Ase Technology Holding Co., Ltd (NYSE:ASX)

WEB NEWS

Wednesday, October 30, 2019

Comments & Business Outlook

TAIPEI, Taiwan, R.O.C., Oct. 30, 2019 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (TAIEX: 3711, NYSE: ASX) ("We", "ASEH", or the "Company"), the leading provider of semiconductor manufacturing services in assembly and test, today reported unaudited net revenues(1) of NT$117,557 million for 3Q19, up by 9% year-over-year and up by 30% sequentially.  Net income attributable to shareholders of the parent for the quarter totaled NT$5,734 million, down from a net income attributable to shareholders of the parent of NT$6,257 million in 3Q18 and up from a net income attributable to shareholders of the parent of NT$2,690 million in 2Q19.  Basic earnings per share for the quarter were NT$1.35 (or US$0.087 per ADS), compared to basic earnings per share of NT$1.47 for 3Q18 and NT$0.63 for 2Q19.  Diluted earnings per share for the quarter were NT$1.33 (or US$0.085 per ADS), compared to diluted earnings per share of NT$1.43 for 3Q18 and NT$0.62 for 2Q19.

RESULTS OF OPERATIONS

3Q19 Results Highlights – Consolidated

  • Net revenue contribution from packaging operations, testing operations, EMS operations and others, each represented approximately 46%, 10%, 43% and 1%, respectively, of total net revenues for the quarter.
  • Our 3Q19 basic earnings per share of NT$1.35 (or US$0.087 per ADS) were based on 4,252,217,297 weighted average numbers of shares outstanding in 3Q19.  Our 3Q19 diluted earnings per share of NT$1.33 (or US$0.085 per ADS) were based on 4,261,515,344 weighted average numbers of shares outstanding in 3Q19.

3Q19 Results Highlights – ATM(2)(3)

  • Cost of revenues was NT$53,193 million for the quarter, up by 10% sequentially.
  • Gross margin increased 3.1 percentage points to 21.7% in 3Q19 from 18.6% in 2Q19.
  • Operating margin was 9.4% in 3Q19 compared to 6.2% in 2Q19.

3Q19 Results Highlights – EMS

  • Cost of revenues for the quarter was NT$46,105 million, up by 61% sequentially.
  • Gross margin decreased to 8.9% in 3Q19 from 9.1% in 2Q19.
  • Operating margin increased to 4.1% in 3Q19 from 1.6% in 2Q19.

LIQUIDITY AND CAPITAL RESOURCES

  • Capital expenditures in 3Q19 totaled US$436 million, of which US$181 million were used in packaging operations, US$229 million in testing operations, US$23 million in EMS operations and US$3 million in interconnect materials operations and others.
  • As of September 30, 2019, total unused credit lines amounted to NT$196,993 million.
  • Current ratio was 1.14 and net debt to equity ratio was 0.73 as of September 30, 2019.
  • Total number of employees was 94,675 as of September 30, 2019, compared to 91,641 as of June 30, 2019.

BUSINESS REVIEW

Customers
ATM CONSOLIDATED BASIS (3)

  • Our five largest customers together accounted for approximately 46% of our total net revenues in 3Q19, compared to 48% in 2Q19.  One customer accounted for more than 10% of our total net revenues in 3Q19.
  • Our top 10 customers contributed 58% of our total net revenues for the quarter, compared to 60% in 2Q19.
  • Our customers that are integrated device manufacturers or IDMs accounted for 33% of our total net revenues both in 3Q19 and 2Q19.

EMS BASIS

  • Our five largest customers together accounted for approximately 82% of our total net revenues in 3Q19, compared to 73% in 2Q19.  One customer accounted for more than 10% of our total net revenues in 3Q19.
  • Our top 10 customers contributed 90% of our total net revenues during the quarter in 3Q19, compared to 85% in 2Q19.


Wednesday, July 31, 2019

Comments & Business Outlook
TAIPEI, Taiwan, R.O.C., July 31, 2019 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (TAIEX: 3711, NYSE: ASX) ("We", "ASEH", or the "Company") was established following the completion of the merger between Advanced Semiconductor Engineering, Inc. ("ASE") and Siliconware Precision Industries Co., Ltd. on April 30, 2018.  ASE is the Company's predecessor entity; therefore, the financial results of the Company for periods before merger are prepared under the assumption that the Company owned 100% shareholdings of ASE.  The financial results after April 30, 2018, including both 2Q19 and 1Q19, reflect full quarters of combined operations following the completion of the merger.  The financial results for 2Q18 reflect operations of ASE starting from April 1, 2018 and operations of ASEH starting from April 30, 2018.  As a result, the Company's financial results for 2Q19 and 1Q19 may not be comparable to that of 2Q18.  ASEH, the leading provider of semiconductor manufacturing services in assembly and test, today reported unaudited net revenues[1] of NT$90,741 million for 2Q19, up by 7% year-over-year and up by 2% sequentially.  Net income attributable to shareholders of the parent for the quarter totaled NT$2,690 million, down from a net income attributable to shareholders of the parent of NT$11,463 million in 2Q18 and up from a net income attributable to shareholders of the parent of NT$2,043 million in 1Q19.  Basic earnings per share for the quarter were NT$0.63 (or US$0.041 per ADS), compared to basic earnings per share of NT$2.70 for 2Q18 and NT$0.48 for 1Q19.  Diluted earnings per share for the quarter were NT$0.62 (or US$0.040 per ADS), compared to diluted earnings per share of NT$2.69 for 2Q18 and NT$0.46 for 1Q19.

Tuesday, April 30, 2019

Comments & Business Outlook

TAIPEI, Taiwan, R.O.C., April 30, 2019 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (TAIEX: 3711, NYSE: ASX) ("We", "ASEH", or the "Company") was established following the completion of the merger between Advanced Semiconductor Engineering, Inc. ("ASE") and Siliconware Precision Industries Co., Ltd. on April 30, 2018.  ASE is the Company's predecessor entity; therefore, the financial results of the Company for periods before merger are prepared under the assumption that the Company owned 100% shareholdings of ASE at the very beginning.  The financial results after April 30, 2018, including both 1Q19 and 4Q18, reflect full quarters of combined operations following the completion of the merger.  The financial results before April 30, 2018 reflect the operations of ASE and its subsidiaries prior to the establishment of the Company.  As a result, the Company's financial results for 1Q19 and 4Q18 may not be comparable to that for 1Q18.   ASEH, the leading provider of semiconductor manufacturing services in assembly and test, today reported unaudited net revenues[1] of NT$88,861 million for 1Q19, up by 37% year-over-year and down by 22% sequentially.  Net income attributable to shareholders of the parent for the quarter totaled NT$2,043 million, down from a net income attributable to shareholders of the parent of NT$2,096 million in 1Q18 and down from a net income attributable to shareholders of the parent of NT$5,446 million in 4Q18.  Basic earnings per share for the quarter were NT$0.48 (or US$0.031 per ADS), compared to adjusted basic earnings per share of NT$0.49 for 1Q18 and basic earnings per share of NT$1.28 for 4Q18.  Diluted earnings per share for the quarter were NT$0.46(or US$0.030 per ADS), compared to adjusted diluted earnings per share of NT$0.48 for 1Q18 and diluted earnings per share of NT$1.24 for 4Q18.

RESULTS OF OPERATIONS

1Q19 Results Highlights -- Consolidated

  • Net revenue contribution from packaging operations, testing operations, EMS operations and others, each represented approximately 50%, 10%, 39% and 1%, respectively, of total net revenues for the quarter.
  • Cost of revenue was NT$77,476 million for the quarter, down from NT$95,344 millionin 4Q18.
  • Gross margin decreased 3.6 percentage points to 12.8% in 1Q19 from 16.4% in 4Q18.
  • Operating margin was 2.6% in 1Q19 compared to 7.5% in 4Q18.
  • In terms of non-operating items:
  • Income before tax was NT$2,635 million for 1Q19, compared to NT$7,235 million in 4Q18.  We recorded income tax expenses of NT$405 million for the quarter, compared to NT$1,342 million in 4Q18.
  • In 1Q19, net income attributable to shareholders of the parent was NT$2,043 million, compared to net income attributable to shareholders of the parent of NT$2,096 million in 1Q18 and net income attributable to shareholders of the parent of NT$5,446 millionin 4Q18.
  • Our total number of shares outstanding at the end of the quarter was 4,322,625,732, including treasury stock owned by our subsidiaries.  Our 1Q19 basic earnings per share of NT$0.48 (or US$0.031 per ADS) were based on 4,249,572,979 weighted average numbers of shares outstanding in 1Q19.  Our 1Q19 diluted earnings per share of NT$0.46 (or US$0.030 per ADS) were based on 4,255,559,025 weighted average number of shares outstanding in 1Q19.

Monday, July 9, 2018

Comments & Business Outlook
TAIPEI, Taiwan, July 9, 2018 /PRNewswire/ -- ASE TECHNOLOGY HOLDING CO., LTD. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces that as approved by the shareholders of ASE Industrial Holding Co., Ltd. ("ASE") at the extraordinary general shareholders' meeting held on June 21, 2018 (Taiwan time), the name of the Company has been changed to ASE Technology Holding Co., Ltd., effective on the same date.

Friday, July 28, 2017

Comments & Business Outlook

Financial Results Second Quarter 2017

  • Net revenue contribution from packaging operations, testing operations, EMS operations, substrates sold to third parties and others, each represented approximately 46%, 10%, 43%, 1% and 0%, respectively, of total net revenues for the quarter.
  • In 2Q17, net income attributable to shareholders of the parent was NT$7,847 million, compared to net income attributable to shareholders of the parent of NT$4,302 million in 2Q16 and net income attributable to shareholders of the parent of NT$2,559 million in 1Q17.

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the third quarter of 2017 to be as follows:

IC ATM 3Q17 business should be a notch or two lower than 3Q16 levels;
IC ATM 3Q17 margin should be similar to 2Q16 levels;
EMS 3Q17 business should be similar to the average of 3Q16 and 4Q16 levels;
EMS 3Q17 gross margin should be similar to the average of 1Q16 and 2Q16 levels.


Friday, November 18, 2016

Joint Venture

TAIPEI, Taiwan, Nov. 18, 2016 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. ( TWSE code: 2311, NYSE code: ASX; "ASE") and Siliconware Precision Industries Co., Ltd. (TWSE code: 2325, NASDAQ code: SPIL; "SPIL") jointly announced today that on November 16, 2016, the Taiwan Fair Trade Commission (the "TFTC") resolved to give clearance to the notification submitted by ASE on July 29, 2016, in respect of the merger participated by ASE and SPIL as well as a new holding company established through share exchange (the "Share Exchange") between the two companies based on the joint share exchange agreement between ASE and SPIL dated June 30, 2016 (the "Joint Share Exchange").

ASE and SPIL respectfully agree with the TFTC's press release, which indicates, among other things, that "the overall economic benefits outweigh the disadvantages resulting from competition restrictions from the Share Exchange", "most of the respondents think the dual-brand independent operation model will reduce the impacts of adjusting the price", "the Share Exchange has not caused obvious restrictive effects on competition in the global semiconductor packaging and testing market" and "the Share Exchange will also stimulate the development of technology for related industry supply chain." ASE and SPIL firmly believe the completion of the Share Exchange will help improve their strategic position and create new opportunities for the future development and sustainable operations of the semiconductor industry, and will allow both companies to provide customers with better-quality, more efficient and wider -spectrum of packaging and testing services.

According to the Joint Share Exchange Agreement, the Share Exchange is subject to approval, consent or a decision not to prohibit the transaction by the antitrust law enforcement authorities of relevant countries or regions and approval by the shareholders' meetings of each of ASE and SPIL. ASE and SPIL will continue to obtain necessary approvals for the Share Exchange in accordance with the Joint Share Exchange Agreement and relevant laws and regulations.


Thursday, October 27, 2016

Comments & Business Outlook

Third Quarter 2016 Financial Results

  • Net revenues of NT$72,784 million for the third quarter of 2016 (3Q16), down by 0.1% year-over-year and up by 16% sequentially.
  • Diluted earnings per share for the quarter were NT$0.64 (or US$0.101 per ADS), compared to diluted earnings per share of NT$0.69 for 3Q15 and NT$0.47 for 2Q16.

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the fourth quarter of 2016 to be as follows:

IC ATM capacity should be flat quarter over quarter;
IC ATM blended utilization rate should decrease 0-5% sequentially;
IC ATM gross margin should be similar with prior quarter;
EMS business capacity should be flat quarter over quarter; blended utilization rate should increase 10-15% quarter over quarter;
EMS gross margin should be consistent with our gross margin during the first half of 2016.
About ASE, Inc.


Friday, July 29, 2016

Comments & Business Outlook

Second Quarter 2016 Financial Results

  • Net revenues[1] of NT$62,601 million for the second quarter of 2016 (2Q16), down by 11% year-over-year and up by 0.4% sequentially
  • Basic earnings per share for the quarter were NT$0.61 (or US$0.094 per ADS), compared to basic earnings per share of NT$0.48 for 2Q15 and NT$0.54 for 1Q16. Diluted earnings per share for the quarter were NT$0.51 (or US$0.079 per ADS), compared to diluted earnings per share of NT$0.43 for 2Q15 and 1Q16.

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the third quarter of 2016 to be as follows:

IC ATM capacity will increase 5% sequentially;
IC ATM utilization rate will also increase 5% sequentially;
IC ATM gross margin should be around 4Q15 levels;
EMS business should approach 2Q15 levels;
EMS gross margin should approach 1Q16 levels.


Thursday, June 30, 2016

Acquisition Activity

TAICHUNG, Taiwan, June 30, 2016 /PRNewswire/ -- Siliconware Precision Industries Co., Ltd. (TWSE code: 2325, NASDAQ code: SPIL, hereafter "SPIL") and Advanced Semiconductor Engineering, Inc. (TWSE code: 2311, NYSE code: ASX, hereafter "ASE") jointly announced today that each party's respective board of directors has passed resolution to approve the entering into and execution of a joint share exchange agreement between SPIL and ASE (the "Agreement") and agrees to establish a holding company (the "Holdco").  Major stipulations and purposes of the Agreement are set forth below:

  1. ASE and SPIL jointly agree to establish Holdco, which will be listed in the Taiwan Stock Exchange and whose American depositary shares will be listed in the New York Stock Exchange. Upon the establishment of the Holdco, ASE and SPIL will become wholly-owned subsidiaries of the HoldCo and become sibling companies. Through this parallel operation model which incentivizes healthy internal competition and promotes cooperation, ASE and SPIL strive to improve each's operating efficiency, economy of scale as well as R&D and innovation results, thereby creating an environment of mutual assistance and win-win mentality, strengthening competitiveness and improving the performance of Holdco, with the main goals of improving the quality of customer service, creating shareholder value and benefiting the employees.
  2. Upon the establishment of the Holdco, ASE and SPIL will each maintain its separate legal entity status, retain its respective legal entity name as well as independent business and operation model. ASE and SPIL will each retain its respective management team and employees and maintain its current organizational structure, compensation and relevant benefits and personnel policies.
  3. The share exchange will be conducted (1) at an exchange ratio of one ASE common share for 0.5 HoldCo common share, and (2) at NT$55 in cash for each of SPIL's common shares and ASE and SPIL will become wholly-owned subsidiaries of HoldCo. The cash consideration of NT$55 has been adjusted to NT$51.2 after excluding the NT$2.8 per share cash dividend distribution approved by resolution at SPIL's annual shareholders' meeting in 2016 as well as a NT$1.0 per share payment from capital reserve. The NT$51.2 cash consideration aforementioned will not be subject to further adjustment if the cash dividends distribution by SPIL in 2017 is less than 85% of SPIL's after-tax net profit for the year 2016.
  4. The long stop date of the Agreement (the "Long Stop Date") means the expiry day of 18 months after the execution date of the Agreement (i.e., December 31, 2017) or a later date otherwise agreed upon in writing by both parties. If the closing of this transaction cannot be consummated due to failure of the conditions precedent to be satisfied on or before the Long Stop Date, the Agreement shall be terminated automatically at 0:00 on the day immediately following the Long Stop Date, except as otherwise agreed thereof.
  5. The closing of the transaction will be subject to the execution of the Agreement, the necessary approvals by relevant domestic and foreign competent authorities, the approvals by ASE and SPIL's respective shareholders' meeting as well as the satisfaction of other conditions precedent.
    The management teams of ASE and SPIL have agreed to jointly plan, with the utmost sincerity and determination and on the basis of equality, reciprocity and mutual benefit, the establishment of the HoldCo to consolidate the current operations and excellent talents of ASE and SPIL. The collaboration between the parties will result in synergies that can create a competitive advantages and opportunities for the future development and sustained growth of the semiconductor industry by enhancing efficiency and economies of scale as well deeply strengthening research and development and innovation capabilities, thereby providing customers with higher quality, more efficient, and well-rounded packaging and testing services. ASE and SPIL have always strived for innovation, research and development and improving economies of scale and operating efficiency to maximize shareholder value and improve the semiconductor packaging and testing industry's advantage. Both parties also believe that one of their main task and social responsibilities is to continue to cultivate and nurture excellent talents for years to come.

The management teams of ASE and SPIL have agreed to jointly plan, with the utmost sincerity and determination and on the basis of equality, reciprocity and mutual benefit, the establishment of the HoldCo to consolidate the current operations and excellent talents of ASE and SPIL. The collaboration between the parties will result in synergies that can create a competitive advantages and opportunities for the future development and sustained growth of the semiconductor industry by enhancing efficiency and economies of scale as well deeply strengthening research and development and innovation capabilities, thereby providing customers with higher quality, more efficient, and well-rounded packaging and testing services. ASE and SPIL have always strived for innovation, research and development and improving economies of scale and operating efficiency to maximize shareholder value and improve the semiconductor packaging and testing industry's advantage. Both parties also believe that one of their main task and social responsibilities is to continue to cultivate and nurture excellent talents for years to come.


Thursday, May 26, 2016

Acquisition Activity

TAIPEI, Taiwan, May 26, 2016 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TWSE Code: 2311, NYSE Code: ASX) ("ASE") and Siliconware Precision Industries Co., Ltd. ("SPIL")(Taiwan Stock Exchange: 2325, NASDAQ: SPIL) announced today that the boards of directors of ASE and SPIL have separately passed resolutions today for the execution by ASE and SPIL of the "Joint Share Exchange Memorandum of Understanding." Both companies agree to promote plans for the establishment of a holding company ("HoldCo"). The main terms and purpose of the plans to jointly establish HoldCo are as follows:

1.     HoldCo will be jointly established by ASE and SPIL, and will be listed on the Taiwan Stock Exchange (American depositary shares of HoldCo will be listed on the New York Stock Exchange). Upon the completion of its establishment, HoldCo will simultaneously hold 100% equity interests in both ASE and SPIL (the "Transaction" or "Joint Share Exchange"). As parallel sibling companies under HoldCo, ASE and SPIL can, through maintaining an operating model which incentivizes healthy competition while promoting cooperation between the two companies, improve their individual operating efficiencies and economies of scale as well as research innovation achievements. In doing so, both companies will jointly create a mutually beneficial platform that can strengthen competitiveness, improve the performance of HoldCo, and seek to attain the goals of improving customer service quality, creating shareholder value and improving employee well-being.

2.     After the establishment of HoldCo, ASE and SPIL will each maintain its separate legal entity status, retain its legal entity name, and maintain its current independent operations and operating model. ASE and SPIL will each retain its full management team and employees, and their current organizational structure, compensation, relevant benefits and personnel regulations will continue to remain unchanged.

3.     The Joint Share Exchange will result in (1) Holdco issuing new HoldCo shares as consideration in exchange for all of ASE's shares at the exchange ratio of 1 ASE common share in exchange for 0.5 HoldCo common shares and (2) HoldCo paying NT$55 in cash per SPIL common share as consideration for all of SPIL's shares. HoldCo will simultaneously hold 100% equity interests in both ASE and SPIL upon the consummation of the Transaction.

