuant to which each of the Joint Managers has agreed to subscribe and pay for, or to procure subscribers to subscribe and pay for the Placed Bonds to be issued by the Company in an aggregate principal amount of US$200 million.

Based on the initial Conversion Price of HK$0.7965 and assuming full conversion of the Placed Bonds at the initial Conversion Price, the Placed Bonds will be convertible into 1,946,817,325 Shares, representing (i) approximately 6.07% of the issued share capital of the Company on the Last Trading Day and (ii) approximately 5.72% of the issued share capital of the Company as enlarged by the issue of the Conversion Shares. The Conversion Shares will be allotted and issued pursuant to the general mandate of the Company granted to the Directors at the annual general meeting held on 13 June 2013 and will rank pari passu in all respects with the Shares then in issue on the relevant conversion date. The issue of the Placed Bonds is not subject to the approval of the Shareholders.

An application will be made to the Hong Kong Stock Exchange for the listing of, and permission to deal in, the Conversion Shares. An application will be made to the Singapore Exchange for the listing of the Bonds.

Completion of the Bond Subscription Agreement is subject to the satisfaction or waiver of the conditions precedent therein. In addition, the Bond Subscription Agreement may be terminated in certain circumstances. Please refer to the paragraph headed ''The Bond Subscription Agreement'' under the section ''Issue of the Placed Bonds'' below for further information.

Third Quarter 2013 Financial Results:

• Revenue including wafer shipments from Wuhan Xinxin was $534.3 million in 3Q13, an increase of 15.8% year over year, and down 1.3% quarter over quarter.
• Earnings per ADS (basic and diluted) was 0.07 vs. last years 0.02

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director, commented, "SMIC has achieved another good quarter. Revenue excluding Wuhan wafer shipment was $503.7 million in the third quarter of 2013, representing a robust year over year growth of 21.7% and a sequential growth of 0.4%. Total revenue including Wuhan wafer shipments declined 1.3% sequentially as we exit our relationship with Wuhan Xinxin. I'm also pleased that we made $42.5 million in profit attributable to SMIC, which is our sixth consecutive quarter of positive profit.
 
I am happy to announce that 40nm wafer revenue grew 50.3% sequentially to 15.7% of total wafer revenue. This growth was mainly driven by smartphone related products. Meanwhile, 40nm new tape outs grew significantly in the second half of this year, driven by both consumer and communications products like smartphones, set-top box, IPTV, and tablets. As a result, we are targeting strong growth for 40nm next year.
 
During the quarter, demand for our differentiated applications continued to be strong, especially in the areas of power management, CIS, and EEPROM. Revenue from our differentiated applications, specifically PMIC, CIS, and EEPROM, grew over 50% year over year in 3Q2013 compared to 3Q2012.
 
We target another full year of record high revenue in 2013 with sustainable profitability and growth as our priority. Looking into 2014, we aim to outgrow the industry average again. We have a number of exciting opportunities ahead of us. 1) Our 40nm ramp up will continue. 2) Our 28nm technology is coming on line. 3) Our embedded Non-Volatile Memory (e-NVM) is finding wide spread customer acceptance. 4) A number of other differentiated technologies will be rolling out in 2014. And lastly, our new capacity for high-end and mature technology is coming on line. It will be an exciting 2014."

Fourth Quarter 2013 Guidance:

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below.

• Excluding wafer shipments from Wuhan Xinxin which SMIC began gradually phasing out in 3Q13, non-GAAP revenue is expected to be flat to down 4.5% quarter over quarter.
• Revenue including wafer shipments from Wuhan Xinxin is expected to be down 4.5% to down 9% quarter over quarter.
• Non-GAAP gross margin excluding wafer shipments from Wuhan Xinxin is expected to range from 19.0% to 22.0%.
• Gross margin including wafer shipments from Wuhan Xinxin is expected to range from 18.5% to 21.5%.
• Non-GAAP operating expenses excluding the effect of foreign exchange, employee bonus accrual, funding of R&D contracts from the government and gain from the disposal of living quarters are expected to range from $80.0 million to $84.0 million.

SHANGHAI, June 3, 2013 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), mainland China's largest and most advanced semiconductor foundry, today announced that it entered into the Joint Venture Agreement with SMIC Beijing, BIDIMC and ZDG in relation to the establishment of the Joint Venture Company (subject to the approval of the relevant PRC authorities).