4.     The Joint Share Exchange Memorandum of Understanding is not binding. After separately convening their respective boards of directors to approve the Transaction, both parties will execute a "Joint Share Exchange Agreement" on or before June 25, 2016. The completion of the Transaction is conditioned upon the completion of the execution of the Joint Share Exchange Agreement, all necessary approvals from foreign and domestic competent authorities and the satisfaction of all other closing conditions.

After sincere communication and exchange of opinions, the management teams of ASE and SPIL have agreed to jointly plan, with utmost sincerity and determination and on the basis of equality, reciprocity and mutual benefit, the establishment of HoldCo to consolidate the current operating models and excellent talents of ASE and SPIL. The collaboration between the parties will result in synergies that can create a high point and opportunities for the future development and sustained operations of the semiconductor industry by enhancing efficiency and economies of scale as well strengthening deep research and development and innovation capabilities, thereby providing customers with higher quality, more efficient, and well-rounded packaging and testing services. ASE and SPIL have always strived to innovate research and development and improve economies of scale and operating efficiency to maximize shareholder value. Both parties believe their main task and social responsibility is to continue maintaining and improving the semiconductor packaging and testing industry's advantage, and at the same time consolidate the excellent talents nurtured over the decades.


Wednesday, May 4, 2016

Comments & Business Outlook
BUSINESS WIRE) - Tessera Technologies, Inc. (Nasdaq : TSRA) today announced that its wholly owned subsidiary Invensas Corporation and ASE (Advanced Semiconductor Engineering, Inc., hereinafter referred to as ASE) (TAIEX: 2311, NYSE : ASX) signed a new technology licensing and development agreement, the two sides will jointly develop Invensas Bond Via Array � (BVA�) technical and commercial launch. ASE is the world's largest semiconductor packaging and testing services provider, the company is about to enter for a stacked package (PoP) application launch Invensas BVA� final stage of the vertical interconnect technology identification, and customers began to promote. With Invensas of BVA technology, ASE will do so to meet their customers' demands for low-cost thin stacked package solutions These solutions apply to current and future generations of application processor executing smartphones and tablets.

Consumers are more compact, more advanced mobile electronic needs spawned more challenging chip packaging technology requirements. Maintaining or reducing overall package height and cost, we must be able to accommodate larger volumes, higher performance applications processors. Invensas of BVA technology enables equipment manufacturers to meet these conflicting requirements to smaller packages provide better performance while using the existing wire stitching process infrastructure.

ASE chief operating officer Tien Wu (Tien Wu) said: "Tessera ASE is an important partner, was pleased to see between the two companies to further expand technical and business cooperation between the BVA .Invensas technology will help us provide advanced packaging solutions, so that we can continue to meet customer demand for advanced thin integrated packaging solutions and cost-effective. "

Invensas of BVA technology packaging and testing industry will provide unparalleled process variation tolerance, and thus enhance the productivity and cost efficiency. In addition, this technology can also be used to provide a cost-effective 3D interconnect solutions for system-in-package (SiP) and a range of applications.

Tessera Technologies, Inc. CEO Tom Lacey said: "very pleased to sign this agreement with ASE, expect the two sides continue to maintain close cooperation, so that the BVA Invensas future technologies and more in-depth market this agreement will the two companies. provide for a variety of different end products lay the foundation for the next generation of packaging solutions, including smart phones and tablet PCs and other mobile electronic products. "

The companies expect Invensas BVA equipped with advanced packaging technology features the second half of 2016 will be supplied to the ASE customers. For more information about the BVA Invensas Invensas technical and other solutions, please visit


Friday, April 29, 2016

Comments & Business Outlook

First Quarter 2016 Financial Results

  • Net revenue contribution from packaging operations, testing operations, EMS operations, substrates sold to third parties and others, each represented approximately 45%, 10%, 40%, 1% and 4%, respectively, of total net revenues for the quarter.
  • Our 1Q16 basic earnings per share of NT$0.54 (or US$0.082 per ADS) were based on 7,649,385,595 weighted average number of shares outstanding in 1Q16. Our 1Q16 diluted earnings per share of NT$0.43 (or US$0.065 per ADS)

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the second quarter of 2016 to be as follows:

IC ATM business will approach 4Q15 levels, driven by a moderate recovery while SiP business remains seasonally soft;
IC ATM gross margin should see meaningful improvement from 1Q16, but could be a bit lower than 4Q15;
EMS business should decline moderately on a quarter over quarter basis;
EMS gross margin should be similar with 1Q16 levels.


Thursday, April 28, 2016

Comments & Business Outlook

SAN JOSE, Calif., April 28, 2016 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311) (NYSE: ASX) and Deca Technologies, a subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY), today announced the signing of an agreement whereby ASE will invest $60 million in Deca and will license Deca's M-Series� Fan-out Wafer-Level Packaging (FOWLP) technologies and processes. As part of the agreement, ASE and Deca will jointly develop the M-Series fan-out manufacturing process and will expand production of chip-scale packages using this technology. The technology is required for the reduced size and power consumption needed for portable Internet of Things (IoT) applications and smartphones. Deca's version of it uses autoline technology developed by SunPower to decrease cost and manufacturing cycle time.

"At Cypress we have experienced the efficiency of Deca's M-Series technology with our own chips and brought its benefits to our customers," said T.J. Rodgers, Chairman of the Board at Deca Technologies and president and CEO of Cypress Semiconductor Corp. "With this investment from ASE, Deca now has strong validation of M-Series as a technology that will bring fan-out wafer-level packaging to mass production. This deal is a significant proof point for Deca and for Cypress's ongoing strategy of investing in startups as part of our Emerging Technologies Division."

The ability to put more functionality on ever-shrinking semiconductors, also known as Moore's Law, is causing an unintended consequence in the semiconductor packaging industry, where chips using advanced silicon technologies are so small that all of the input and output balls cannot fit on the surface of the chip using conventional wafer-level chip-scale packaging (WLCSP) technology. Deca's M-Series addresses this challenge with a FOWLP approach, where very small silicon chips are embedded into a larger plastic chip, and the CSP balls are redistributed onto both the native silicon chip and the expanded plastic chip. M-Series enables industry-leading manufacturability for FOWLP using Deca's proprietary Adaptive Patterning� technology, which tracks the alignment of each silicon IC in the redistributed plastic package. ASE has found M-Series to be a viable and effective high-volume manufacturing FOWLP solution.

"With the increasing demands to improve performance and reduce package size from the smartphone market and the emerging demand for IoT, the industry has been looking for a FOWLP technology with true manufacturability," said Chris Seams, CEO of Deca Technologies. "Deca is excited to have ASE select our patented M-Series technology to meet this challenge. By leveraging ASE's large customer base and world-class manufacturing expertise, we can bring FOWLP processing to high-volume reality."

Deca's fan-out wafer level packaging technologies will add to ASE's advanced packaging portfolio, providing customers with a more diverse selection of offerings that are best suited for their IC designs. "Today's announcement is a major milestone in ASE's FOWLP roadmap and demonstrates ASE's continued pursuit in industry leadership to build a complete manufacturing eco-system with key partners," said Dr. Tien Wu, COO, ASE Group. "The incorporating of Deca's M-Series and Adaptive Patterning technologies and manufacturing process will enable ASE to offer customers a proven FOWLP solution that is cost-effective due to the efficiency of large-panel-based processing."

The proposed investment by ASE is subject to the various regulatory approvals or consents including but not limited to the approvals of the Taiwan government.


Wednesday, March 23, 2016

Acquisition Activity

TAIPEI, Taiwan, March 23, 2016 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE" or "we" ) noted today that the Taiwan Fair Trade Commission ("TFTC") has decided to suspend its review of the proposed combination between ASE and Siliconware Precision Industries Co., Ltd. ("SPIL").  We deeply regret and are extremely baffled by the TFTC's decision, which is completely without legal basis and violates the TFTC's own administrative precedents.

In order to respond to the intense and constant changes in the global semiconductor industry, as well as to ensure the sustained development of the Taiwanese semiconductor packaging and testing supply chain, we will continue with our plan to acquire 100% equity interest in SPIL through all legally permissible means and avenues.


Thursday, March 17, 2016

Acquisition Activity

TAIPEI, Taiwan, March 17, 2016 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TWSE Code: 2311, NYSE Code: ASX) ("ASE") announced today that the tender offer by ASE for common shares (including common shares represented by American depositary shares) of Siliconware Precision Industries Co., Ltd. ("SPIL"), launched on December 29, 2015, was unsuccessful due to failure to satisfy the tender offer conditions, as ASE did not receive approval from the Taiwan Fair Trade Commission ("FTC") for the proposed combination between ASE and SPIL before the expiration of the tender offer. Over 27.57% of SPIL shareholders participated in this tender offer. ASE sincerely thanks all members of various fields who supported this tender offer, particularly all SPIL shareholders who participated in this tender offer. ASE deeply regrets not being able to purchase shares from all participating SPIL shareholders due to the FTC not approving the proposed combination before the expiration date of this tender offer. ASE has instructed its tender agents to return all shares to participating SPIL shareholders as soon as possible.

Currently, the Taiwanese semiconductor packaging and testing industry is facing an unprecedented and intense challenge. Semiconductor businesses of other countries and regions -- both integrated device manufacturers ("IDMs") and outsourced assembly and test ("OSAT") companies -- have dramatically improved their global competitiveness through large-scale mergers and acquisitions, and certain players have arisen in the global market with significant support from the government. ASE deeply believes that, only if Taiwanese packaging and testing peers form a national team to face numerous current challenges through the active integration of resources and response to government policies, can the Taiwanese packaging and testing industry maintain its competitive advantage. ASE's acquisition of an equity interest in SPIL was aimed at seeking cooperation with SPIL in order to consolidate both parties' resources and excellent teams. In so doing, both parties could grasp the opportunity of next-generation packaging and testing technologies, welcome the arrival of the "Internet of things" and miniaturization, and jointly create a new blue ocean for the Taiwanese packaging and testing industry against a backdrop of intensifying competition in the global semiconductor industry from IDMs and OSATs.

During the tender offer period, ASE listened with an open mind to the opinions and recommendations expressed by individuals from all walks of society, and hereby makes the following four statements:

ASE's determination to seek integration with SPIL has not changed; after obtaining the FTC's approval, ASE expects to continue seeking the support of SPIL shareholders in order to complete the acquisition of 100% equity interest in SPIL.
ASE's promise to maintain SPIL's legal entity status, legal entity name, current employee benefits, work conditions and personnel regulations, and retain the current SPIL management team and all employees with the utmost good faith to protect their employment right, has not changed.
In order to realize ASE's promise to maintain its roots in Taiwan, integrate the industry, innovate technology, and look after SPIL employees, suppliers and industry partners, concurrent with the acquisition of SPIL, ASE will plan to establish an industrial holding company in Taiwan. In the future, the industrial holding company will separately hold 100% equity interests in both ASE and SPIL, both of which shall retain their legal entity status, allowing ASE and SPIL to become parallel sibling companies under the same holding company, and at the same time jointly creating a platform for mutual benefit that maintains the current operating model of the two companies. The newly established industrial holding company will be listed in Taiwan (and the American depositary shares of the new holding company will be listed in the U.S.) and all current operations of ASE and SPIL in Taiwan will be maintained. ASE will invite, in utmost good faith, Chairman Lin and President Tsai of SPIL to join the board of the industrial holding company and jointly manage the industrial holding company with ASE's management team. In addition, they will continue to serve as chairman and president of SPIL, respectively, and lead the current SPIL management team to look after all SPIL employees as well partners in the up-, mid- and downstream industry chain.
Driven by the twin engines of ASE and SPIL's packaging and testing, the newly established industrial holding company can be expected to strengthen resource consolidation in Taiwan's current semiconductor packaging and testing and related industries and become a new innovation platform for the industry. By drawing on the strength of up-, mid- and downstream businesses in the semiconductor packaging and testing industry, it can face the challenges posed by intense changes in the global semiconductor landscape.
Faced with new competition in the greater environment and the major decision of the industry's future development, ASE sincerely calls upon individuals from all walks of domestic society to adopt a macro perspective and soberly view the impact of development trends in the global semiconductor industry on the Taiwanese packaging and testing industry. Integration of the Taiwanese packaging and testing industry is both necessary and timely. The merger between ASE and SPIL is neither a fight for management rights nor an act of impulse, but rather a critical question of survival for the entire Taiwanese semiconductor packaging and testing supply chain. Founding a business is not easy, but  conserving what has been established is even more difficult. ASE's management team deeply believes that simply maintaining the status quo and reaping the fruit of our predecessor's labor is not a currently acceptable option.

Based on our determination for sustained operation in Taiwan, as well as our promise to look after the families of tens of thousands of Taiwanese employees, ASE chose to take the first step in integration.  We also hoped our tender offer could stimulate the industry's integration, generate complementary synergy, and help the future development of the Taiwanese semiconductor industry reach a new high point in terms of enhanced efficiency, economic scale, and depth of research and development and innovation. Even though the process of integration has its challenges and difficulties, building on past success is our joint responsibility and society's expectation. ASE sincerely hopes that SPIL and ASE can jointly create the glory of Taiwan, so that a brighter day may soon arrive for the next generation of the Taiwanese semiconductor packaging and testing industry.


Wednesday, February 24, 2016

Acquisition Activity

TAIPEI, Taiwan, R.O.C., Feb. 24, 2016 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TWSE Code: 2311, NYSE Code: ASX) ("ASE") received today the decision made by the Taiwan Fair Trade Commission ("FTC") to extend the review period of the proposed acquisition of shares of Siliconware Precision Industries Co., Ltd. ("SPIL") by ASE ("the Tender Offer").

To accommodate the FTC review period for the Tender Offer, ASE previously filed and publicly announced on February 4, 2016 that in accordance with laws, the expiration date of the Tender Offer has been extended from February 16, 2016 to March 17, 2016. ASE trusts that the FTC will review the Tender Offer and make its final decision before March 17, 2016, in order to protect the interests of investors and all SPIL shareholders participating in the Tender Offer.


Friday, January 29, 2016

Comments & Business Outlook

Fourth Quarter 2015 Financial Results

  • Net revenue contribution from packaging operations, testing operations, EMS operations, substrates sold to third parties and others, each represented approximately 39%, 8%, 52%, 1% and 0%, respectively, of total net revenues for the quarter.
  • Our 4Q15 basic earnings per share of NT$0.62 (or US$0.095 per ADS) were based on 7,642,022,605 weighted average number of shares outstanding in 4Q15. Our 4Q15 diluted earnings per share of NT$0.60 (or US$0.092 per ADS) were based on 7,839,691,884 weighted average number of shares outstanding in 4Q15.

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the first quarter of 2016 to be as follows:

IC ATM capacity should stay flat and blended utilization rate should be down high single digits sequentially;
IC ATM gross margin should be approaching 1Q14 levels;
EMS business should decline moderately on a year-over-year basis;
EMS gross margin should decline slightly quarter-over-quarter.


Thursday, January 7, 2016

Comments & Business Outlook

TAIPEI, Taiwan, Jan. 7, 2016 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for December and 4th quarter of 2015.

CONSOLIDATED NET REVENUES (UNAUDITED)


Dec

Nov

Dec

Sequential

YoY

(NT$ Million) 

2015

2015

2014

Change 

Change

Net Revenues 

21,529

26,267

24,873

-18.0%

-13.4%








Dec 

Nov 

Dec 

Sequential 

YoY

(US$ Million) 

2015

2015

2014

Change 

Change

Net Revenues 

660

810

801

-18.5%

-17.5%








Q4 

Q3 

Q4 

Sequential 

YoY

(NT$ Million) 

2015

2015

2014

Change 

Change

Net Revenues 

75,548

72,870

76,645

+3.7%

-1.4%








Q4 

Q3 

Q4 

Sequential 

YoY

(US$ Million) 

2015

2015

2014

Change 

Change

Net Revenues 

2,321

2,295

2,505

+1.1%

-7.3%

Net revenues for the ATM assembly testing and material business are as follows:

ATM NET REVENUES (UNAUDITED)


Dec 

Nov 

Dec 

Sequential 

YoY

(NT$ Million) 

2015

2015

2014

Change 

Change

Net Revenues 

12,449

12,707

14,163

-2.0%

-12.1%








Dec 

Nov 

Dec 

Sequential 

YoY

(US$ Million) 

2015

2015

2014

Change 

Change

Net Revenues 

382

392

456

-2.5%

-16.3%








Q4 

Q3 

Q4 

Sequential 

YoY

(NT$ Million) 

2015

2015

2014

Change 

Change

Net Revenues 

38,406

39,862

43,884

-3.7%

-12.5%








Q4 

Q3 

Q4 

Sequential 

YoY

(US$ Million) 

2015

2015

2014

Change 

Change

Net Revenues 

1,180

1,258

1,434

-6.2%

-17.7%


Thursday, January 7, 2016

Acquisition Activity

TAICHUNG, Taiwan, Jan. 7, 2016 /PRNewswire/ -- Siliconware Precision Industries Co., Ltd. (TWSE: 2325, NASDAQ: SPIL) (the "Company") has separately convened a Review Committee meeting and Board of Directors meeting in accordance with the Regulations Governing Public Tender Offers for Securities of Public Companies to review the tender offer of the Company's common shares and/or ADRs by Advanced Semiconductor Engineering, Inc. (TWSE: 2311, NYSE: ASX) ("ASE").

The Review Committee's and the Board of Director's review conclusions and recommendations are as follows:

1.      ASE's second tender offer price is not reasonable

ASE proposed to offer NT$55 per common share in cash to acquire the Company's common shares, with a maximum number of 770,000,000 shares (including common shares represented by ADRs) and a minimum number of 155,818,056 shares (not including common shares represented by ADRs). Taking into consideration the Company's operations, share market price, earnings per share, net value per share, future development, distributed earnings in recent years and an independent expert's opinion to the reasonableness of the tender offer price, the tender offer price is not reasonable.

(1)   The tender offer price does not reach the reasonable transaction price range

Independent expert CPA Wei-Lin Chen of Dingshuo accounting firm has produced a reasonability opinion determining that the reasonable transaction price range should be NT$56.33 to NT$68.60 per share. Additionally, CPA Samuel Lu of Diwan & Company accounting firm has produced a reasonability opinion determining that the reasonable transaction price range should be NT$58.32 to NT$63.44 per share. However, the tender offer price proposed by ASE of NT$55 per common share is lower than the reasonable transaction price ranges suggested by the aforesaid both independent experts. Thus, ASE's tender offer price is not reasonable.

(2)   Comparison of ASE's tender offer price to the price offered by the Company's private placement subscriber

ASE's tender offer price of NT$55 per share while the price offered by Company's private placement subscriber is also NT$55 per share. Comparing the control rights and liquidity of the two cases, ASE should pay a higher price premium, and thus should reasonably offer a higher price.

2.      Global Anti-Trust Filing Doubts

(1)   Filing Completeness

In view of ASE's tender offer prospectus not disclosing whether ASE has completed a thorough evaluation nor whether ASE has made filings with the competent authorities in foreign countries and jurisdictions, ASE needs to provide more information in order to resolve such doubts.

(2)   Without obtaining approval, there is risk that the shares sold cannot be delivered

The time the Taiwan Fair Trade Commission and anti-trust authorities in other countries or jurisdictions takes to review anti-trust cases vary. If ASE is unable to obtain the approval of anti-trust authorities during the tender offer period, there is risk that the selling shareholders' shares cannot be delivered. Unless the competent authority for tender offers (the Financial Supervisory Commission) officially and clearly states that the tender offer can proceed and be completed even without obtaining approval, the relevant risks remain.

3.      Recommendation to the Shareholders

Before the aforementioned doubts are completely clarified, the Review Committee and the Board of Directors believe that such risks still exist and thus take a reserved attitude toward whether the shareholders of the Company should participate in the present tender offer. However, the shareholders of the Company should still consider the aforementioned explanations and closely review the tender offer announcement and tender offer prospectus issued by ASE, including the relevant risks associated with participating and not participating noted in the tender offer prospectus, to decide individually whether to participate in the tender offer.


Monday, December 28, 2015

Acquisition Activity

TAICHUNG, Taiwan, Dec. 28, 2015 /PRNewswire/ -- Siliconware Precision Industries Co., Ltd. (TWSE: 2325, NASDAL: SPIL) (the "Company") held a board meeting this morning to discuss the letter from Advance Semiconductor Engineering Inc. ("ASE"), datedDecember 14, 2015 (the "ASE Letter"), and has resolved to clarify and respond to the ASE Letter as follows:

  1. With regard to the ASE Letter's accusations that the Company's management has always held a hostile attitude towards ASE's investment proposal and that the Company has not used a more reasonable attitude to carefully consider all the possibilities of cooperation with ASE, the Company hereby emphasizes again that it has never opposed amicable industry consolidation that are beneficial for the development of the Taiwan semiconductor industry. On the contrary, the Company opposes hostile plundering takeovers, because it may possibly be detrimental to the Taiwan semiconductor industry. ASE was the party that commenced the hostile takeover, while the Company has never, from the beginning, maintained hostility towards ASE. However, the Company and ASE have not been able to communicate mainly because ASE has said it is making a financial investment but in fact has tried to seize management control instead. ASE has also completely ignored the Company's repeated request for ASE to pledge not to interfere with management, resulting in a lack of trust between the parties.
  2. ASE has eventually publicly admitted and proposed on December 14 and December 22 that the acquisition of 100% of the shares of the Company and management control is ASE's ultimate goal. If ASE immediately ceases its second hostile tender offer to demonstrate good will, the Company is willing to proceed with evaluation and negotiation of ASE's proposal to use a share swap, with cash as consideration, to acquire 100% of the shares of the Company (the "ASE Acquisition Proposal").
  3. Since the ASE Acquisition Proposal will materially impact the Company's future operations, the Company's board will need to take into consideration the best interests of employees, shareholders, and customers, as well as the future development of the Company and other facets when evaluating the proposal in its entirety. Therefore, it is necessary to collect sufficient information, clarify relevant questions, or engage experts to assist in the providing of opinions. Prior to further evaluation of the proposal, ASE is requested to provide concrete responses to the points below: 

    1. Protect the rights and interests of the Company's Employees
      ASE's proposal requires that all of the Company's shareholders receive cash and transfer their shares to ASE. In this case, the Company will need to delist, so how can the rights of the Company's employees and management team after delisting be safeguarded? Can ASE please detail a concrete proposal for subsequent safeguarding of the rights of the Company's employees.
    2. Protect Shareholders' Equity Interests
      ASE proposes to uses NT$55 per share to acquire 100% of the Company's equity interest. What is the basis for determining this price? When compared to the present price for a private placement that will not interfere with the Company's management, ASE's proposed price to acquire 100% of the Company's equity interest and management control is actually comparably low. Can ASE please further explain on this, in order to facilitate the various parties' evaluation on the reasonability of ASE's proposed price.
    3. Comply with the Anti-trust Laws in Main Markets Worldwide
      ASE has to voluntarily notify its proposal to acquire 100% of the Company's equity interests and management control with the competition regulatory authorities in global main markets and obtain the approvals. 

      The combination of both leading companies in the IC packaging and testing industry has already caused customers' concerns that the combination will result in disorder of market competition and seriously impact industrial supply and the whole economic benefits.

The Company requests ASE to respond to the abovementioned concerns in written form to the Company by January 4, 2016, so that the Company may evaluate and start further negotiations.


Tuesday, December 22, 2015

Acquisition Activity

TAIPEI, Taiwan, Dec. 22, 2015 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TWSE Code: 2311, NYSE Code: ASX) ("ASE") announced today that it plans to commence on December 29, 2015 concurrent tender offers in the Republic of China (the "ROC Offer") and in the United States (the "U.S. Offer," and together with the ROC Offer, the "Tender Offer") for common shares, including those represented by American depositary shares ("ADSs"), of Siliconware Precision Industries Co., Ltd. ("SPIL") at a price ofNT$55 per common share and NT$275 per ADS, respectively. ASE plans to acquire an estimated maximum number of 770,000,000 common shares of SPIL (including common shares represented by ADSs), equivalent to approximately 24.71% of the issued and outstanding common shares of SPIL. 

The ROC Offer will commence at 9:00 a.m., Taiwan time, on December 29, 2015 and expire at 3:30 p.m., Taiwan time, on February 16, 2016. The U.S. Offer will commence at 12:00 a.m., New York City time, on December 29, 2015 and expire at 1:30 a.m., New York Citytime, on February 16, 2016.

On October 1, 2015, ASE acquired 24.99% equity interest in SPIL through tender offers for a consideration of NT$35.2 billion to establish the basis and opportunity for exploration of possible avenues of cooperation between the two companies. However, after ASE acquired its 24.99% equity interest in SPIL, SPIL's management has acted with animosity towards ASE and continuously disregarded ASE's proposals to engage in discussions on potential cooperation, and has taken various actions that are ill-advised from a corporate governance perspective. For example, SPIL commenced baseless litigation alleging that ASE does not have the right to be recorded in SPIL's shareholder register for the shares ASE lawfully acquired and paid for on October 1, 2015; and on December 11, 2015, SPIL announced yet another defensive measure under which SPIL would issue a large number of new shares to a third party through private placement (the "Third Party Deal"), another highly dilutive transaction which brings no cash value to SPIL shareholders.

ASE believes that the Third Party Deal is not in the best interests of SPIL shareholders. In order to protect its investment in SPIL, ASE submitted a proposal to SPIL's board of directors (the "SPIL Board") on December 14, 2015 to acquire 100% of SPIL's shares forNT$55 per common share in cash. However, ASE understands that the SPIL Board has not responded by December 21, 2015. ASE believes that at its existing ownership level, it will continue to face similar defensive measures from SPIL thereby eliminating any realistic possibility of a cooperative dialogue between the parties, and that this inherently unstable situation will have an adverse effect on the interests of ASE's and SPIL's shareholders.

As a result, in order to protect ASE's investment in SPIL, ASE plans to launch this Tender Offer for the purpose of increasing its shareholding in SPIL to approximately 49.71%. Furthermore, subject to the conditions that (1) SPIL shareholders, at the extraordinary general meeting to be held on January 28, 2016 (the "EGM"), do not approve the proposals required for the Third Party Deal  (the "amendments to the Articles of Association proposal" and "the proposals to commence a private placement") or (2) the SPIL Board terminates the Third Party Deal in accordance with its terms or applicable laws before January 28, 2016and revokes its resolution for convening the EGM for the shareholders to vote on the "amendments to the Articles of Association proposal" and "the proposals to commence a private placement," ASE intends to ultimately seek to acquire 100% of the common shares and ADSs of SPIL by seeking to discharge the SPIL Board at one or more shareholders' meetings or await the expiration of the current Board's term, and elect new nominees to the SPIL Board; if after such election, one half or more of the SPIL Board is composed of candidates nominated or designated by ASE, ASE intends to, in accordance with the Taiwan Mergers and Acquisitions Act, cause the SPIL Board to resolve in favor of a share exchange proposal (the "100% Acquisition") between ASE and SPIL, pursuant to which ASE shall pay all SPIL's shareholders a consideration of NT$55 per share (or NT$275 per ADS) and acquire 100% of the outstanding equity interest of SPIL not already owned by ASE. (Actual consideration will be subject to adjustment if SPIL issues shares or cash dividends and will also be adjusted in accordance with applicable laws, including Article 26 of the Principles on Acquisition and Disposition of Assets for Public Companies.) The consummation of the 100% Acquisition will require resolutions by ASE and SPIL in favor of a statutory share exchange under Taiwan law at their respective board and shareholders' meetings, and be subject to receipt of all requisite competition, antitrust or other government approvals in Taiwan or other jurisdictions. Upon the completion of the 100% Acquisition, SPIL will become ASE's direct and 100%-owned subsidiary.

After the completion of this Tender Offer, ASE reserves the right to increase or decrease its shares in SPIL, exercise its right as a SPIL shareholder, or take one or more actions to enforce and protect its interest in SPIL and/or to enhance its control in SPIL.


Monday, December 14, 2015

Acquisition Activity

TAIPEI, Taiwan, December 14, 2015 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX stock code: 2311; NYSE: ASX) ("ASE" or "we") today announced that its board of directors has approved and submitted a proposal (the "Proposal") to Siliconware Precision Industries Co., Ltd. ("SPIL") to acquire all SPIL shares for cash, to be effected through an agreed statutory share exchange transaction under Taiwan law between ASE and SPIL on customary terms and conditions (including closing conditions) (please see below for the full text of the letter that ASE sent to the board of directors of SPIL). The terms and conditions of our Proposal are as follows:

  • Price: NT$55 per common share (or NT$275 per American depositary share).
  • Acquisition amount and legal entity name: all shares of SPIL not otherwise owned by ASE. If the transaction is consummated, SPIL will become a wholly-owned subsidiary of ASE. ASE will maintain SPIL's separate legal entity status and retain SPIL's legal entity name.
  • All directors and management of SPIL will be retained and their current compensation and benefits maintained.
  • SPIL's current employee policies will be observed and all SPIL employees will be retained to ensure the protection of their labor rights.
  • SPIL must terminate or cancel the Tsinghua Deal (as defined below) in accordance with its terms or applicable laws (and terminate any other transaction that will dilute SPIL's shares or other similar transactions).

ASE's investment in SPIL was based on our sincere belief in the need for Taiwan's semiconductor packaging and testing industry players to actively seek opportunities for cooperation and resource consolidation to maintain and further improve the competitive strength of Taiwan's semiconductor packaging and testing industry in the face of intensified global competition and emerging competitors. Therefore, we hoped that our investment in SPIL would have promoted the cooperation between both companies and set an excellent example in Taiwan for productive cooperation between two exemplary companies in the face of intense competition.

However, from the time we launched the tender offer for shares of SPIL, we have noted the hostility of SPIL's management towards our investment and its refusal to reasonably consider the possibility of cooperating with ASE. We were chagrined to learn that on December 11, 2015 the board of directors of SPIL decided to enter into a share placement agreement with Tsinghua Unigroup Ltd. ("Tsinghua"), pursuant to which SPIL will issue 1,033 million common shares to a subsidiary of Tsinghua for NT$55 per share (the "Tsinghua Deal"), contemplating a defensive and highly dilutive transaction that brings no cash to its shareholders.

As ASE is deeply committed both to preserving and creating shareholder value at SPIL, and in order to protect our investment in SPIL, we are left with no choice but submit the Proposal to SPIL for the parties to enter into an agreed statutory share exchange agreement pursuant to Taiwan law on customary terms and conditions (including closing conditions), under which we will acquire 100% equity interest in SPIL for cash.

We have asked that SPIL review our Proposal and send us a written response no later than December 21, 2015 to confirm whether SPIL is willing to discuss as soon as possible a 100% share exchange transaction in accordance with our Proposal. If SPIL agrees, the contemplated 100% share exchange transaction will be implemented pursuant to the Taiwan Mergers and Acquisitions Act and applicable regulations, and will be subject to the parties' execution and delivery of a share exchange agreement, approval from both ASE's and SPIL's shareholders meetings, clearance from the relevant regulatory authorities and other customary closing conditions.

We believe that our Proposal provides an attractive and immediate cash value to SPIL shareholders while preserving the rights and entitlements of SPIL's management and employees.

The key highlights of our Proposal include:

  • Premium valuation: Our Proposal represents a 20.88% premium over the closing price of SPIL common shares on December 11, 2015 and a 27.91% premium over the average closing price of common shares of SPIL for the 60-business day period ending December 11, 2015.
  • Cash value for SPIL shareholders: The Tsinghua Deal not only does not provide any cash to SPIL's shareholders, but will also significantly dilute the equity interests of SPIL's shareholders. (If SPIL issues 1,033 million new shares to Tsinghua, the additional shares issued will amount to approximately 33% of the current pre-money total outstanding share capital of SPIL.) In contrast, our Proposal is for an all cash offer that would provide immediate and certain cash value to SPIL's shareholders.
  • Beneficial for SPIL management and employees: ASE intends to continue to be subject to all previous personnel regulations, employee compensation and employee benefits in order to protect the rights and interests of employees.

We are deeply committed both to preserving and creating shareholder value at SPIL and we believe that our Proposal provides compelling value to SPIL shareholders.

***

Below is the full text of the letter that ASE sent to the board of directors of SPIL today.

December 14, 2015

The Board of Directors
Siliconware Precision Industries Co., Ltd.

No. 123, Section 3, Da Fong Rd.
Tanzi District, Taichung, Taiwan, R.O.C.

To All Directors of SPIL:

On October 1, 2015, Advanced Semiconductor Engineering, Inc. ("ASE," "we" or "the Company") acquired 779,000,000 common shares ("Common Shares"), including those represented by American depositary shares ("ADSs"), of Siliconware Precision Industries Co., Ltd. ("SPIL") through concurrent tender offers in Taiwan and in the United States (the "Tender Offer"), thereby becoming a shareholder of SPIL, holding approximately 24.99% of the issued and outstanding share capital of SPIL.

ASE and SPIL were both established in 1984. Over the past 30 years, ASE and SPIL worked tirelessly to build the foundation of Taiwan's semiconductor industry. Both ASE and SPIL have experienced the numerous ups and downs of Taiwan's semiconductor industry, faced challenges from around the world and prevailed over difficulties to establish Taiwan's leading position in the global semiconductor industry. These events flashed by and it seems as if the huge changes in the industry only happened yesterday. Only those who have participated can truly appreciate this achievement. In this age of intensified global competition and emerging competitors, we hope that with all our efforts, and with the support and assistance from Taiwan's government, Taiwan will continue to be a leading force in the intensely competitive environment of the global semiconductor industry.

ASE's investment in SPIL was based on our sincere belief in the need for Taiwan's semiconductor packaging and testing industry players to actively seek opportunities for cooperation and resource consolidation to maintain and further improve the competitive strength of Taiwan's semiconductor packaging and testing industry in the face of intensified global competition and emerging competitors. Therefore, we greatly value our investment in SPIL and hoped that this investment would have promoted the cooperation between both companies, as well as set an excellent example in Taiwan for productive cooperation between two exemplary companies in the face of intense competition.

However, from the time we launched the Tender Offer we have noted the hostility of SPIL's management towards our investment and its refusal to reasonably consider the possibility of cooperating with ASE. For example:

  • SPIL attempted to implement a cashless and highly dilutive share swap with a third party at an extremely low implied price - a maneuver that was not approved at SPIL's shareholders' meeting;
  • SPIL commenced baseless litigation against ASE, attempting to invalidate the Tender Offer and alleging that ASE does not have the right to be recorded in SPIL's shareholder register for the shares it acquired in the Tender Offer for consideration of approximately NT$35.2 billion, and publicly denied that ASE is a lawful shareholder of SPIL;
  • SPIL has on multiple occasions questioned in the harshest terms ASE's good faith to seek avenues of cooperation;
  • The financial press has reported repeatedly that SPIL is putting in place defensive measures to disadvantage ASE, SPIL's largest shareholder; and
  • SPIL's employees have repeatedly and publicly made unfounded speculations about ASE and the lawful Tender Offer, even organizing a 3,000-person protest intended to generate public hostility against us; SPIL's management has at no point refuted such actions or statements made by its employees.

Even so, we have not maliciously criticized SPIL and its management, but repeatedly sought dialogue with SPIL on an equal and mutually beneficial basis. Unfortunately, we have failed to reach any consensus. We were further chagrined to learn that on December 11, 2015 the board of directors of SPIL decided to enter into a share subscription agreement with Tsinghua Unigroup Ltd. ("Tsinghua"), pursuant to which SPIL will issue 1,033 million Common Shares to a subsidiary of Tsinghua for NT$55 per share (the "Tsinghua Deal"), contemplating a defensive and highly dilutive transaction that brings no cash to its shareholders.

As ASE is deeply committed both to preserving and creating shareholder value at SPIL, and in order to protect our investment in SPIL, we are left with no choice but to propose to enter into an agreed statutory share exchange agreement between ASE and SPIL on customary terms and conditions (including closing conditions), under which we will acquire 100% equity interest in SPIL for cash. The terms and conditions of our proposal (the "ASE Acquisition Proposal") are as follows:

  • Price: NT$55 per Common Share (or NT$275 per ADS).
  • Acquisition amount and legal entity name: all shares of SPIL not otherwise owned by ASE. If the transaction is consummated, SPIL will become a wholly-owned subsidiary of ASE. ASE will maintain SPIL's separate legal entity status and retain SPIL's legal entity name.
  • All directors and management of SPIL will be retained and their current compensation and benefits maintained.
  • SPIL's current employee policies will be observed and all SPIL employees will be retained to ensure the protection of their labor rights.
  • SPIL must terminate or cancel the Tsinghua Deal in accordance with its terms or applicable laws (and terminate any other transaction that will dilute SPIL's shares or other similar transactions).

We urge that SPIL review the ASE Acquisition Proposal and send us a written response no later than December 21, 2015 confirming whether SPIL is willing to discuss as soon as possible a 100% share exchange transaction in accordance with the aforementioned ASE Acquisition Proposal. If SPIL agrees with the ASE Acquisition Proposal, the contemplated 100% share exchange transaction will be implemented pursuant to the Taiwan Mergers and Acquisitions Act and applicable regulations, and will be subject to the parties' execution and delivery of a share exchange agreement, approval at both ASE's and SPIL's shareholders meetings, clearance from the relevant regulatory authorities and other customary closing conditions.

Unlike the Tsinghua Deal, the ASE Acquisition Proposal will bring a cash value to all SPIL shareholders. The Tsinghua Deal not only does not provide any cash to SPIL's shareholders, but will also significantly dilute the equity interests of SPIL's shareholders. (If SPIL issues 1,033 million new shares to Tsinghua, the additional shares issued will amount to approximately 33% of the current pre-money total outstanding share capital of SPIL.)

We once again sincerely urge that all members of the board of directors of SPIL uphold their fiduciary duties, and, keeping in mind the interests of all of SPIL's shareholders, carefully review the details and conditions of the ASE Acquisition Proposal. We trust that the board of directors of SPIL will take a broader perspective and seriously consider the future of Taiwan's semiconductor packaging and testing industry, taking into account both companies' endeavors in Taiwan's semiconductor industry for over 30 years, when considering the ASE Acquisition Proposal.

Advanced Semiconductor Engineering, Inc.


Monday, December 7, 2015

Comments & Business Outlook

TAIPEI, Taiwan, Dec. 7, 2015 /PRNewswire/ -- ADVANCED SEMICONDUCTOR ENGINEERING, INC. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for November 2015.

CONSOLIDATED NET REVENUES (UNAUDITED)

(NT$ Million)   

Nov
2015    

Oct
2015  

Nov
2014  

Sequential
Change 

YoY
Change

Net Revenues 

26,267

27,752

25,250

-5.4%

+4.0%







(US$ Million)  

Nov
2015     

Oct
2015   

Nov
2014  

Sequential
Change 

YoY
Change

Net Revenues 

810

851

829

-4.8%

-2.3%

Net revenues for the ATM assembly testing and material business are as follows:

ATM NET REVENUES (UNAUDITED)                                                     

(NT$ Million)  

Nov 
2015 

Oct
2015 

Nov
2014 

Sequential
Change  

YoY
Change

Net Revenues  

12,707

13,250

14,469

-4.1%

-12.2%







(US$ Million) 

Nov
2015 

Oct
2015 

Nov
2014 

Sequential
Change 

YoY
Change

Net Revenues 

392

406

475

-3.6%

-17.5%


Tuesday, December 1, 2015

Comments & Business Outlook

TAIPEI, Taiwan--(BUSINESS WIRE)--

Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX), the world�s largest semiconductor assembly and test service provider, today announced that it has been certified by the Ministry of Economic Affairs, Bureau of Foreign Trade (BOFT) as a qualified Internal Compliance Program (ICP) exporter. The certification is valid for 3 years and allows ASE to apply for multiple export permits for strategic high tech goods.