Following its establishment and depending on the environment in which the Joint Venture Company operates and market conditions, the Joint Venture Company is expected to establish and build up significant manufacturing capacity with a focus on 45-nanometer and finer technologies and aims to reach a manufacturing capacity of 35,000 wafers per month. The total investment is estimated to beUS$3.59 billion. US$1.2 billion of the total investment will be contributed by the parties in the form of registered capital, and the remaining amount is intended to be funded through the Joint Venture Company's internal cash flow, shareholders' further contribution to share capital, shareholders' loan and/or bank loans.

SMIC and SMIC Beijing shall contribute 55% of the registered capital in an aggregate amount of US$660 million, ZDG and BIDIMC shall contribute 45% of the registered capital in an aggregate amount of US$540 million. The registered capital shall be made by the parties within two years from the establishment of the Joint Venture Company.

Funding to the Joint Venture Company in the form of shareholders' further contribution to share capital or shareholders' loan, if any, will be contributed as to 55% by SMIC and SMIC Beijing, and as to 45% by ZDG and BIDIMC. In addition, the Joint Venture Company and the parties involved may seek debt financing on terms beneficial to the Joint Venture Company.

The progress of contributions by the parties to the Joint Venture Agreement may be adjusted by the Joint Venture Company in accordance with its actual operational needs. If a party does not fully make its relevant contribution by the timing required, until such contribution is fully made, the party may only enjoy its shareholder rights based on its proportional actual contribution. Each of the parties may transfer its rights to subscribe to the share capital and contribution obligations under the Joint Venture Agreement to its affiliates, subject to certain conditions. The cash capital contribution from SMIC will be funded by internal cash flow and, if necessary, other form of financing.

The board of directors of the Joint Venture Company will comprise 5 directors. SMIC and SMIC Beijing are together entitled to nominate 3 directors in total and ZDG is entitled to nominate 2 directors. BIDMIC is entitled to appoint an observer to sit in at the board meetings. SMIC will be responsible for managing the daily operations of the Joint Venture Company. The term of operation of the Joint Venture Company will be 25 years from the date of the issue of its business license. The parties to the Joint Venture Agreement shall decide whether to extend the term of operation of the Joint Venture Company at least six months prior to the expiry date of the term of operation, subject to the approval of the relevant PRC authorities. The Joint Venture Agreement will, after being agreed and signed by the parties, become effective on the day on which all necessary approvals and consents from the relevant PRC governmental and regulatory authorities have been obtained. The obligations of the parties under the Joint Venture Agreement are subject to compliance with applicable laws (including those of regulatory authorities (including the Stock Exchange)).

First Quarter 2013 Financial Results

• Fourth consecutive quarter of record high revenue of $501.6 million in 1Q13, an increase of 50.8% year over year, and up 3.2% quarter over quarter.
• Gross margin was 20.4% in 1Q13, compared to 12.0% in 1Q12 and 19.9% in 4Q12.
• Net income attributable to SMIC was $40.6 million in 1Q13, compared to net loss of $42.8 million in 1Q12 and net income of $46.6 million in 4Q12.
• Earnings (loss) per ADS (basic and diluted) was $0.06 vs last years loss of ($0.08)

Second Quarter 2013 Guidance:

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below.

• Revenue is expected to increase between 3% to 5% quarter over quarter.
• Gross margin is expected to range from 20% to 22%.
• Expenses from continuing operations excluding the effect of foreign exchange and government R&D grants are expected to range from $85 million to $88 million.

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director, commented, "I am very pleased to report that SMIC has again achieved record high revenue of $501.6 million in the first quarter of 2013, representing year over year growth of 50.8%. In addition, revenue from our China-based customers grew 14.5% sequentially and 79.1% year-over-year, contributing 38.6% of total revenue in the first quarter of 2013, an all-time high. Income attributable to SMIC was $40.6 million in 1Q 2013 compared to a loss of $42.8 million in 1Q 2012. Despite the normal seasonally slow fourth and first quarters, we achieved five consecutive quarters of revenue growth and four consecutive quarters of net profit.