Violation of any export control regulation often results in hefty fines, significant business disruptions and serious damages to a company�s reputation. As such, compliance to complex trade regulations is a strategic and operational imperative of ASE�s export business. ASE, with assistance from the BOFT, has developed and implemented internal compliance programs to reduce the risks of export control violation through employee training and policies that manage the flow of goods from the quotation stage, order processing to order fulfilment. Frequent audits by professional third party companies and self-assessment are conducted to ensure the integrity and robustness of ASE�s compliance measures.

ASE has also recently received the ISO 15408-EAL6 certification, a globally recognized standard that endorses a company for its capability to manage high security semiconductor products. Together with the ICP certification, ASE�s customers would benefit from the ease of goods flow, a secure production process to a shortened time to market. The ISO 15408-EAL6 and ICP certifications elevate ASE as a global company that respects governing laws, and further strengthen the company�s competitive leadership.


Monday, November 30, 2015

Comments & Business Outlook

TAIPEI, Taiwan--(BUSINESS WIRE)--

Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX), the world�s largest semiconductor assembly and test service provider, today announced that 6 of its production facilities in Nantze, Kaohsiung; K4, K7, K8, K10, K11 and K12, have received the ISO 15408-EAL6 certification, becoming the first outsourced semiconductor assembly and test (OSAT) services company to achieve this significant recognition. The ISO 15408-EAL6 certificate is an international standard for IT product security certification. The certification received by ASE was issued by the German Government�s Federal Office for IT Security (Bundesamt f�r Sicherheit in der Informationstechnik, BSI) which is the central IT security service provider for the German federal government. BSI also offers its services to private and commercial users of information technology.

ISO 15408-EAL6 is a framework that outlines the criteria for globally recognized standards and security inspections for IT products. It is designed for products and applications that are targeted for high security-intensive markets, such as the government, banking or defense sectors. �Effective security is only possible when everyone involved is vigilant and trained to guard against any potential risks, which is why ASE invested time, financial and human resources into IT security,� said Dr Tien Wu, COO, ASE. �With the ISO 15408-EAL6 certification, customers at ASE can be safely assured that their intellectual property (IP) are well protected, their products and information data are handled with a high degree of sensitivity and are processed within the highest level of security at ASE�s facilities,� Dr Wu added. ISO 15408-EAL6 certification will greatly benefit customers and ASE as both parties would be able to shorten the time needed to verify product security and thus, enable customers� products to reach their intended markets quickly.

As part of the certification effort, ASE invested NTD6.5 million to completely revamp its workplace security access systems. ASE engaged MiTAC Information Technology Corp and TLJ Intertech Inc to design and create secure access management programs, new proximity badges with smart chips for more than 25,000 employees and visitors, and card readers in various parts of the ASE facilities in the Kaohsiung Nantze campus. These new measures will help identify, secure and provide a systematic level of traceability in the movement of people and goods inside and around the ASE facilities. The secure access management system is already implemented at ASE Kaohsiung Nantze campus and is planned to be adopted in gradual stages by ASE�s global sites in parallel with ISO 15408 certification plans.


Thursday, October 29, 2015

Comments & Business Outlook

Third Quarter 2015 Financial Results

Net revenues[1] of NT$72,870 million for the third quarter of 2015 (3Q15), up by 9% year-over-year and up by 4% sequentially

Diluted earnings per share for the quarter were NT$0.69 (or US$0.109 per ADS), compared to diluted earnings per share of NT$0.82 for 3Q14 and NT$0.43 for 2Q15.

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the fourth quarter of 2015 to be as follows:

  • IC ATM capacity should stay flat and blended utilization should be down 4-6% sequentially;
  • IC ATM gross margin should resemble 1Q15 level;
  • EMS capacity should stay flat and blended loading should be up mid-teen percentage sequentially;
  • EMS gross margin should approach 2Q15 level.

Friday, October 16, 2015

Legal Insights

TAICHUNG, Oct. 15, 2015 /PRNewswire/ -- Siliconware Precision Industries Co. Ltd. (TWSE: 2325, NASDAQ: SPIL) (the "Company") filed a civil lawsuit against Advanced Semiconductor Engineering, Inc. (TWSE 2311, NYSE: ASX) ("ASE") in ASE's domicile at the Kaohsiung District Court at 9:30 AM on October 15, 2015, requesting the court to confirm ASE does not have the right to request registration as a shareholder in the Company's shareholder register.

ASE conducted a tender offer of the Company's issued common shares and American Depositary Receipts between August 24 and September 22, 2015, claiming in its tender offer prospectus and at numerous public occasions that its tender offer was a "purely financial investment". However, ASE, both during the tender offer period and after its completion, has acted with a competitor's mindset, repeatedly criticizing the Company's proposed strategic alliance with Hon Hai Precision Industry Co., Ltd. and aggressively intervening in the Company's business operations, even clearly stating in its lawsuit that the proposed strategic alliance will affect the number of the Company's board of director seats it can obtain. These various actions reveal ASE's "financial investment" was in name only, when in actuality ASE is attempting to directly and indirectly control the Company's business operations. SPIL believes ASE's tender offer prospectus was a sham, concealing the true purpose of ASE's tender offer, thereby ASE's tender offer violated the Securities and Exchange Act, Fair Trade Act and other related regulations and breaching public order, and thus should be invalid.

The Company, in order to protect the rights of Company and all its shareholders, is appealing to the court to right the injustice of ASE's tender offer. Once the court issues a judgment in this case, the Company shall lawfully proceed with all procedures.


Monday, October 5, 2015

Company Rebuttal

TAICHUNG, Taiwan, Oct. 3, 2015 /PRNewswire/ -- Siliconware Precision Industries Co., Ltd. (TWSE: 2325, NASDAQ: SPIL) (the "Company") has formally received a Preliminary Injunction Petition on yesterdayafternoon from the Taichung District Court (Year 2015 No. 101) (the "Petition") filed by Advanced Semiconductor Engineering Inc. (TWSE: 2311, NYSE: ASX) ("ASE") seeking to enjoin the convening onOctober 15, 2015 of an extraordinary shareholders' meeting of the Company.

Since receiving the Petition, the Company has convened internal meetings and had discussions with outside counsels, and will duly file a response to the Petition to the court in accordance with law.

The Company regrets that ASE, which has repeatedly claimed that it is making a "financial investment" in the Company, and who is not yet a formally registered shareholder of the Company, abruptly seeks to prevent the Company from holding the extraordinary shareholders' meeting. ASE is obstructing the opportunity all shareholders of the Company to attend and express their views at the extraordinary shareholders' meeting. ASE had made numerous public statements urging shareholders of the Company to attend the extraordinary shareholders' meeting on October 15, 2015, but now ASE seeks to prevent the Company from calling this meeting on October 15, 2015. ASE's positions are apparently contradictory.

The Company will in accordance with the law protect our shareholders' attendance of the lawfully-convened extraordinary shareholders' meeting, and concurrently urges our shareholders to attend the extraordinary shareholders' meeting on October 15, 2015, and support the Company's proposals.   


Monday, October 5, 2015

Legal Insights

TAICHUNG, Taiwan, October 3, 2015 /PRNewswire/ -- Siliconware Precision Industries Co., Ltd. (TWSE: 2325, NASDAQ: SPIL) (the "Company") has formally received a Preliminary Injunction Petition on yesterday afternoon from the Taichung District Court (Year 2015 No. 101) (the "Petition") filed by Advanced Semiconductor Engineering Inc. (TWSE: 2311, NYSE: ASX) ("ASE") seeking to enjoin the convening on October 15, 2015 of an extraordinary shareholders' meeting of the Company.

Since receiving the Petition, the Company has convened internal meetings and had discussions with outside counsels, and will duly file a response to the Petition to the court in accordance with law.

The Company regrets that ASE, which has repeatedly claimed that it is making a "financial investment" in the Company, and who is not yet a formally registered shareholder of the Company, abruptly seeks to prevent the Company from holding the extraordinary shareholders' meeting. ASE is obstructing the opportunity all shareholders of the Company to attend and express their views at the extraordinary shareholders' meeting. ASE had made numerous public statements urging shareholders of the Company to attend the extraordinary shareholders' meeting on October 15, 2015, but now ASE seeks to prevent the Company from calling this meeting on October 15, 2015. ASE's positions are apparently contradictory.

The Company will in accordance with the law protect our shareholders' attendance of the lawfully-convened extraordinary shareholders' meeting, and concurrently urges our shareholders to attend the extraordinary shareholders' meeting on October 15, 2015, and support the Company's proposals.


Thursday, October 1, 2015

Comments & Business Outlook

TAIPEI, Taiwan, Oct. 1, 2015 /PRNewswire/ --

To the Honorable Shareholders of Siliconware Precision Industries Co., Ltd.:

We would like to report the successful results of our tender offer (the "Tender Offer") for common shares (the "Common Shares") and American depositary shares (the "ADSs") of Siliconware Precision Industries Co., Ltd ("SPIL"). The aggregate number of shares validly tendered and not withdrawn in our Tender Offer represented approximately 36.83% of the issued and outstanding share capital of SPIL, which far exceeded the offer cap of approximately 24.99% of the issued and outstanding share capital of SPIL. We would like to express our sincere gratitude for the support we received from those of you who participated in our Tender Offer. The results of our Tender Offer provide a market view affirming that our price was a fair one, and also affirm our original belief that the market sees the compelling rationale for our investment and the future collaboration between SPIL and ASE, in a manner consistent with all applicable laws and taking into account the rights and interests of SPIL's shareholders and employees.

Unfortunately, SPIL announced that it planned to form a strategic alliance with Hon Hai Precision Industry Co., Ltd. ("Hon Hai") by issuing to Hon Hai new Common Shares through a share exchange (the "Hon Hai Share Exchange") and called an extraordinary shareholders' meeting ("EGM") to consider (i) the proposed amendments to SPIL's Articles of Incorporation (e.g., the increase in SPIL's authorized share capital) (the "AOIs Amendment") and (ii) the proposed amendments to SPIL's Procedures for Acquisition and Disposal of Assets (the "Acquisition and Disposition Procedures Amendment"). As indicated in our open letter to SPIL shareholders dated September 28, 2015, as a shareholder of SPIL, we believe that the Hon Hai Share Exchange and the EGM proposals are detrimental to the rights and interests of shareholders.

First, the reasonableness of the implied price of SPIL's shares to be issued in the Hon Hai Share Exchange is highly questionable. The implied price of SPIL's shares to be issued in the Hon Hai Share Exchange (NT$35.85[1]) is not only below our Tender Offer price (NT$45.00), but also significantly below the bottom end of the value (NT$48.91) determined by SPIL's independent appraiser in a fairness report issued on August 28, 2015. The implied price of SPIL's shares to be issued in the Hon Hai Share Exchange is also lower than SPIL's share price on the date SPIL first announced the proposed Hon Hai Share Exchange(NT$39.50).

Second, in practice, there are various ways for companies to enter into strategic alliances that do not involve diluting their shareholders. Why did SPIL have to issue a large amount of new shares at a deep discount solely for the purpose of entering into a strategic alliance? The Hon Hai Share Exchange will not bring any cash to SPIL or SPIL shareholders. Instead, it allows Hon Hai to become SPIL's largest shareholder through SPIL's issuance of new shares amounting to approximately 21.24% of its share capital under Article 156 of the Company Act of the Republic of China. The Hon Hai Share Exchange, if consummated, will be dilutive to ALL SPIL shareholders equally. It is questionable whether the Hon Hai Share Exchange is in the best interests of SPIL, or is consistent with the general principle of "proportionality" under civil law.

Third, SPIL intentionally disenfranchised ASE (a major shareholder holding 24.99% of outstanding and issued share capital of SPIL) and deprived ASE of the opportunity to voice a view to SPIL shareholders and to protect the interests of shareholders. It is evident from these actions that SPIL's management team did not seriously take into account the interests of all shareholders. For example, shortly after entering into a non-binding letter of intent for the strategic alliance with Hon Hai, SPIL chose a meeting date of October 15 for the EGM, and selected September 16 as the first day for the book closure period of the EGM for SPIL's shares (as such, the record date for the EGM is September 15). This approach was designed to disenfranchise ASE, which will not be able to vote its 24.99% stake in SPIL. SPIL's Board of Directors has failed to take into account the rights and interest of its shareholders when it evaluated the legality, necessity and appropriateness of the Hon Hai Share Exchange.

Fourth, as of today, SPIL has yet to fully disclosed the Strategic Alliance and Share Exchange Agreement as required by United States disclosure rules. How can SPIL shareholders properly exercise their voting rights at the EGM without having access to the actual content of the Strategic Alliance and Share Exchange Agreement? 

Finally, SPIL only needed to increase its authorized capital from 3.6 billion shares to approximately 4.2 billion shares to effect the Hon Hai Share Exchange (such amount is adjusted to include the shares issuable upon the conversion of SPIL's offshore convertible bonds). Why was it necessary for SPIL's Board to propose to amend its Articles of Incorporation to significantly increase its authorized capital to 5 billion shares? If SPIL shareholders approve this proposal, the Board of Directors of SPIL can, without prior approval from its shareholders, issue additional shares representing approximately 25% of the issued and outstanding shares of SPIL, which could potentially significantly dilute all shareholders up to a maximum of 60.44% of their shareholding.

We believe that the interests and rights of all SPIL shareholders should always be the top priority of SPIL's management. If you held SPIL's shares on September 15, 2015, we urge you to consider the reasons listed above, attend the EGM to exercise your shareholder rights and vote "AGAINST" the "AOIs Amendment"(to approve the increase in authorized share capital) and the "Acquisition and Disposition Procedures Amendment".

Wishing all SPIL shareholders good health and all the best, 
Advanced Semiconductor Engineering, Inc.


Wednesday, September 30, 2015

Company Rebuttal

TAIPEI, Taiwan, Sept. 30, 2015 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX stock code: 2311, NYSE: ASX) (the "Company" and "ASE") would like to make the following comments in response to a letter from Siliconware Precision Industries Co., Ltd. ("SPIL") to its shareholders dated September 28, 2015 (the "SPIL Shareholder Letter"):

1.   Was it necessary for SPIL's Board of Directors to propose to amend its Articles of Incorporation to significantly increase its authorized capital to 5 billion shares when there will already be ample headroom if SPIL increasesits authorized capital from 3.6 billion shares to approximately 4.2 billion shares to effect the proposed share exchange ("Hon Hai Share Exchange")  with Hon Hai Precision Industry Co., Ltd. ("Hon Hai") and provide for the conversion of its overseas convertible bonds issued in 2014?

SPIL's management in the SPIL Shareholder Letter claims that it intends to seek shareholders' prior approval to comply with the requirements under Article 185 of the Republic of China Company Act (the "ROC Company Act") for future "material transactions" (as defined therein) and for "most of the merger and acquisition transactions" defined under the Republic of China Enterprise Mergers and Acquisitions Act that it may enter into. However, in the exact same SPIL Shareholder Letter, SPIL reiterates in the first paragraph that the Hon Hai Share Exchange will be effectuated in accordance with Article 156, paragraph 8 of the ROC Company Act. If the extraordinary shareholders' meeting approves the increase of SPIL's authorized capital to 5 billion shares and SPIL's Board of Directors does not provide a written commitment to all shareholders that it will not issue new shares pursuant to Article 156, paragraph 8 of the ROC Company Act, SPIL's Board of Directors may, without first obtaining approval from shareholders at a shareholders' meeting, issue up to approximately 800 million additional shares to other companies. If such further issuances occur under Article 156, paragraph 8 of the ROC Company Act, not only are SPIL shareholders prevented from exercising their voting rights to vote against such extremely dilutive proposals, but SPIL shareholders and employees are also precluded from subscribing for new shares in such issuances.

Will SPIL's Board of Directors be willing to provide a written commitment, to all SPIL shareholders that before depriving them and SPIL's employees of their rights, SPIL will first obtain shareholders' approval before issuing new shares pursuant to Article 156, paragraph 8 of the ROC Company Act? Such a commitment is necessary to ensure that the rights and interests of all SPIL shareholders' are protected.

2.  If SPIL's Board of Directors truly values and respects shareholders' views, instead of asking for a free hand to issue up to an additional 800 million shares, it should have only asked for an additional 4.2 billion shares for its authorized share capital increase and seek specific approval from shareholders each time it plans to issue new shares. Seeking such massive headroom may be used as a maneuver to provide incumbent management a means to entrench themselves and continuously control SPIL's Board.

If the proposed 5 billion shares are fully issued, SPIL's Board of Directors may decide to issue the new shares through share swaps with other companies (including Hon Hai) up to approximately 52.56% of the issued and outstanding share capital of SPIL. In other words, SPIL's Board of Directors may use these additional shares in other dilutive share swap schemes similar to the Hon Hai Share Exchange, and, together with the approximately 15% stake purportedly controlled by management, SPIL's management could, with those allied companies, control up to approximately 47.02% of SPIL (calculation formula: [(3,116,361,139 x 15%) + (5,000,000,000 � 3,116,361,139)] / 5,000,000,000 = 47.02%). If such is the case, it would seriously jeopardize the ability for SPIL's shareholders to supervise and monitor SPIL's Board of Directors at shareholders' meetings.

3.  In the first paragraph of the SPIL Shareholder Letter, SPIL stated that it signed a Strategic Alliance and Share Exchange Agreement with Hon Hai on September 15, 2015. However, as of today, SPIL's management has yet to fully disclose the content of the Strategic Alliance and Share Exchange Agreement. If SPIL completes the issuance of 840.6 million new shares to Hon Hai, all SPIL shareholders' holdings (including dividends per share) will immediately be subject to significantly dilution. Given the immediate dilutive effect, how can SPIL's Board of Directors possibly live up to its long-term commitment to all SPIL shareholders?

Setting aside the questions of the fairness and the necessity of SPIL Board of Directors' hasty decision on August 28, 2015 to propose the amendment of its Articles of Incorporation to allow for the issuance of 840.6 million shares to Hon Hai at a deep discount, SPIL's Board of Directors is still unable to deny the fact that after the Hon Hai Share Exchange, SPIL shareholders' shareholding will be significantly diluted (resulting in approximately 12% EPS dilution in 2016). According to the SPIL Shareholder Letter, the strategic alliance with Hon Hai will only begin providing SPIL significant revenue and profit contribution starting from 2017, as SPIL only expects to capture a significant market share in the SiP market in 2018. Furthermore, while these self-claimed value propositions may only be tested for viability after SPIL fully discloses the full text of the Strategic Alliance and Share Exchange Agreement, it is inevitable that SPIL shareholders will suffer from the extremely destructive results from SPIL's issuance of  a large quantity  of shares to Hon Hai under the Hon Hai Share Exchange.  In light of the above, how can SPIL's management possibly fulfill its long-term commitment to all SPIL shareholders as stated in the SPIL Shareholder Letter? How will SPIL's Board of Directors be held accountable should it fail to fulfill its obligations towards all SPIL shareholders in the future?

If you held SPIL's shares on September 15, 2015, we again urge you to consider the reasons listed above and attend the EGM scheduled to be held on October 15, 2015 to exercise your shareholder rights and vote "AGAINST" the "Amendment to the Articles of Incorporation" (to approve the increase in authorized share capital) and the "Amendment to the Procedures for Acquisition and Disposition Procedures".

Advanced Semiconductor Engineering, Inc.


Wednesday, September 30, 2015

Resolution of Legal Issues

TAIPEI, Taiwan--(BUSINESS WIRE)--

Advanced Semiconductor Engineering, Inc. (TAIEX:2311) (ASX) announced today that the Taiwan High Court Kaohsiung Branch has cleared the company and its five employees of all charges related to the Violation of the Waste Disposal Act.

In the press release issued by the Taiwan High Court Kaohsiung branch today, the court has noted that on October 1, 2013 1000hrs, when an abnormal overflow of hydrochloric acid occurred, ASE had tried to neutralize the discharge by increasing the amount of caustic added to the effluent. By 2000hrs of the same day, the pH value of the effluent discharge had gradually returned to normalcy. The court was of the opinion that the October 1, 2013 discharge of wastewater over regulatory effluent limits was not a deliberate act but was a result of the lack of a well-equipped internal procedure to handle contingencies such as the hydrochloric acid overflow.

Since the incident, ASE has taken this opportunity to further strengthen its internal infrastructures and policies in the management of environmental issues including wastewater discharge processes. In April 2015, ASE began operating Taiwan�s largest state of the art wastewater processing and recycling facility at the Nantze Export Processing Zone in Kaohsiung. In its first phase, the facility is capable of processing 20,000 tons of wastewater per day and recycling 10,000 tons per day. The second phase is expected to be completed by 2017 whereby it aims to process 40,000 tons of wastewater per day and recycle almost 20,000 tons per day.

ASE is sincerely grateful that the company and its employees have been vindicated from all charges. The company continues to commit to corporate sustainability and focus its efforts in building a socially responsible entity in the countries and communities it operates in.


Monday, September 28, 2015

Shareholder Letters

TAIPEI, Taiwan, Sept. 28, 2015 /PRNewswire/ -- To the Honorable Shareholders of Siliconware Precision Industries Co., Ltd.:

We would like to report the successful results of our tender offer (the "Tender Offer") for the common shares (the "Common Shares") and the American depositary shares (the "ADSs") of Siliconware Precision Industries Co., Ltd. ("SPIL"). Our Tender Offer was well oversubscribed, and we express our sincere gratitude for the support we received from those of you who supported our Tender Offer. The number of Common Shares (including those represented by ADSs) validly tendered and not withdrawn in our Tender Offer was 1,147,898,165 (representing 36.83% of the issued and outstanding share capital of SPIL), a number which significantly exceeded the offer cap of 779,000,000 Common Shares (representing approximately 24.99% of the issued and outstanding share capital of SPIL). The results of our Tender Offer provide a market view affirming that our price of NT$45.00 per Common Share was a fair one, and it also affirms our strong belief that the market sees the compelling rationale for our investment and the future collaboration between SPIL and ASE, in a manner consistent with all applicable laws and taking into account the rights and interests of SPIL's shareholders and employees.

Unfortunately, shortly after we commenced our Tender Offer on August 24, 2015, SPIL announced onAugust 28, 2015 that it planned to form a strategic alliance with Hon Hai Precision Industry Co., Ltd. ("Hon Hai") by issuing Hon Hai new Common Shares through a share exchange (the "Hon Hai Share Exchange") and called an extraordinary shareholders' meeting for October 15, 2015 ("EGM") to discuss (i) the proposed amendments to SPIL's Articles of Incorporation (e.g., the increase in SPIL's authorized share capital) (the "AOIs Amendment") and (ii) the proposed amendments to SPIL's Procedures for Acquisition and Disposal of Assets (the " Acquisition and Disposition Procedures Amendment"). As a shareholder of SPIL, we believe that the Hon Hai Share Exchange, proposed by SPIL's management team, is detrimental to the rights and interests of SPIL shareholders, and we have already expressed our strong objection to SPIL's management team. We respectfully list out the reasons why we object to the Hon Hai Share Exchange below for your consideration:

First, the implied price of SPIL's shares to be issued in the Hon Hai Share Exchange (if calculated based onHon Hai pre-dividend share price NT$88.60 on August 28, 2015, the date on which SPIL first announced the proposed Hon Hai Share Exchange), is approximately NT$37.86 per SPIL share (ex-dividend); or, if calculated based on Hon Hai ex-dividend share price NT$83.90 on September 3, 2015, the implied price isNT$35.85 per SPIL share. This implied price of SPIL's shares to be issued in the Hon Hai Share Exchange is not only below our Tender Offer price (NT$45.00 per SPIL share), but also significantly below the bottom end of the value range (NT$48.91 to NT$60.58) determined by SPIL's independent appraiser, engaged by SPIL's Board of Directors and Independent Review Committee, in a fairness report issued on August 28, 2015. It was also below the SPIL's share price on the date which SPIL first announced the proposed Hon Hai Share Exchange (NT$39.50). We believe that the fairness of the implied price of SPIL shares under the Hon Hai Share Exchange is highly questionable.

Second, SPIL announced on August 28, 2015 that it planned to, in an extremely dilutive manner to shareholders, increase its authorized share capital to allow for the issuance of 840,600,000 shares to Hon Hai for the Hon Hai Share Exchange. However, to the market's surprise, SPIL suddenly announced onSeptember 25, 2015 that the proposed increase in its share capital is not capped at the amount required for the Hon Hai Share Exchange, but, to the contrary, at a total amount of NT$14 billion. If the shareholders approve the AOIs Amendment at the EGM, SPIL's Board of Directors may issue new shares in the amount of 1,883,638,861 shares. SPIL's Board of Directors may, without seeking approval from the shareholders' meeting, after deducting approximately 245,756,750 shares reserved for the conversion of SPIL's convertible bonds issued in 2014 ("ECB") and the 840,600,000 shares to be issued under the Hon Hai Share Exchange (representing 26.97% of the issued and outstanding share capital of SPIL),  issue up to a further approximately 797,282,111 new shares (representing approximately 25.58% of the issued and outstanding share capital of SPIL). These additional shares would account for approximately 52.56% of the issued and outstanding share capital of SPIL. Assuming that the shares reserved for the conversion for the ECB will not be converted, and SPIL's Board of Directors decided to issue new shares up to the proposed authorized share capital cap, then the dilution effect described above will be further increased to 60.44%.

In addition, if the Acquisition and Disposition Procedures Amendment is approved by shareholders at the EGM, the cap for SPIL to invest in a single security will increase from 20% of SPIL's net worth to 60%, which is an amount that far exceeds the amount it needs to issue 840,600,000 new shares to Hon Hai under the Hon Hai Share Exchange. As a result, SPIL's Board of Directors may also implement other dilutive acts similar to the Hon Hai Share Exchange to further significantly dilute all SPIL shareholders. This will also seriously jeopardize the foundation and opportunity for ASE to seek legal avenues of cooperation with SPIL in the future.

Third, in contrast to our Tender Offer, the Hon Hai Share Exchange brought no cash to SPIL or SPIL shareholders. Instead, it allows Hon Hai to become SPIL's largest shareholder through SPIL's issuance of new shares amounting to approximately 21.24% of its share capital. The Hon Hai Share Exchange, if consummated, will be dilutive to ALL SPIL shareholders. It is questionable whether the ratio for the Hon Hai Share Exchange is in the best interests of SPIL, or is consistent with the general principle of "proportionality". As a matter of fact, in practice, there are various ways for companies to enter into strategic alliances with each other. It is inappropriate for SPIL to issue a large number of new shares at a deep discount, thereby diluting all of its shareholders for the purpose of entering into a strategic alliance.

Fourth, shortly after entering into a non-binding letter of intent, SPIL chose a meeting date of October 15 for the EGM, and selected a record date of September 15. The purpose of this approach was to disenfranchise ASE, which will not be able to vote its 24.99% stake in SPIL against the AOIs Amendment which seeks to dramatically increase SPIL's authorized share capital and in turn materially and adversely affect ASE's right as a SPIL shareholder. As such, it is evident that SPIL's Board of Directors has failed to take into account the rights and interest of its shareholders when it evaluated the legality, necessity and appropriateness of the Hon Hai Share Exchange.

Fifth, if SPIL really believes that the Hon Hai Share Exchange is good for its shareholders, why has it not fully disclosed the Strategic Alliance and Share Exchange Agreement, to comply with United States disclosure rules and to allow all shareholders to fully understand the content of the Strategic Alliance and Share Exchange Agreement so that they can be fully informed when exercising their voting rights at the EGM?  

Under the applicable laws and regulations in Taiwan, every shareholder who is a holder of record of SPIL shares on September 15, 2015 (regardless of whether the shares had been tendered in our Tender Offer on or after September 15, 2015, or had been subsequently sold in open market after September 15, 2015) has the right to vote at SPIL's EGM. As a major shareholder of SPIL, we believe the interests and rights of all SPIL shareholders should always be the top priority of SPIL's management. Although we are unable to participate in the EGM, however, if you held SPIL's shares on September 15, 2015, we urge you to consider the reasons listed above, attend the EGM to exercise your shareholder rights and vote "AGAINST" the "AOIs Amendment" (to approve the increase in authorized share capital) and the "Acquisition and Disposition Procedures Amendment".

Wishing all SPIL shareholders good health and all the best,

Advanced Semiconductor Engineering, Inc.


Tuesday, September 22, 2015

Acquisition Activity

TAIPEI, Taiwan, Sept. 22, 2015 /PRNewswire/ -- In connection with the offer to purchase, for cash, up to 779,000,000 common shares ("Common Shares") of Siliconware Precision Industries Co., Ltd. ("SPIL"), including those represented by American depositary shares ("ADSs"), by Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE" or "we" ), through concurrent tender offers in the United States (the "U.S. Offer") and in the Republic of China (the "ROC Offer"), ASE announced today that the ROC Offer expired at 3:30 p.m. on September 22, 2015, Taiwan time, and the U.S. Offer expired at 1:30 a.m. on September 22, 2015, New York time. The number of Common Shares (including those represented by ADSs) validly tendered in the ROC Offer and the U.S. Offer is 1,147,898,165 (representing approximately 36.83% of the issued and outstanding share capital of SPIL), which exceeded the offer cap of 779,000,000 Common Shares (representing approximately 24.99% of the issued and outstanding share capital of SPIL). As a result, the number of Common Shares and ADSs that will be accepted for payment will be subject to proration as described in the tender offer documents for the ROC Offer and the U.S. Offer.  

ASE expresses its sincere gratitude for all SPIL shareholders who participated in the ROC Offer and the U.S. Offer. Subject to and in accordance with the terms of the ROC Offer and the U.S. Offer, ASE will pay NT$45 per Common Share and NT$225 per ADS payable in the equivalent amount of U.S. dollars on or before September 30, 2015.

Going forward, ASE, as a major shareholder of SPIL, is looking forward to promptly explore future cooperation opportunities with SPIL, in a manner consistent with all applicable laws, in an effort to maintain and promote the competitiveness of both ASE and SPIL in the face of challenges arising from the increase in global competition and the consolidation trends in the global semiconductor industry. If further avenues of cooperation with SPIL cannot be agreed, our shares in SPIL through the ROC Offer and the U.S. Offer will otherwise be held as a financial investment. ASE will not interfere with SPIL's operations, and will not interfere or affect the rights and interests of SPIL's employees.


Friday, September 18, 2015

Acquisition Activity

TAIPEI, Taiwan, Sept. 17, 2015 /PRNewswire/ -- In connection with the offer to purchase, for cash, up to 779,000,000 common shares ("Common Shares") of Siliconware Precision Industries Co., Ltd. ("SPIL"), including those represented by American depositary shares ("ADSs") by Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE" or "we"), through concurrent tender offers in the United States (the "U.S. Offer") and in the Republic of China (the "ROC Offer"), ASE announced today that as of 10 a.m. Taiwan time today, the number of Common Shares tendered in the ROC Offer has reached 156,546,720, exceeding 155,818,056 Common Shares (representing approximately 5% of the issued and outstanding share capital of SPIL), which satisfied the minimum condition of the ROC Offer and the US Offer. As the minimum condition has been satisfied, subject to and in accordance with the terms of the ROC Offer and the U.S. Offer, ASE will pay NT$45 per Common Share and NT$225 per ADS payable in the equivalent amount of U.S. dollars on or before September 30, 2015.

The ROC Offer will expire at 3:30 p.m. on September 22, 2015, Taiwan time. The U.S. tender offer will expire at 1:30 a.m. onSeptember 22, 2015, New York time. We urge holders of SPIL shareholders who would like to participate in the tender offers to tender your Common Shares or ADSs as soon as possible before the relevant expiration date.


Tuesday, September 8, 2015

Comments & Business Outlook

TAIPEI, Taiwan, Sept. 7, 2015 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for August 2015.


Tuesday, September 8, 2015

Acquisition Activity

TAICHUNG, Sept. 6, 2015 /PRNewswire/ -- According to recent media reports, Advanced Semiconductor Engineering, Inc.'s (Taiwan Stock Exchange: 2311.TT, NASDAQ: ASX) ("ASE") Chairman Jason C.S. Changand COO Tien Wu have responded to the conclusions of Siliconware Precision Industries Co., Ltd.'s (Taiwan Stock Exchange: 2325.TT, NASDAQ: SPIL) (the "Company") Review Committee's August 28, 2015 meeting (the "ASE Response"). The Company's Review Committee held a meeting today and the Review Committee's additional comments are as follows:

1. The ASE Response expresses that, in accordance with law, ASE's tender offer could not be publicly disclosed prior to being made and that due to legal restrictions, ASE could not notify the Company beforehand. However, according to legal research, Taiwan laws and regulations do not prohibit a company making a tender offer from communicating with the target company of the tender offer in order to facilitate the tender offer process. In actuality, there are few precedents in Taiwan where an entity making a tender offer has not communicated with the tender offer target company. ASE clearly has a misunderstanding ofTaiwan laws and the tender offer practice.

2. The ASE Response professes that ASE's tender offer is purely a financial investment and that ASE will not interfere with the business operations of the Company. The Review Committee, on the basis of protecting the interests of the Company's shareholders, recommends ASE to formally state and confirm in the tender offer prospectus and the documents and announcements submitted to the competent authority that ASE's tender offer is purely a financial investment, that ASE will not interfere with the business operations of the Company and that, while ASE holds the Company's shares, it will not directly or indirectly be a director of the Company or nominate anyone to be a director of the Company. This will better allow the Company's shareholders to decide whether or not to participate in ASE's tender offer.


Friday, September 4, 2015

Joint Venture

KAOHSIUNG, Taiwan--()--Advanced Semiconductor Engineering, Inc (TSE: 2311, NYSE: ASX) today announced the official inauguration of ASE Embedded Electronics Incorporated, at a formal signing ceremony in Kaohsiung with TDK Corporation and local officials.

On May 8th, 2015, both ASE and TDK entered into an agreement to establish a joint venture company, named ASE Embedded Electronics Incorporated, to manufacture IC embedded substrates using TDK�s SESUB�(Semiconductor Embedded in SUBstrate) technology. The ASE Embedded Electronics manufacturing facility is to be located in the Nantze Export Processing Zone, Kaohsiung City, Taiwan. ASE�s System-in-Package (SiP) solutions using SESUB technology will offer a robust embedded solution in enabling a wide number of applications such as PMIC, sensors, RF tuners, and many more. Through the joint venture company, ASE aims to leverage ASE�s capabilities in advanced packaging, test and module level solutions with TDK�s proven proprietary embedded technology to address escalating market needs for semiconductor miniaturization.

As a leader in SiP technology, ASE continues to expand its product and service portfolio through collaboration with key suppliers and partners. "Such alliances enable ASE to strengthen its SiP ecosystem and offer our customers a complete suite of solutions for integrating dozens of chips into smaller and thinner spaces in the advent of portable and wearable devices and the Internet of Things," said Dr. Tien Wu, COO, ASE Group.


Monday, August 31, 2015

Acquisition Activity

TAIPEI, Taiwan, Aug. 28, 2015 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE" or "we") today acknowledged the announcement made public today by Siliconware Precision Electronics Co, Ltd. ("SPIL") in response to ASE's tender offer of NT$45 per common share for up to 779,000,000 common shares of SPIL (including the common shares represented by American depositary shares) made starting from August 24, 2015 (the "Tender Offer") and the hasty announcement made by SPIL regarding the entering into a letter of intent between SPIL and Hon Hai Precision Industry Co., Ltd. ("Hon Hai") in connection with their strategic alliance ("Hon Hai Deal").

The Tender Offer will continue to proceed in Taiwan and in the U.S. pursuant to the applicable rules and regulations, and will not be affected by the Hon Hai Deal announcement.

Based upon the extremely limited information contained in SPIL's announcement, SPIL has in a four day time period agreed a major transaction with Hon Hai. At no point after commencement of ASE's bid did SPIL make any effort to determine whether there were possible basis on which ASE's bid could be acceptable to SPIL. Instead, SPIL has crafted a substantially similar investment structure with Hon Hai, except that it offers zero cash to SPIL's shareholders, and appears to place an implied value for SPIL of NT$37.86 per common share, compared to ASE's cash offer price of NT$45 per common share. It is also a discount to SPIL's current market price. This is difficult to reconcile with the views of SPIL's certificated public accountant concerning the reasonable valuation range for SPIL's shares.

Similarly, ASE is disappointed that SPIL's Independent Review Committee raised concerns regarding the reasonableness of the price and purposes of the Tender Offer and recommended SPIL shareholders to refrain from participating in the Tender Offer. As noted above, it is also difficult to reconcile with the proposed Hon Hai Deal, which ASE believes is at implied valuation of SPIL that is a meaningful discount both to the ASE bid price, and SPIL's own accountant's valuation range.

Under the terms of the Tender Offer, ASE's bid price is NT$45 per common share, a price which is a compelling 34% premium over the closing price of SPIL's common shares on the Taiwan Stock Exchange as of August 21, 2015. Compared to the terms of the proposed Hon Hai Deal, which ASE believes requires SPIL to issue new shares in exchange for new shares of Hon Hai ("Share Exchange") at a consideration that appears to equate to an implied value of NT$37.86 per common share, ASE's bid is at a 19% premium to the implied value of the Hon Hai Deal, which further signifies that ASE's bid presents a compelling premium for SPIL's shareholders to realize its value, and demonstrates ASE's sincerity and respect to all SPIL's shareholders. ASE strongly encourages SPIL's shareholders to participate in the Tender Offer.

Before making a decision on the proposed Share Exchange, ASE urges that the management, directors and shareholders of SPIL fully consider whether the Hon Hai Deal is in the best interests of SPIL and its shareholders.

We continue to believe that the ASE bid represent compelling value for SPIL's shareholders.


Friday, August 28, 2015

Acquisition Activity

TAICHUNG, Aug. 28, 2015 /PRNewswire/ -- Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company") (Taiwan Stock Exchange: 2325.TT, NASDAQ:SPIL) held both a Review Committee meeting and a Board of Directors meeting today in accordance with the Regulations Governing Public Tender Offers for Securities of Public Companies to discuss and review the tender offer by Advanced Semiconductor Engineering, Inc. ("ASE") (Taiwan Stock Exchange: 2311.TT, NASDAQ:ASX) to purchase the Company's common shares and/or American depositary receipts ("ADRs").

The conclusions of the Review Committee and the Board of Directors are consistent. They both recommend shareholders not to tender their shares and/or ADRs. The reasons are as followings:

1. ASE proposed to offer NTD 45 cash per common share (US dollar equivalent of NTD 225 cash per ADR (each representing 5 of the Company's common shares), collectively the "Proposed Cash Considerations") to acquire the common shares and ADRs of the Company, with a maximum number of 779,000,000 shares (including common shares represented by ADRs) and a minimum number of 155,818,056 shares (not including common shares represented by ADRs). If using the average closing price of NTD 44.87 within the last 90 trading days prior to August 21, 2015 as the calculation basis, the tender offer price premium is only 0.29%. Considering the Company's operations, market price of shares, earning per share, book value per share, future development, distributed earnings in recent years and an independent expert's opinion to the reasonableness of the tender offer price, the reasonableness of the tender offer price is questionable.