"40/45nm revenue contribution more than doubled to 6.4% compared to 2.6% wafer revenue in the fourth quarter of 2012. This increase was mainly driven by higher demand for mobile products from both U.S. and China-based customers. Along the same line, our 28nm advanced development, for both HKMG and PolySiON processes, continues to be on track and are targeted to be ready by the fourth quarter of 2013.

"We currently expect 2Q 2013 to continue to grow 3% to 5% sequentially, which means SMIC would achieve 6 consecutive quarters of growth. Our growth driver in 2013 will continue to be 40/45nm process, servicing primarily mobile related applications, as well as the strong demand from China.

"I'd like to reiterate that we will continue to focus on sustainable profitability, growth, and shareholder value."

Third Quarter 2012 Highlights:

• Quarterly revenue hit a record high of $461.2 million in 3Q12, which was up by 9.3% from $421.8 million in 2Q12 and grew by 50.3% year over year.
• Gross margin increased to 27.5% in 3Q12 compared to 24.1% in 2Q12, primarily due to continued improvements in manufacturing efficiency.
• Net cash flow generated from operations was $119.0 million in 3Q12, compared to $109.4 million in 2Q12.
• Income attributable to Semiconductor Manufacturing International Corporation increased to $12.0 million in 3Q12, compared to $7.1 million in 2Q12.
• Diluted EPS was $0.02 per ADS.

Fourth Quarter 2012 Guidance:

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below.

• Revenue is expected to be flat to up 2%.
• Gross margin is expected to range from 18% to 20%.
• Operating expenses excluding the effect of foreign exchange and government R&D grants are expected to range from $70 million to $74 million.

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director, commented, "SMIC has demonstrated another quarter of significant improvement. This management team came on board in the third quarter of 2011, and since then our capacity has grown 6% with 50% revenue growth. Our gross margin improved from 1.4% to 27.5%, and on the bottom-line we are back in the black. We are now three quarters through the year, and we anticipate that 2012 will mark a year of record-high revenue.

"In the past two quarters, we successfully achieved our short-term goal: to fully utilize our existing capacity and improve efficiency.

"Our medium-term goal of technology differentiation is on track. We've already seen the fruit of some initial results.

"And we are on track with our long-term objective, to continue advanced technology development to serve the expanding demand from the fast growing China market, while deepening our relationships with leading customers through quality and service.

"We anticipate flat to slight growth for the fourth quarter sequentially, as a result of our 65nm and 0.18um strength. I'd like to add that SMIC is in the right market and still benefiting from the rapid growth of the communications and consumer sectors in China. Because of SMIC's weight in these sectors, we are less sensitive to PC weakness, and we are currently benefiting from good exposure to feature phones, smart phones and tablets."

Second Quarter 2012 Results

• Record-high quarterly revenue of $421.8 million in 2Q12, which was up by 26.8% from $332.7 million in 1Q12 and jumped by 19.7% year over year.
• Gross margin doubled to 24.1% in 2Q12 compared to 12.0% in 1Q12, primarily due to a higher utilization rate and continued improvements in manufacturing efficiency.
• Net cash flow from operations tripled to $109.4 million in 2Q12 from $35.8 million in 1Q12.
• Income attributable to Semiconductor Manufacturing International Corporation was $7.1 million in 2Q12, compared to a loss of $42.8 million in 1Q12.
• Diluted EPS was $0.01 per ADS.

Third Quarter 2012 Guidance: 

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below.

• Revenue is expected to increase between 4% and 6%.
• Gross margin is expected to range from 22% to 24%.
• Operating expenses excluding foreign exchange differences and government grants are expected to range from $93 million to $96 million.

Dr. Tzu-Yin Chiu, SMIC's Chief Executive Officer and Executive Director, remarked, "I am very pleased to report solid second quarter results with revenue of US$421.8 million. This is a new sales record for SMIC with a quarter-over-quarter increase of 26.8% and growth of 19.7% over the same period last year. We have a positive operating profit and a net profit of US$7.1 million. SMIC has benefited from strong customer demand across the board and in particular an 87% quarter-to-quarter increase in our 65/55nm revenue. We are also experiencing a strong demand increase for our specialty processes, including power management ICs, EEPROM, and others. As a result, the overall revenue growth exceeded our original guidance.