2. The Company has retained J.P. Morgan Chase Bank, N.A., Taipei Branch ("J.P. Morgan Taipei") as its exclusive financial advisor in connection with the Tender Offer and to render an opinion by J.P. Morgan Taipei or its affiliate to the Company as to whether the Proposed Cash Considerations are adequate, from a financial point of view, to the holders of the Company's common shares and the Company's ADSs, respectively. The Company has received a copy of such opinion from JPMorgan Securities (Asia Pacific) Limited, an affiliate of J.P. Morgan Taipei, to the effect that, as of the date of the opinion and subject to the limitations and other matters stated therein, such Proposed Cash Considerations are inadequate, from a financial point of view, to the holders of the Company's common shares and the Company's ADSs.

3. Pursuant to an opinion provided by the certified public accountant Fu-Jie Hsu from Ding Shuo Certified Accountants, the reasonable transaction price range is from NTD 48.91 to NTD 60.58 per common share, equivalent to a reasonable transaction price range of NTD 244.55 to NT 302.90 per ADR. ASE's tender offer price is NTD 45 (US dollar equivalent of NTD 225 cash per ADR (each representing 5 of the Company's common shares)), which is below the reasonable transaction price range suggested by the certified public accountant. As such, the tender offer price offered by ASE is not reasonably adequate.

4. ASE has stated in relevant announcements and filing documents that the current public tender offer is purely a financial investment and that it has no plans to interfere with the business operations of the Company. However, ASE has also stated publicly that, facing intense global competition and the accelerating trend towards consolidation in the semiconductor industry, the purpose of the public tender offer for SPIL's shares is to seek to build a foundation and opportunity for cooperation between ASE and SPIL. These two statements of ASE are contradictory. The Review Committee and the Board of Directors are not able to understand the real purpose of ASE's public tender offer and is concerned that ASE's actions will not be beneficial to the interests of the Company and its shareholders.

5. The Company constantly has cooperation opportunities with other companies and is open to strategic partnerships with others. However, when cooperating with others, the Company has always held discussions with its partners in advance in order to find a consensus and achieve the goal of mutual benefit. ASE did not communicate with the Company prior to its tender offer, which has resulted in the Company being caught unaware. Such raid on a fellow industry competitor by taking advantage of the recent volatility in the domestic securities markets is a rare seen approach among domestic corporations and differs from the Company's enterprise culture. Moreover, the purpose behind ASE's tender offer is contradictory and unclear, and the contents of its tender offer prospectus is also quite vague and general, which leaves issues such as the competitive relationship between the Company and ASE, client relationships, or impacts the Company's business and employment arrangements with great uncertainty.

In sum of the above, with respect to the fairness and reasonableness of the conditions and pricing of this public tender offer, besides the fact that the tender offer price is low and may not be fair and reasonable to the shareholders of the Company, the Review Committee and the Board of Directors also continue to have certain concerns with the public tender offer after discussing the relevant issues. As such, the Company recommends all shareholders of the Company to refrain from entertaining the offer to participate in this public tender offer. The Company would like to call upon all shareholders to take the above reasons into due consideration and assess prudently whether to participate in this tender offer together with its relevant risks so as to maintain their rights and interests.


Monday, August 24, 2015

Acquisition Activity

TAICHUNG, Aug. 24, 2015 /PRNewswire/ -- Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company") (Taiwan Stock Exchange:2325.TT, NASDAQ:SPIL) announced today that it has received an unsolicited tender offer from Advanced Semiconductor Engineering, Inc. ("ASE") (Taiwan Stock Exchange:2311.TT, NASDAQ:ASX) to acquire up to 25% of the common shares and/or American depositary shares of the Company.

The board of directors of the Company has formed a review committee consisting of its independent directors (the "Independent Review Committee") today to evaluate the unsolicited tender offer from ASE and make a recommendation to the shareholders of the Company regarding this unsolicited tender offer. The Company will publish the recommendation and reasons for such recommendation from the Review Committee within the required time under relevant laws and regulations in Taiwan and the United States, which is expected to be within the next seven calendar days.

The Company has retained JPMorgan Chase & Co. as its financial advisor, Simpson Thacher & Bartlett LLP as its United States legal counsel and Jones Day as its Taiwan legal counsel.

The Company strongly urges its shareholders to refrain from tendering any common shares or American depositary shares until the Review Committee has evaluated the unsolicited tender offer and published its recommendation and reasons for such recommendation.

TAICHUNG, Taiwan, Aug. 21, 2015 /PRNewswire/ -- Siliconware Precision Industries Co., Ltd.  ("SPIL" or the "Company") (Taiwan Stock Exchange: 2325.TT, NASDAQ: SPIL) today announced that regarding the announcement of Advanced Semiconductor Engineering, Inc. ("ASE") today to propose a tender offer for SPIL's common shares and/or ADSs, the Company was not aware of such matter in advance.

The Company will take all actions in accordance with the applicable laws upon receipt of the public tender offer prospectus, and will provide a formal response, together with recommendation and explanations, to the Company's shareholders within seven (7) days.


Friday, August 21, 2015

Notable Share Transactions

TAIPEI, Taiwan, Aug. 21, 2015 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE") announced today that it plans to commence on August 24, 2015, tender offers in theRepublic of China and the United States for common shares and American Depositary Shares ("ADSs") of Siliconware Precision Industries Co., Ltd. ("SPIL") at a price of NT$45 per common share and NT$225 per ADS payable in the equlvant amount of U.S. dollars, respectively. The Taiwan offer is being made to all holders of common shares and the U.S. offer is being made to all holders of ADSs.

The Taiwan offer will commence at 9:00 a.m., Taiwan time, on August 24, 2015 and expire at 3:30 p.m.,Taiwan time, on September 22, 2015.  The U.S. offer will commence at 12:01 a.m., New York City time, onAugust 24, 2015 and expire at 12:00 p.m. noon, New York City time, on September 22, 2015.  ASE plans to acquire an estimated maximum number of 779,000,000 common shares of SPIL (including common shares represented by ADSs), equivalent to approximately 25% of the common shares issued by SPIL.

In the face of intensifying global competition and rising of new contenders, the drive for consolidation of the semiconductor industry is becoming increasingly apparent.  ASE believes that industry peers in Taiwanshould actively search for opportunities to cooperate and integrate resources, in order to protect and further improve the competitive advantage of the Taiwanese packaging and testing industry.  The purpose of ASE acquiring an equity interest in SPIL through the tender offer is to establish the basis and opportunity for exploration of possible avenues of cooperation between ASE and SPIL; within the legally permitted scope and taking into full consideration the mutual interests of both parties' employees and shareholders, ASE is willing to discuss specific details of such avenues of cooperation with SPIL's operations team.  Until such time, the acquisition of equity interest in SPIL by ASE through this tender offer is purely a financial investment, and ASE will not intervene in SPIL's operations.  As SPIL reported strong operating performance in the past, ASE believes that its financial investment should yield excellent return.

During the tender offer period, if the number of common shares tendered in Taiwan reaches the minimum number of 155,818,056 shares (equivalent to 5% of common shares issued by SPIL), ASE shall lawfully acquire common shares and ADSs of SPIL tendered in the Taiwan and U.S. offers up to the limits expressed in the second paragraph, and subject to proration, as described in the the Taiwan and U.S. offers, and subject to the terms and conditions of the Taiwan and U.S. offers.


Friday, August 21, 2015

Acquisition Activity

TAIPEI, Taiwan, Aug. 21, 2015 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE") announced today that it plans to commence on August 24, 2015, tender offers in theRepublic of China and the United States for common shares and American Depositary Shares ("ADSs") of Siliconware Precision Industries Co., Ltd. ("SPIL") at a price of NT$45 per common share and NT$225 per ADS payable in the equlvant amount of U.S. dollars, respectively. The Taiwan offer is being made to all holders of common shares and the U.S. offer is being made to all holders of ADSs.

The Taiwan offer will commence at 9:00 a.m., Taiwan time, on August 24, 2015 and expire at 3:30 p.m.,Taiwan time, on September 22, 2015.  The U.S. offer will commence at 12:01 a.m., New York City time, onAugust 24, 2015 and expire at 12:00 p.m. noon, New York City time, on September 22, 2015.  ASE plans to acquire an estimated maximum number of 779,000,000 common shares of SPIL (including common shares represented by ADSs), equivalent to approximately 25% of the common shares issued by SPIL.

In the face of intensifying global competition and rising of new contenders, the drive for consolidation of the semiconductor industry is becoming increasingly apparent.  ASE believes that industry peers in Taiwanshould actively search for opportunities to cooperate and integrate resources, in order to protect and further improve the competitive advantage of the Taiwanese packaging and testing industry.  The purpose of ASE acquiring an equity interest in SPIL through the tender offer is to establish the basis and opportunity for exploration of possible avenues of cooperation between ASE and SPIL; within the legally permitted scope and taking into full consideration the mutual interests of both parties' employees and shareholders, ASE is willing to discuss specific details of such avenues of cooperation with SPIL's operations team.  Until such time, the acquisition of equity interest in SPIL by ASE through this tender offer is purely a financial investment, and ASE will not intervene in SPIL's operations.  As SPIL reported strong operating performance in the past, ASE believes that its financial investment should yield excellent return.

During the tender offer period, if the number of common shares tendered in Taiwan reaches the minimum number of 155,818,056 shares (equivalent to 5% of common shares issued by SPIL), ASE shall lawfully acquire common shares and ADSs of SPIL tendered in the Taiwan and U.S. offers up to the limits expressed in the second paragraph, and subject to proration, as described in the the Taiwan and U.S. offers, and subject to the terms and conditions of the Taiwan and U.S. offers.


Monday, August 10, 2015

Comments & Business Outlook

TAIPEI, Taiwan, Aug. 10, 2015 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for July 2015.

CONSOLIDATED NET REVENUES (UNAUDITED)



Jul


Jun


Jul


Sequential


YoY

(NT$ Million)


2015


2015


2014


Change


Change

Net Revenues


21,669


24,832


20,052


-12.7%


+8.1%














Jul


Jun


Jul


Sequential


YoY

(US$ Million)


2015


2015


2014


Change


Change

Net Revenues


701


808


671


-13.2%


+4.6%


Starting from Feb. 1, 2010, Universal Scientific Industrial Co., Ltd.'s consolidated revenues were consolidated into ASE Inc.'s consolidated revenues. Net revenues for the ATM assembly test and material business (excluding USI) are as follows:

ATM NET REVENUES (UNAUDITED)



Jul


Jun


Jul


Sequential


YoY

(NT$ Million)


2015


2015


2014


Change


Change

Net Revenues


12,934


12,593


13,398


+2.7%


-3.5%














Jul


Jun


Jul


Sequential


YoY

(US$ Million)


2015


2015


2014


Change


Change

Net Revenues


419


410


448


+2.1%


-6.6%


Thursday, July 30, 2015

Comments & Business Outlook

Second Quarter 2015 Financial Results

  • Unaudited net revenues[1] of NT$70,222 million for the second quarter of 2015 (2Q15), up by 20% year-over-year and up by 9% sequentially.
  • Diluted earnings per share for the quarter were NT$0.43 (or US$0.070 per ADS)compared to diluted earnings per share of NT$0.65 for 2Q14 and NT$0.56 for 1Q15.

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the third quarter of 2015 to be as follows:

  • IC ATM production capacity should be flat and blended IC ATM utilization should be up 1% to 5%;
  • IC ATM gross margin should resemble the 1Q15 level;
  • EMS Business should approach 4Q14 level;
  • EMS gross margin should decline slightly.

Friday, May 29, 2015

Comments & Business Outlook

TAIPEI, Taiwan--(BUSINESS WIRE)--

Advanced Semiconductor Engineering, Inc (TAIEX:2311, NYSE:ASX), the world’s largest semiconductor assembly and test service provider, today announced it will be showcasing System in Package (SiP) solutions in consumer applications at Computex 2015, scheduled to take place in Taipei, Taiwan, over June 2-5, 2015. These SiP applications highlight the synergy between ASE’s IC packaging, material and test technologies, together with the strong expertise of Universal Scientific Industrial Shanghai Co, Ltd (USI; SHA: 601231) in module level manufacturing services to bring SiP into the realm of the Internet-of-Things (IoT).

SiP technology enables multiple semiconductor chips and passive components to be integrated within a smaller and more compact module without compromising the functionality and performance of the entire package or module. Hence, SiP can be ideally applied to many of today’s consumer technologies that require heterogeneous integration of numerous IC functions such as RF, processor, memory, sensors, power management, multimedia, and more, within very tight space constraints.

ASE’s developments in SiP also serve to protect the environment as it reduces the number of required manufacturing steps. Previously, each device function was developed onto individual IC chips, but with SiP technology, the ICs can be designed and directly embedded onto a substrate, then onto a module. The reduction in manufacturing steps results in less required materials as well as increased efficiency in logistics management during inventory shipment.

To better serve the fast-growing IoT segment, ASE has evolved its business model by combining its technologies in wire bonding, wafer level, fan-out, flip chip, 2.5D/3D, substrates and embedded IC packaging with USI’s module level assembly to establish a strong leadership in SiP. ASE has also created a cohesive ecosystem for its SiP platform that included a key announcement with Inotera Memories Inc (April 7, 2014) on foundry service for 2.5D silicon interposer and TDK Corporation (May 8, 2015) for proprietary embedded substrate manufacturing. The collaboration within the supply chain has led to the development of a world class manufacturing technology that can be used in embedded solutions within smartphones, wearables, homes, connectivity and sensor applications.

Computex attendees will find the end result of this collaboration on display in the ASE VIP suite which is located on the second floor of the Taipei International Convention Center, number T203A. The exhibits on display will include mesh lighting (smart lighting) that can be controlled through an iPad, environmental sensors, Beacon (micro location) technology, wearables, connectivity and embedded substrate technology. Attendees will have the opportunity to see how SiP solutions are implemented into a variety of applications, including smart living, connectivity, data management and diagnostic devices in healthcare.


Friday, May 8, 2015

Comments & Business Outlook

KAOHSIUNG, Taiwan--()--Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) and TDK Corporation (TSE: 6762) announced today that both companies will enter into an agreement to establish a joint venture company to manufacture IC embedded substrates using TDK�s SESUB� (Semiconductor Embedded SUBstrate) technology. ASE and TDK plan to own 51 percent and 49 percent, respectively, of the newly created entity. The indicative name of the joint venture company will be ASE Embedded Electronics Incorporated, and its manufacturing facility is planned to be located in the Nantze Export Processing Zone, Kaohsiung City, Taiwan.

Through its strengths in manufacturing excellent inductive devices and magnetic heads for hard disk drives, TDK developed its proprietary SESUB technology by harnessing TDK�s signature technologies in ultrafine processing and materials. The SESUB technology enables semiconductor chips to be thinned down to as low as 50 μm and embedded in a four-layer plastic substrate. TDK�s SESUB technology provides numerous advantages, such as enabling miniaturization by reducing the mounting area on substrates and a thinner profile by achieving a 300 μm thickness. Other advantages include excellent thermal dissipation characteristics, which offer greater design flexibility and inter-chip connection that enhances EMI performance.

As a leader in System in Package (SiP) technology, ASE continues to expand its product and service portfolio through collaboration with key suppliers and partners. ASE SiP solutions using SESUB technology will offer a robust embedded solution in enabling a wide number of applications such as PMIC, sensors and RF tuners etc. The planned joint venture business model aims to leverage on TDK�s success in delivering SESUB technology to the market with ASE�s capabilities in advanced packaging, test and module level solutions for semiconductor miniaturization.

�With the anticipated need for further miniaturization and weight reduction of smartphones and wearable devices in the future, demand for semiconductors embedded in substrates, such as SESUBs, is expected to increase globally,� says Mr Takehiro Kamigama, CEO and President of TDK Corporation. �TDK has already been producing SESUBs at its Kofu Plant, but to meet the anticipated increase in demand, it will establish the joint company in Taiwan to add to its production capacity with ASE, which possesses technologies including assembly of IC packages and other items, and boasts a world-class performance record in product testing. The joint venture establishment will create a structure for full-scale mass production,� added Mr Takehiro Kamigama.

�ASE serves a diverse group of customers including several major players supplying to the portable and wearable consumer market and is a leader in SIP integration using its advanced packaging solutions and test expertise. TDK, on the other hand, has a proven proprietary embedded substrate technology addressing the market needs of integrating more chips and functions, higher performance, lower power consumption and better heat dissipation onto a smaller form factor,� says Dr Tien Wu, COO, ASE Group. �We see this powerful alliance as an added value to the ASE SIP ecosystem and together, catapulting TDK�s SESUB technology into the forefront as an industry standard,�� added Dr Tien Wu.

The proposed establishment of and capital injection into the joint venture company will be subject to various regulatory approvals or consents (including but not limited to the approvals of the Taiwan Fair Trade Commission and Export Processing Zone Administration).


Thursday, April 30, 2015

Comments & Business Outlook

First Quarter 2015 Financial Results

  • Unaudited net revenues[1] of NT$64,662 million for the first quarter of 2015 (1Q15), up by 18% year-over-year and down by 16% sequentially.
  • Diluted earnings per share for the quarter were NT$0.56 (or US$0.089 per ADS), compared to diluted earnings per share of NT$0.44 for 1Q14 and NT$0.99 for 4Q14.

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the second quarter of 2015 to be as follows:

  • IC ATM production capacity will be up 2%; blended IC ATM utilization should be flat to up 2%;
  • IC ATM gross margin should stay relatively unchanged from the previous quarter;
  • EMS business should reach a level between the results of the last two quarters;
  • EMS gross margin might be slightly lower than the normalized margin in the previous quarter due to customer supply chain issues.

Wednesday, March 18, 2015

Comments & Business Outlook

CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME
(Amounts in Thousands Except Earnings Per Share)

 
   
For the Years Ended December 31
 
   
2012
   
2013
   
2014
 
   
NT$
   
NT$
   
NT$
   
US$ (Note 4)
 
                         
OPERATING REVENUES (Note 4)
  $ 193,972,392     $ 219,862,446     $ 256,591,447     $ 8,119,983  
                                 
OPERATING COSTS (Notes 11, 21 and 23)
    157,342,744       177,040,435       203,002,918       6,424,143  
                                 
GROSS PROFIT
    36,629,648       42,822,011       53,588,529       1,695,840  
                                 
OPERATING EXPENSES (Notes 21 and 23)
                               
Selling and marketing expenses
    2,766,880       2,982,789       3,438,166       108,803  
General and administrative expenses
    8,283,264       8,712,862       10,214,810       323,254  
Research and development expenses
    7,872,422       9,064,712       10,289,684       325,623  
                                 
Total operating expenses
    18,922,566       20,760,363       23,942,660       757,680  
                                 
Other income and expenses (Notes 20 and 23)
    83,192       (1,348,246 )     228,615       7,235  
                                 
PROFIT FROM OPERATIONS
    17,790,274       20,713,402       29,874,484       945,395  
                                 
NON-OPERATING INCOME AND EXPENSES
                               
Other income (Note 23)
    553,088       493,884       529,251       16,749  
Other gains and losses (Note 23)
    244,830       447,886       607,299       19,218  
Finance costs (Note 23)
    (2,042,544 )     (2,307,455 )     (2,354,097 )     (74,497 )
Share of the profit or loss of associates (Note 4)
    63,076       22,039       (121,882 )     (3,857 )
                                 
Total non-operating income and expenses
    (1,181,550 )     (1,343,646 )     (1,339,429 )     (42,387 )
                                 
PROFIT BEFORE INCOME TAX
    16,608,724       19,369,756       28,535,055       903,008  
                                 
INCOME TAX EXPENSE (Notes 4, 5 and 24)
    2,960,426       3,499,595       5,665,954       179,302  
                                 
PROFIT FOR THE YEAR
    13,648,298       15,870,161       22,869,101       723,706  
                                 
OTHER COMPREHENSIVE INCOME (LOSS)
                               
Items that will not be reclassified subsequently to profit or loss:
                               
Remeasurement of defined benefit obligation
    (818,546 )     412,225       (28,145 )     (891 )
Share of other comprehensive income of associates
    -       -       (1,031 )     (32 )

(Continued)
 
F-5

 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. AND SUBSIDIARIES

CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME
(Amounts in Thousands Except Earnings Per Share)

 
   
For the Years Ended December 31
 
   
2012
   
2013
   
2014
 
   
NT$
   
NT$
   
NT$
   
US$ (Note 4)
 
Income tax relating to items that will not be reclassified subsequently
  $ 140,880     $ (66,706 )   $ 23,885     $ 756  
      (677,666 )     345,519       (5,291 )     (167 )
                                 
Items that may be reclassified subsequently to profit or loss:
                               
Exchange differences on translating foreign operations
    (3,269,623 )     2,817,268       5,405,008       171,044  
Unrealized gain (loss) on available-for-sale financial assets
    16,539       14,839       (133,714 )     (4,232 )
Cash flow hedges
    53,755       1,245       3,279       104  
Share of other comprehensive income of associates
    55,401       55,183       235,156       7,442  
Income tax relating to items that may be reclassified subsequently
    (9,138 )     (769 )     -       -  
      (3,153,066 )     2,887,766       5,509,729       174,358  
                                 
Other comprehensive income (loss) for the year, net of income tax
    (3,830,732 )     3,233,285       5,504,438       174,191  
                                 
TOTAL COMPREHENSIVE INCOME FOR THE YEAR
  $ 9,817,566     $ 19,103,446     $ 28,373,539     $ 897,897  
                                 
PROFIT FOR THE YEAR ATTRIBUTABLE TO:
                               
Owners of the Company
  $ 13,191,617     $ 15,404,505     $ 22,228,602     $ 703,437  
Non-controlling interests
    456,681       465,656       640,499       20,269  
                                 
    $ 13,648,298     $ 15,870,161     $ 22,869,101     $ 723,706  
                                 
TOTAL COMPREHENSIVE INCOME FOR THE YEAR ATTRIBUTABLE TO:
                               
Owners of the Company
  $ 9,420,363     $ 18,509,604     $ 27,394,362     $ 866,910  
Non-controlling interests
    397,203       593,842       979,177       30,987  
                                 
    $ 9,817,566     $ 19,103,446     $ 28,373,539     $ 897,897  
                                 
                                 
EARNINGS PER SHARE (Note 25)
                               
Basic
  $ 1.77     $ 2.05     $ 2.89     $ 0.09  
Diluted
  $ 1.73     $ 1.99     $ 2.79     $ 0.09  
                                 
EARNINGS PER AMERICAN DEPOSIT SHARE (“ADS”)
                               
Basic
  $ 8.86     $ 10.26     $ 14.46     $ 0.46  
Diluted
  $ 8.65     $ 9.96     $ 13.93     $ 0.44

Management Discussion and Analysis

Operating Revenues. Operating revenues increased 16.7% to NT$256,591.4 million (US$8,120.0 million) in 2014 from NT$219,862.4 million in 2013, primarily due to an increase in revenues from our electronic manufacturing services business. Packaging revenues increased 7.8% to NT$121,336.5 million (US$3,839.8 million) in 2014 from NT$112,603.9 million in 2013. Testing revenues increased 4.6% to NT$25,874.7 million (US$818.8 million) in 2014 from NT$24,732.2 million in 2013. Revenues from our electronic manufacturing services business increased 34.7% to NT$105,784.4 million (US$3,347.6 million) in 2014 from NT$78,530.6 million in 2013. The increase in packaging revenues was primarily due to an increase in the demand for our services and an increase in the revenues generated from our copper wire bonding solutions. The increase in testing revenues was primarily due to an increase in sales volume for our testing business. The increase in the revenues from our electronic manufacturing services business was primarily due to an increase in the outsourced orders for communications products.

Net Profit. Net profit, excluding non-controlling interests, increased 44.3% to NT$22,228.6 million (US$703.4 million) in 2014 compared to NT$15,404.5 million in 2013. Our diluted earnings per ADS increased to NT$13.93 (US$0.44) in 2014 compared to diluted earnings per ADS of NT$9.96 in 2013. Our income tax expense increased 61.9% to NT$5,666.0 million (US$179.3 million) in 2014 compared to NT$3,499.6 million in 2013, primarily due to an increase in the profit before income tax and income tax on undistributed earnings, partially offset by an increase in the tax credit.


Thursday, February 26, 2015

Comments & Business Outlook

TAIPEI, Taiwan--()--Advanced Semiconductor Engineering, Inc. (TAIEX:2311, NYSE:ASX) announced today that it has joined the Electronics Industry Citizenship Coalition (EICC), the world�s largest industry coalition committed to creating shared value for the businesses, people, and communities who collectively contribute to the manufacture of electronic devices around the world. ASE�s membership further represents the Company�s resolve to align and work with suppliers and partners that share similar values regarding sustainability.

As the world�s leading provider of semiconductor assembly and test services, ASE recognizes the need to consistently demonstrate a higher standard of corporate social responsibility. Membership in the EICC underscores the significant strides ASE has taken in enhancing its commitment to environmental and social governance, both within ASE operations as well as throughout its broader supply chain. Through this membership, ASE has joined a dedicated community of leading electronics companies, and will benefit from the opportunity to learn and collaborate with customers, partners, peers, and suppliers, alike.

ASE has also adopted the EICC Code of Conduct to improve efficiency and social, ethical and environmental responsibility throughout its global supply chain, with the expectation that suppliers likewise act in accordance with the code too. In addition, ASE suppliers and partners are encouraged to commit to �The ASE Group sustainability supply chain management� policies and procedures when conducting business with ASE, as these have been developed to align closely with the EICC Code.

�Corporate sustainability has always been an important focus at ASE and we have channeled a significant amount of resources into the development and implementation of CSR policies, including management operational policies, labor welfare, health and safety, environmental conservation and community relations,� commented Dr Tien Wu, COO, ASE Group. �ASE will continue to expand initiatives and collaborate within the industry to promote sustainability and transparency to the company�s stakeholders and society at large.�


Monday, February 9, 2015

Comments & Business Outlook
TAIPEI, Feb. 9, 2015 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for January 2015.

CONSOLIDATED NET REVENUES (UNAUDITED)


Jan

Dec

Jan

Sequential

YoY

(NT$ Million)

2015

2014

2014

Change

Change

Net Revenues

23,355

24,873

18,589

-6.1%

+25.6%








Jan

Dec

Jan

Sequential

YoY

(US$ Million)

2015

2014

2014

Change

Change

Net Revenues

736

801

621

-8.1%

+18.6%

Starting from Feb. 1, 2010, Universal Scientific Industrial Co., Ltd.'s consolidated revenues were consolidated into ASE Inc.'s consolidated revenues.  Net revenues for the ATM assembly test and material business (excluding USI) are as follows:

ATM NET REVENUES (UNAUDITED)


Jan

Dec

Jan

Sequential

YoY

(NT$ Million)

2015

2014

2014

Change

Change

Net Revenues

12,838

14,163

11,133

-9.4%

+15.3%








Jan

Dec

Jan

Sequential

YoY

(US$ Million)

2015

2014

2014

Change

Change

Net Revenues

404

456

372

-11.3%

+8.8%


Friday, February 6, 2015

Comments & Business Outlook

Fourth Quarter 2014 Financial Results

  • Net revenue contribution from IC ATM operations was NT$43,884 million for the quarter, up by 16% year-over-year and up by 4% sequentially. Net revenue contribution from packaging operations, testing operations, and substrates sold to third parties wasNT$36,359 million, NT$6,663 million, and NT$862 million, respectively, and each represented approximately 83%, 15%, and 2%, respectively, of total net revenues for the quarter.
  • Earnings (losses) per equivalent ADS Diluted was US$0.162 vs. last years same quarter of US$0.112

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the first quarter of 2015 to be as follows:

  • IC ATM production capacity and blended ASP will be flat; blended IC ATM utilization will come down by 10-15%;
  • The pace for our EMS Q1 sequential change should be similar to 2014Q1;
  • Consolidated gross margin and operating margin should both be similar to 2014Q1

Thursday, January 15, 2015

Comments & Business Outlook

TAIPEI, January 15, 2015 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TWSE: 2311; NYSE: ASX) (ASE) announces that today its board of directors passed resolutions to spin-off of its subsidiary Universal Scientific Industrial Co., Ltd. ("USI") as part of an effort to enhance operational flexibility via structural adjustments. Where necessary, ASE will integrate the business activities of USI with those of other business entities within the group with the aim of achieving increased integral operational efficiency by integrating various group resources dedicated to specialized business operations.

At today's board meeting, subsidiary USI also passed resolutions authorizing the spin-off as well as capital reduction proposals that will assign its investment business with an estimated value of NTD 35.5 billion (including assets, liabilities and business) to USI, Inc. ("New USI"), a newly established business entity. New USI will issue approximately 1 billion new shares at the ratio of 1,000 existing USI shares to 609.2743815 new shares. At the same time, USI plans to undergo a capital reduction of NTD 16,013 million by reducing 975.62902474 shares per 1,000 shares (a reduction ratio of 97.56%). After the capital reduction, the share capital of USI will be reduced from NTD 16,413 million to NTD 400 million. The record date of the spin-off and capital reduction is March 6, 2015. This proposal will be submitted to a special shareholders' meeting of USI to be held on February 2, 2015.

ASE holds a total of 1,625 million common shares in USI, a 99.01% shareholding. After the record date of the USI spin-off and capital reduction, ASE's shareholding is expected to decrease to 39.603 million shares with the same 99.01% shareholding. At the same time, ASE will acquire 990 million shares in New USI, with a 99.01% shareholding. The spin-off is part of the internal structural adjustments in the ASE group and will not have impact on the financial position and business operation of ASE.


Monday, December 15, 2014

Comments & Business Outlook

TAIPEI, Dec. 15, 2014 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE", or the "Company"), the world's largest semiconductor assembly and test service provider, today announced that wafer-level process operations where nickel is used at ASE's K7 plant has been resumed onDecember 15, 2014 pursuant to the Approval Letter (No. 10343171000) that ASE received from the Kaohsiung City Environment Protection Bureau (KEPB) on the same day.

The Company expresses gratitude to the inspectors from the Environmental Inspection Division of the KEPB and Kaohsiung City Government for their corrective instructions and supervision.  The Company has learned lessons and obtained valuable experience since the incident at the K7 plant occurred.  It has taken many mandatory and corrective measures to improve the monitoring system for waste water discharge.  For example, for purpose of information disclosure, the Company has installed LED screens in each of the plant buildings for displaying relevant information.  The Company has also become the first company nationwide to have established direct link to the KEPB and disclose relevant information and data on KEPB's website for public inspection.

In addition, in response to the requests for improvement made on December 8, 2014by director Chen Jinde of the KEPB, including the request for real-time displaying of waste water flow in the central control room of the Company's monitoring system and the request for countermeasures for dealing with abnormal level of accumulation of nickel-containing waste water, the Company has made improvements and has responded to the KEPB within three days and confirmed that such requests had been fulfilled.

The Company expects that in the future it will not only comply with all the safety and environmental regulations but also aspire be deeply rooted as a green plan in the city of Kaohsiung.  The Company has entered into a contract with the National Kaohsiung First University of Science and Technology to establish the "South Taiwan Environmental Education Solution -- Sustainable Development Center" which will commence a series of environmental courses with rich and exciting content by the end of 2014, including those designed for the seniors, families and youth.  Further, we will work with the Environmental Quality Protection Foundation (EQPF) to plant 93 hectares of trees and hold a number of environmental education lectures and establish the first environmental education audio-visual platform.

Furthermore, out of our concern for the local residents of the Nantze District, in order to help elementary schools in Nantze District for energy conservation and carbon emission reduction and protect the vision of the school children, we are in the process of implementing the plan to install power-saving LED lights for the elementary schools in Nantze District.  In the future, along with its revenue and profit generation, the Company will take sincere actions for environment protection and environmental education and fulfill its social responsibility to become a semiconductor industry role model for environment protection.


Thursday, November 20, 2014

Deal Flow

TAIPEI, Nov. 20, 2014 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE", or the "Company") announced today that its subsidiary Universal Scientific Industrial (Shanghai) Co., Ltd. ("USI")(SSE: 601231), which is responsible for electronics design and design manufacture service ("DMS"), completed its capital increase by way of domestic private placements through a bidding process on November 20, 2014, raising a total of RMB2.06 billion (approximately NTD10.43 billion).  The proceeds from this offering will be used to fund the production of wireless modules and wearable miniature modules.  USI's offering received overwhelming response from investors in the PRC capital markets.  The issue price per share was RMB27.06 (1.5 times the minimum issue price of RMB17.86).  After the offering, ASE's holdings in USI decreased by 6.18% from 88.30% to 82.12%.

USI was listed on the main board of the Shanghai Stock Exchange on February 20, 2012.  On the day of listing, USI's issue price per share was RMB7.60, closing price was RMB11.63, and had a total market capitalization of RMB11.77 billion (approximately NTD59.48 billion).  Since its listing on the Shanghai Stock Exchange in 2012, USI's performance has continuously improved, which lead to an increase in its market capitalization to RMB32.57 billion (approx. NTD164.66 billion) as of November 20, 2014.  Currently, USI ranks 115thplace among 2,582 A-share companies in terms of market capitalization.

In 2014, FORTUNEChina listed USI as one of the top 500 enterprises in China, recognizing its continuous efforts in developing wireless modules as well as consumer electronics, automotive electronics, storage and industrial products.  USI was included in the SSE 380 index in January 2013, and in the Shanghai and Shenzhen 300 Index in December of the same year.  As USI is a constituent of the SSE 380 Index, it is one of the eligible stocks tradable through the Shanghai-Hong Kong Stock Connect pilot programme.

As of November 20, 2014, ASE holds 82.12% interest in USI at a market capitalization of NTD135.21 billion, accounting for 46% of ASE's market capitalization of TWD295.26 billion.


Thursday, October 30, 2014

Comments & Business Outlook

Third Quarter 2014 Financial Results

  • Net revenues[1] of NT$66,632 million for the third quarter of 2014 (3Q14), up by 17% year-over-year and up by 14% sequentially.
  • Diluted earnings per share for the quarter were NT$0.82 (or US$0.137 per ADS), compared to diluted earnings per share of NT$0.57 for 3Q13 and NT$0.64 for 2Q14.

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the fourth quarter of 2014 to be as follows:

  • IC-ATM production capacity should increase by roughly 1% quarter-over-quarter; blended IC-ATM utilization rate should go up by 1-3% as compared to 3rd quarter;
  • The pace for our EMS 3rd quarter sequential growth should carry into 4th quarter;
  • Consolidated gross margin should edge down, while consolidated operating margin should be flattish.

Tuesday, September 9, 2014

Comments & Business Outlook

TAIPEI, Sept. 9, 2014 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for August 2014.

CONSOLIDATED NET REVENUES (UNAUDITED)


Aug

Jul

Aug

Sequential

YoY

(NT$ Million)

2014

2014

2013

Change

Change

Net Revenues

20,934

20,052

18,827

+4.4%

+11.2%








Aug

Jul

Aug

Sequential

YoY

(US$ Million)

2014

2014

2013

Change

Change

Net Revenues

700

671

630

+4.3%

+11.1%

Starting from Feb. 1, 2010, Universal Scientific Industrial Co., Ltd.'s consolidated revenues were consolidated into ASE Inc.'s consolidated revenues. Net revenues for the ATM assembly test and material business (excluding USI) are as follows:

ATM NET REVENUES (UNAUDITED)


Aug

Jul

Aug

Sequential

YoY

(NT$ Million)

2014

2014

2013

Change

Change

Net Revenues

13,912

13,398

12,555

+3.8%

+10.8%








Aug

Jul

Aug

Sequential

YoY

(US$ Million)

2014

2014

2013

Change

Change

Net Revenues

465

448

420

+3.8%

+10.7%


Tuesday, August 26, 2014

Comments & Business Outlook

TAIPEI, Taiwan--()--Advanced Semiconductor Engineering, Inc. (TAIEX:2311) (NYSE:ASX), the world's largest semiconductor assembly and test service provider, today announced that it has been selected by Bosch Sensortec GmbH as a key manufacturing and technology partner for production of a leading edge sensor device. Through utilizing advanced wafer level packaging technologies developed at ASE, Bosch Sensortec has successfully brought to market the industry's smallest 3-axis MEMS accelerometer available today. Geared towards highly integrated low-power consumer electronics applications, this leading edge sensor device features digital interfaces in an advanced wafer level chip scale package.

With sensor technologies playing an integral role in emerging applications within the Internet of Things and the smart world evolving around us, there is high demand for innovative IC packaging solutions to meet stringent performance, efficiency, and footprint requirements. As an industry leader, ASE was one of the world�s first providers of wafer level packaging, which enables the smallest package size possible, that being the same size as the die itself. ASE�s proven WLCSP portfolio includes an expanding scope of highly customizable options, encompassing technologies such as high density routing, very thin WLCSPs, low temperature processing, enhanced WLCSP Structures and materials, Wafer Level integrated passives, 3D WLPs, WL MEMS, and embedded die packaging.

�As Bosch Sensortec moved forward with our latest sensor technology, it was clear that we needed a solid and reliable partner that could effectively deliver both the technology and manufacturing capabilities required to bring our product to a dynamic market in a timely fashion,� said Wolfgang Lohner, Chief Financial Officer, Bosch Sensortec GmbH.

Lohner added, �ASE successfully delivered on both fronts, and this is testament to their demonstrated expertise and dedicated focus in evolving their technologies so we could deliver ours to our customers, and ultimately to the world beyond.�

�Semiconductor industry trends towards smaller and thinner form factors is providing major impetus for ASE to explore and develop unique packaging techniques using innovative material and process technologies,� said Fuyu Shih, Vice President of Sales and Marketing, ASE Europe. �ASE is continuously aligning the evolution of our packaging portfolio with the highly intricate technology requirements of our customer base, and our partnership with Bosch Sensortec encompassed key strategic collaboration on advanced technologies involving both WLCSP and TSV.�

Shih elaborated, �Driven by mutual desire to innovate and create, while addressing new demands related to product integration, mobility, and reliability, ASE is pleased that our deep technology integration with Bosch Sensortec produced a milestone sensor device, hence positioning them well within the market.�


Wednesday, July 30, 2014

Comments & Business Outlook
Second Quarter of 2014 Financial Results
  • Net Revenues was NT$39,266,000 vs last years same quarter of NT$36,295,000
  • Diluted earnings per share of NT$0.64 (or US$0.107 per ADS) vs. last years US$0.134

OUTLOOK

Based on our current business outlook and exchange rate assumptions, management projects overall performance for the third quarter of 2014 to be as follows:

  • IC-ATM production capacity should increase by roughly 4% quarter-over-quarter; blended IC-ATM utilization rate should increase by 2-4% from around 80% in Q2;
  • The pace for our EMS first-half year-over-year growth should carry into Q3;
  • Consolidated gross margin should edge down, while consolidated operating margin should edge up.

Thursday, July 17, 2014

Deal Flow

TAIPEI, July 17, 2014 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE", or the "Company") today announced that it has priced an offering of US$300 million aggregate principal amount of guaranteed bonds due 2017 offered by Anstock II Limited, its wholly owned subsidiary (the "Bonds"). The Bonds are unconditionally and irrevocably guaranteed by ASE. The proceeds will be used to fund certain eligible projects to promote the Company's transition to low-carbon and climate resilient growth. Examples of eligible projects may include, among other projects, green buildings, waste water recycling projects, waste water management and projects promoting energy efficiency in manufacturing processes. The Bonds were offered outside the United States pursuant to Regulation S under the Securities Act of 1933, as amended (the "Act").