"We are enjoying good overall fab utilization as a result of industry demand improvement and our internal efforts. The second quarter overall utilization was 95%, as compared to 74% in the first quarter.

"Our China revenue continues to grow along with China's semiconductor market. In the second quarter of 2012, our China revenue grew 28% quarter-over-quarter, equivalent to about 33% of our total revenue in the second quarter of 2012."

First Quarter 2012 Results

• Revenue up by 14.9% to $332.7 million in 1Q12 from $289.6 million in 4Q11 and down by 10.2% compared to 1Q11. 
• Gross margin was 12.0% in 1Q12 compared to -7.4% in 4Q11 primarily due to higher utilization and cost saving actions in 1Q12. 
• Net cash flow from operations decreased to $35.8 million in 1Q12 from $84.7 million in 4Q11 mainly due to VAT refund in 2011 Q4. 
• Loss attributable to Semiconductor Manufacturing International Corporation was $ 42.8 million in 1Q12, compared to loss of $165.2 million in 4Q11. 
• Diluted EPS was $(0.08) per ADS.

Second Quarter 2012 Guidance: 

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below.

• Revenue is expected to increase between 19% and 21%.
• Gross margin is expected to range from 19% to 22%.
• Operating expenses excluding foreign exchange differences are expected to range from $101 million to $104 million.

Dr. Tzu-Yin Chiu, Chief Executive Officer, commented, "In the first quarter of 2012, our revenue grew 15% sequentially; in the second quarter of 2012, our revenue is guided to increase between 19 and 21%; and into the second half of this year, we target continued growth. This ongoing momentum is primarily due to various new product ramp-ups for connectivity chips, mobile phones and set-top boxes, and is also attributable to increased demand for some of our existing products. Apart from macro reasons, the increase in demand and utilization is also driven by performance improvements."

"Our China revenue continues to grow along with China's semiconductor market. In the first quarter of 2012, our China revenue grew 9.5% quarter over quarter, equivalent to about 32.5% of our total revenue in the first quarter of 2012."

"We have successfully obtained two major loans in the first quarter of 2012. First, we obtained a $268 million loan facility in February, and second, a $600 million syndicated loan in March. These credit arrangements have helped us achieve a healthier capital structure, and show that both policy and commercial banks recognize our potential."

"We are excited about the growth prospects of the coming quarters and are expecting continued order momentum for both new and existing products, across various applications, from our leading global and Chinese customers."

SHANGHAI, April 9, 2012 /PRNewswire-Asia/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the world's leading semiconductor foundries, is pleased to announce today an upward revision of its first quarter revenue and gross margin guidance for the three months ended March 31, 2012, which was originally released by SMIC in its results for the three months ended December 31, 2011 on February 8, 2012 (the "Original Guidance").

"Since the release of our original guidance, we have seen solid order momentum and an improved outlook from our customers across the board, exceeding our earlier expectations. Therefore, we are now raising our first quarter 2012 revenue guidance to a sequential increase of 14% to 15%, from the original guidance of an increase of 7% to 9%. We are also raising our first quarter 2012 gross margin guidance to between 10% and 12% from the original guidance of between 4% and 7%, as a result of the increased loading in our fabs," said Gary Tseng, Chief Financial Officer of SMIC.

Second Quarter 2011 Highlights: 

• Revenue down by 4.9% to $352.4 million in 2Q11 from $370.6 million in 1Q11 and down by 5.9% compared to 2Q10.
• Gross margin was 14.3% in 2Q11 compared to 18.6% in 1Q11 primarily due to decreased wafer starts from weakened demand in the third quarter. 
• Net cash flow from operations increased to $79.4 million in 2Q11 from $73.4 million in 1Q11.
• Loss attributable to holders of ordinary shares was $3.8 million in 2Q11, compared to income of $10.2 million in 1Q11.
• Diluted EPS was $(0.0066) per ADS.

Third Quarter 2011 Guidance: 

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below.

• Revenue is expected to decline between -14% to -17%.
• Gross margin is expected to range from 0% to 3%.
• Operating expenses excluding foreign exchange differences are expected to range from $86 million to $89 million.