The Bonds have not been and will not be registered under the Act and these securities may not be offered or sold in the United States absent registration or an applicable exemption from registration requirements.


Thursday, April 17, 2014

Comments & Business Outlook
(Amounts in Thousands Except Earnings Per Share)

 
   
For the Years Ended December 31
 
   
2012
   
2013
 
   
NT$
   
NT$
   
US$ (Note 4)
 
                   
OPERATING REVENUES (Note 4)
  $ 193,972,392     $ 219,862,446     $ 7,370,514  
                         
OPERATING COSTS (Notes 12, 22 and 24)
    157,342,744       177,040,435       5,934,979  
                         
GROSS PROFIT
    36,629,648       42,822,011       1,435,535  
                         
OPERATING EXPENSES (Notes 22 and 24)
                       
Selling and marketing expenses
    2,766,880       2,982,789       99,993  
General and administrative expenses
    8,283,264       8,712,862       292,084  
Research and development expenses
    7,872,422       9,064,712       303,879  
                         
Total operating expenses
    18,922,566       20,760,363       695,956  
                         
Other income and expenses (Notes 24 and 37)
    83,192       (1,348,246 )     (45,198 )
                         
PROFIT FROM OPERATIONS
    17,790,274       20,713,402       694,381  
                         
NON-OPERATING INCOME AND EXPENSES
                       
Other income (Note 24)
    553,088       493,884       16,557  
Other gains and losses (Note 24)
    244,830       447,886       15,015  
Finance costs (Note 24)
    (2,042,544 )     (2,307,455 )     (77,354 )
Share of the profit of associates (Note 4)
    63,076       22,039       739  
                         
Total non-operating income and expenses
    (1,181,550 )     (1,343,646 )     (45,043 )
                         
PROFIT BEFORE INCOME TAX
    16,608,724       19,369,756       649,338  
                         
INCOME TAX EXPENSE (Notes 4, 5 and 25)
    2,960,426       3,499,595       117,318  
                         
PROFIT FOR THE YEAR
    13,648,298       15,870,161       532,020  
                         
OTHER COMPREHENSIVE INCOME (LOSS)
                       
Items that will not be reclassified subsequently to profit or loss:
                       
Remeasurement of defined benefit obligation
    (818,546 )     412,225       13,819  
Income tax relating to items that will not be reclassified subsequently
    140,880       (66,706 )     (2,236 )
      (677,666 )     345,519       11,583  
(Continued)

 

 
   
For the Years Ended December 31
 
   
2012
   
2013
 
   
NT$
   
NT$
   
US$ (Note 4)
 
                   
Items that may be reclassified subsequently to profit or loss:
                 
Exchange differences on translating foreign operations
  $ (3,269,623 )   $ 2,817,268     $ 94,444  
Unrealized gain on available-for-sale financial assets
    16,539       14,839       497  
Cash flow hedges
    53,755       1,245       42  
Share of other comprehensive income of associates
    55,401       55,183       1,850  
Income tax relating to items that may be reclassified subsequently
    (9,138 )     (769 )     (26 )
      (3,153,066 )     2,887,766       96,807  
                         
Other comprehensive income (loss) for the year, net of income tax
    (3,830,732 )     3,233,285       108,390  
                         
TOTAL COMPREHENSIVE INCOME FOR THE YEAR
  $ 9,817,566     $ 19,103,446     $ 640,410  
                         
PROFIT FOR THE YEAR ATTRIBUTABLE TO:
                       
Owners of the Company
  $ 13,191,617     $ 15,404,505     $ 516,410  
Non-controlling interests
    456,681       465,656       15,610  
                         
    $ 13,648,298     $ 15,870,161     $ 532,020  
                         
TOTAL COMPREHENSIVE INCOME FOR THE YEAR ATTRIBUTABLE TO:
                       
Owners of the Company
  $ 9,420,363     $ 18,509,604     $ 620,503  
Non-controlling interests
    397,203       593,842       19,907  
                         
    $ 9,817,566     $ 19,103,446     $ 640,410  
                   
EARNINGS PER SHARE (Note 26)
                 
Basic
  $ 1.77     $ 2.05     $ 0.07  
Diluted
  $ 1.73     $ 1.99     $ 0.07  
                         
EARNINGS PER AMERICAN DEPOSIT SHARE (“ADS”)
                       
Basic
  $ 8.86     $ 10.26     $ 0.34  
Diluted
  $ 8.65     $ 9.96     $ 0.33  

Monday, April 7, 2014

Joint Venture

TAIPEI, Taiwan--()--Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX), the world's largest semiconductor assembly and test service provider, today announced a joint development with Inotera Memories, Inc. (TAIEX: 3474), a leading DRAM wafer foundry, in a move to further strengthen ASE�s System-in-Package (SiP) capabilities. Complementing ASE�s established portfolio, Inotera will provide manufacturing services for silicon interposer, an interconnect device on silicon wafer for 2.5D IC solutions. This collaborative business model, combining Inotera�s strong front-end wafer processing capability with ASE�s advanced IC packaging and testing technology, will serve to deliver solutions featuring high quality, stable yield and an efficient cost structure, to a broader customer base and market.

Semiconductor is playing a significant role in enabling the stark sophistication evolving within today�s vast technology landscape. However, semiconductor evolution is being faced with serious challenges, including the industry need for higher performance and bandwidth, lower power, and increased efficiency. Continuously rising costs are also affecting technology adoption and market growth. According to Gartner, the PC and Server space is experiencing slow down, hence applications driving market growth through 2017 are to be found in the ultra-mobile PC, tablet, smartphone and emerging Internet of Things (IOT) sectors. Chip makers supplying to these segments are progressively required to integrate increased functionality within smaller form factors, therefore enabling products to be faster and smarter. IC manufacturing is playing a larger role within the supply chain and is seeking optimum improvement in regard to process and production.

ASE is continuously exploring and developing new technologies in package design and manufacturing, particularly advanced IC technologies such as 2.5D ICs and 3D ICs, to address market needs within the fast moving mobility space. Essentially, SiP is a module containing an electronic system or sub-systems that utilize such 2.5/3D IC packaging technologies to miniaturize the package. Together with ASE�s electronic manufacturing services (EMS) subsidiary, Universal Scientific Industrial (USI), ASE is offering customers a complete SiP solution, encompassing design to manufacturing to logistical integration. SiP technology is integral to many end market applications including products incorporating biometric touch, sensors, wireless, power management, camera modules, RF front end and lighting, all of which are prevalent within today�s vast technology landscape.

�Inotera hopes to contribute our high-quality and cost-effective manufacturing capability to ASE�s SiP solution through the collaboration,� said Dr. Scott Meikle, President of Inotera. �By combining strengths complementary and maintaining a full commitment to our DRAM capacity, Inotera and ASE can provide an enabling capability to the semiconductor supply chain,� emphasized Dr. Meikle.

�ASE recognizes that collaboration within the supply chain is critical to the success of our vision for system integration, and it is through the establishment of strong partnerships that we can work together to bring optimum value and just-in-time solutions to our customers,� said Dr Tien Wu, Chief Operating Officer, ASE Group.

He continued, �Inotera is a proven leader in DRAM wafer fab technology and has expanded its capabilities to offer silicon interposer foundry services to benefit ASE�s complete SiP solution. ASE�s dedicated R&D team is developing proprietary IC packaging IPs, working with various material and equipment suppliers, as well as customers to further expand and strengthen our SiP portfolio.�


Tuesday, January 7, 2014

Comments & Business Outlook

TAIPEI, Taiwan, R.O.C., Jan. 7, 2014 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for December and 4th quarter of 2013.


Friday, November 8, 2013

Joint Venture

TAIPEI, Taiwan--()--Advanced Semiconductor Engineering, Inc (ASE, NYSE: ASX, TAIEX: 2311) announced today a joint development and production agreement for assembly services of automotive products with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). The collaboration will focus on enabling copper wire bonding for QFP packages in automotive microcontrollers and manufacturing.

�Enabling copper wire bonding for QFP packages in microcontrollers will further enhance our competitive strength in the automotive market,� said Peter Schaefer, VP and GM of the Automotive Microcontroller business unit at Infineon Technologies. �We trust in ASE with their strong manufacturing background to fulfill the stringent automotive market quality requirements and build on the long existing partnership to enlarge our current QFP portfolio for future microcontrollers.�

One of the major drivers in the semiconductor industry�s use of copper was the rising cost of gold. Copper wire bonding has made IC assembly more competitive in terms of cost. Copper also has excellent performance in thermal and electrical conductivity. The ASE Group has been a forerunner in copper wire bonding assembly manufacturing services since 2008 and has shipped more than 25 billion units of copper wire IC packages to date.

�This announcement marks another milestone in ASE�s technology roadmap. The use of copper wire bonding in packages for the automotive market requires adherence to a higher threshold of quality assurance standards,� said Dr Tien Wu, COO of the ASE Group. �Our collaboration with Infineon will enable ASE to learn and adopt world class standards from a leading automotive semiconductor company.�


Wednesday, October 30, 2013

Comments & Business Outlook

Third Quarter 2013 Financial Results

  • Total net revenues NT$56,748 vs. last years NT$48,991.
  • Diluted earnings per share for the quarter were NT$0.57 (or US$0.096 per ADS), compared to diluted earnings per share of NT$0.46 for 3Q12 and NT$0.50 for 2Q13.

"Strong execution resulted in another quarter of sequential growth," said Jason Chang, Chairman and CEO, ASE Group. "ASE's evolution continues, however, we recognize the global economy remains somewhat volatile as market and geopolitical landscapes continue to display dimensions of concern."

Chang continued, "The semiconductor market itself is going through a period of rapid change in line with intense proliferation of sophisticated electronics, geared towards improving lifestyle and efficiency. ASE is responding to this change, through meaningful innovation and technology alignment, driven by a clear vision to create value and meet demand within our evolving ecosystem."

OUTLOOK

Based on our current business outlook and exchange rate assumption, management projects overall performance for the fourth quarter of 2013 to be as follows:

  • Our IC-ATM revenue should decline 0% to 3% and our EMS business to grow in excess of 25%;
  • Our consolidated gross profit margin is expected to be between 18% and 19%;
  • Our capital expenditure for full year 2013 will be around US$700 million, subject to adjustments in line with market condition.

Wednesday, August 7, 2013

Comments & Business Outlook

TAIPEI, Taiwan, R.O.C., Aug. 7, 2013 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for July 2013.


Friday, July 26, 2013

Comments & Business Outlook

Second Quarter of 2013 Unaudited Financial Results

  • Unaudited net revenue[1] of NT$50,760 million for the second quarter of 2013 (2Q13), up by 11% year-over-year and up by 5% sequentially.
  • Net income attributable to shareholders of the parent for the quarter totaled NT$3,820 million, up from a net income attributable to shareholders of the parent of NT$3,196 million in 2Q12 and up from a net income attributable to shareholders of the parent of NT$2,231 million in 1Q13.
  • Diluted earnings per share for the quarter were NT$0.50 (or US$0.084 per ADS), compared to diluted earnings per share of NT$0.42 for 2Q12 and NT$0.29 for 1Q13.

"We are pleased to achieve another quarter of solid growth," said Jason Chang, Chairman and CEO, ASE Group. "Global industry remains dynamic, however, our strategy on expanding market share, technology leadership, and infrastructure scale remains unchanged, and, we are positioning ASE and our customers for success.

Chang added, "Looking forward, our focus on semiconductor evolution continues to drive the next step of innovation and consolidation at ASE. Through strong partnership and deep collaboration, our customers are providing steady guidance as we explore the next level of efficiency and optimization."

OUTLOOK

Based on our current business outlook and exchange rate assumption, management projects overall performance for the third quarter of 2013 to be as follows:

  • Our IC-ATM revenue to grow between 1% to 5% and our EMS business to grow in excess of 25%;
  • Our IC-ATM gross profit margin should be flattish to slightly up while our EMS business gross margin should soften by 0.6-0.9 percentage points.

Monday, May 20, 2013

Acquisition Activity

TAIPEI, Taiwan, R.O.C., May 20, 2013 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) (the "ASE", or the "Company") hereby announces that in order to strengthen the capability of its Shanghai subsidiary for providing IC assembly and testing services, ASE will procure its wholly-owned subsidiary, ASE Assembly & Test (Shanghai) Limited (the "ASESH") to enter into an equity interests transfer agreement (the "EITA") with Toshiba Semiconductor (Wuxi) Co., Ltd. ("TSW") ( a subsidiary of Toshiba Corporation).  Under the EITA, ASESH will pay RMB 70 million to TSW to acquire 100% shares in Wuxi Tongzhi Microelectronics Co., Ltd. held by TSW.


Friday, April 26, 2013

Comments & Business Outlook

First Quarter 2013 Results

  • Net revenue[1] of NT$48,190 million for the up by 12% year-over-year and down by 14% sequentially.
  • Net income attributable to shareholders of the parent for the quarter totaled NT$2,231 million, up from a net income attributable to shareholders of the parent of NT$2,046 million in 1Q12 and down from a net income attributable to shareholders of the parent of NT$4,373 million in 4Q12.
  • Diluted earnings per share for the quarter were NT$0.29 (or US$0.049per ADS), compared to diluted earnings per share of NT$0.27 for 1Q12 and NT$0.58 for 4Q12.

Effective January 1, 2013, companies listed on the Taiwan Stock Exchange, including us, must report their financial statements under Guidelines Governing the Preparation of Financial Reports by Securities Issuers and the IFRS, International Accounting Standards, and the Interpretations as well as related guidance translated by the Accounting Research and Development Foundation and issued by the R.O.C. Financial Supervisory Commission (collectively, the "Taiwan-IFRS"). Accordingly, we have adopted Taiwan-IFRS in the ROC for our interim quarterly earnings releases beginning since the first quarter of 2013 and our annual consolidated financial statements for the year ending December 31, 2013.


Tuesday, April 9, 2013

Comments & Business Outlook

TAIPEI, Taiwan, R.O.C., April 9, 2013 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc.

(NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for March and 1st quarter of 2013.

CONSOLIDATED NET REVENUES (UNAUDITED)


Mar

Feb

Mar

Sequential

YoY

(NT$ Million)

2013

2013

2012

Change

Change

Net Revenues

17,149

14,434

15,365

+18.8%

+11.6%








Mar

Feb

Mar

Sequential

YoY

(US$ Million)

2013

2013

2012

Change

Change

Net Revenues

579

491

521

+17.9%

+11.0%








Q1

Q4

Q1

Sequential

YoY

(NT$ Million)

2013

2012

2012

Change

Change

Net Revenues

48,190

56,008

43,101

-14.0%

+11.8%








Q1

Q4

Q1

Sequential

YoY

(US$ Million)

2013

2012

2012

Change

Change

Net Revenues

1,643

1,923

1,450

-14.6%

+13.3%

 

Starting from Feb. 1, 2010, Universal Scientific Industrial Co., Ltd.'s consolidated revenues were consolidated into ASE Inc.'s

consolidated revenues.  Net revenues for the ATM assembly test and material business (excluding USI) are as follows:

ATM NET REVENUES (UNAUDITED)


Mar

Feb

Mar

Sequential

YoY

(NT$ Million)

2013

2013

2012

Change

Change

Net Revenues

11,321

9,623

10,405

+17.6%

+8.8%








Mar

Feb

Mar

Sequential

YoY

(US$ Million)

2013

2013

2012

Change

Change

Net Revenues

382

327

353

+16.8%

+8.3%








Q1

Q4

Q1

Sequential

YoY

(NT$ Million)

2013

2012

2012

Change

Change

Net Revenues

31,317

34,395

29,236

-8.9%

+7.1%








Q1

Q4

Q1

Sequential

YoY

(US$ Million)

2013

2012

2012

Change

Change

Net Revenues

1,068

1,181

984

-9.6%

+8.5%


Wednesday, January 9, 2013

Comments & Business Outlook
TAIPEI, Taiwan, R.O.C., Jan. 9, 2013 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for December and 4th quarter of 2012.  Revenues increased 27.2% year over year for the month of december.

Friday, October 26, 2012

Comments & Business Outlook

TAIPEI, Taiwan, Oct. 26, 2012 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("We", "ASE", or the "Company"), the world's largest independent provider of packaging and testing services, today reported unaudited net revenue (1) of NT$48,991 million for the third quarter of 2012 (3Q12), up by 5% year-over-year and up by 7% sequentially.  Net income for the quarter totaled NT$3,446 million, down from a net income of NT$3,468 million in 3Q11 and up from a net income of NT$3,202 million in 2Q12.  Diluted earnings per share for the quarter were NT$0.45 (or US$0.076 per ADS), compared to diluted earnings per share of NT$0.45 for 3Q11 and NT$0.42 for 2Q12.

"ASE delivered solid results this past quarter with revenue of NT$48,991 million, representing 7% growth over second quarter revenues," said Jason Chang, Chairman, ASE Group.  "Especially given the tepid economic environment, these results indicate that we are following our long-term strategic plan of growing ASE, through concentrated efforts on our copper wirebond, advanced packaging technology, and low pin count portfolios."


Monday, July 9, 2012

Comments & Business Outlook
TAIPEI, Taiwan, July 9, 2012 /PRNewswire-Asia/ -- Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for June and 2nd quarter of 2012. Net revenues increased 4.5% year over year for June.

Thursday, June 7, 2012

Comments & Business Outlook
TAIPEI, June 7, 2012 /PRNewswire-Asia/ -- ADVANCED SEMICONDUCTOR ENGINEERING, INC. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for May 2012. Revenues increased 1.3% year over year for the month of May.

Friday, April 27, 2012

Comments & Business Outlook

First Quarter 2012 Results

  • Net revenue contribution from IC packaging operations, testing operations, EMS operations, substrates sold to third parties and others was NT$23,531 million, NT$5,077 million, NT$13,889 million, NT$553 million and NT$51 million, respectively, and each represented approximately 55%, 12%, 32%, 1% and 0%, respectively, of total net revenues for the quarter.
  •  Net income for the quarter totaled NT$2,056 million, down from a net income of NT$3,974 million in 1Q11 and down from a net income of NT$2,639 million in 4Q11. Diluted earnings per share for the quarter were NT$0.31 (or US$0.052 per ADS), compared to diluted earnings per share of NT$0.58 for 1Q11 and NT$0.40 for 4Q11.

Friday, October 28, 2011

Comments & Business Outlook

Third Quarter 2011 Results

  •  Net revenue of NT$46,698 million for the third quarter of 2011, down by 9% year-over-year
  •  Net income for the quarter totaled NT$3,468 million, down from a net income of NT$5,460 million in 3Q10
  • Diluted earnings per share for the quarter were NT$0.52 (or US$0.089 per ADS), compared to diluted earnings per share of NT$0.81 for 3Q10

Thursday, August 4, 2011

Comments & Business Outlook

TAIPEI, Aug 4, 2011 /PRNewswire-Asia-FirstCall/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("We", "ASE", or the "Company"), the world's largest independent provider of IC packaging and testing services, today reported unaudited net revenue (Note 1) of NT$46,254 million for the second quarter of 2011 (2Q11), the same as year-over-year while increased by 1% sequentially.  Net income for the quarter totaled NT$3,644 million, down from a net income of NT$4,613 million in 2Q10 and down from net income of NT$3,974 million in 1Q11.  Diluted earnings per share for the quarter were NT$0.60 (or US$0.104 per ADS), compared to diluted earnings per share of NT$0.76 for 2Q10 and diluted earnings per share of NT$0.65 for 1Q11


Friday, June 24, 2011

Liquidity Requirements

We have historically been able to satisfy our working capital needs from our cash flow from operations. We have historically funded our capacity expansion from internally generated cash and, to the extent necessary, the issuance of equity securities and long-term borrowings.

We currently expect to meet our payment obligations through the expected cash flow from operations, long-term borrowings and the issuance of additional equity or equity-linked securities.



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