Gary Tseng, Chief Financial Officer commented, "Highlighting our second quarter performance, revenue decreased 4.9% quarter-over-quarter to $352 million. This decline was in part due to our customer transition to 65nm and 45nm and largely due to unexpected changes in some of our customers' programs—including some customers skipping 65nm to work on 45nm and one customer abandoning their lower-end baseband business. Despite these changes, we continue to have new tape outs for 65nm and customers committed to working with us on their 45/40nm products, which will likely contribute meaningful revenue next year.

"Looking into the third quarter, the overall demand from both international and domestic customers is weaker than expected due to relatively soft end-market consumption and high inventory, in addition to sudden customer product changes. The combination of these factors will pose adverse impacts to our revenue for the third quarter of 2011. Our visibility into fourth quarter demand is currently limited, and the overall global economic outlook also contributes to uncertainty. We currently do not see any particular strengths from customer demand for back-to-school and holiday seasons, so we currently remain cautious on our overall second half 2011 outlook."

Our cash flows from operations have historically exceeded operating income, reflecting our significant non-cash depreciation expenses. Our operating cash flows may not be sufficient to meet our capital expenditure requirements in 2011. If our operating cash flows are insufficient, we plan to fund the expected shortfall through bank loans. If necessary, we will also explore other forms of external financing.

First Quarter Results:

• Revenue down by 9.3% to $370.6 million in 1Q11 from $408.6 million in 4Q10 and up by 7.2% compared to 1Q10.
• Gross margin was 18.6% in 1Q11 compared to 24.3% in 4Q10 primarily due to a decline in fab utilization.
• Net cash flow from operations decreased to $73.4 million in 1Q11 from $248.6 million in 4Q10.
• Income attributable to holders of ordinary shares was US$10.2 million in 1Q11, compared to income of US$68.6 million in 4Q10.
• Diluted EPS was $0.02 per ADS.

Guidance:

• Revenue is expected to decline between 3% to 7%.
• Gross margin is expected to range from 15% to 18%.
• Operating expenses excluding foreign exchange differences are expected to range from $82 million to $86 million.

Dr. David NK Wang, President and Chief Executive Officer of SMIC commented, "Highlighting our first-quarter performance, revenue increased 7% year-over-year and decreased 9% quarter-over-quarter to US$371 million. The quarter-over-quarter revenue decline was largely due to first quarter seasonality and our key customers' transition to our 65nm and 45nm.  Despite these situations, China displays resilience and in the first quarter, China sales grew 54% year-over-year and 3% quarter over quarter and now accounts for 36% of our revenue.

Fourth Quarter Highlights:

Revenue up by 0.4% to $411.8 million in 4Q10 from $410.1 million in 3Q10 and up by 23.6% compared to 4Q09.

Gross margin was 23.9% in 4Q10 compared to 24.5% in 3Q10 primarily due to an increase in other manufacturing costs.

Net cash flow from operations has increased to $248.6 million in 4Q10 from $125.2 million in 3Q10.

Income attributable to holders of ordinary shares was US$68.6 million in 4Q10, compared to income of US$30.4 million in 3Q10.

Diluted EPS was $0.13 per ADS.

First Quarter 2011 Guidance:

Revenue is expected to decline between 6% to 9%.

Gross margin is expected to range from 18% to 20%.

Operating expenses excluding foreign exchange differences are expected to range $82 million to $86 million.

Commenting on the quarterly results, Dr. David NK Wang, President and Chief Executive Officer of SMIC remarked, "2010 was a year of achievement for SMIC. First, I am pleased to report that SMIC continued to be profitable for the third consecutive quarter, and has achieved its first profitable year, at both operational and net income levels, after 5 years of loss. Second, we recorded historical high annual revenue of more than $1.55 billion for 2010, representing a year-over-year growth of 45.2%. All of this shows we have made significant progress compared to 12 months ago. We have confidence that our momentum will continue through 2011 and onwards."

"In summary, we achieved a profitable 2010, successful 65-nanometer ramp up thus far, improved operations and overall customer relationships. We continue to focus on sustainable profitability for the long-term. In the near term we continue to ramp up 65/55-nanometer and to bring our 45/40-nanometer into production by the end of 2011. With our planned build up, we target to outgrow the foundry industry in 2011, and we look forward, with our strategy and execution to deliver sustainable value to our shareholders. "