ASAT Holdings Limited is a global provider of semiconductor assembly, test and package design services. With 20 years of experience, the Company offers a definitive selection of semiconductor packages and world-class manufacturing lines. ASAT's advanced package portfolio includes standard and high thermal performance fine pitch ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip. The Company has locations in the United States, Asia and Europe. ASAT Inc. is a wholly owned subsidiary of ASAT Holdings Limited and the exclusive representative of its services in North America.

ASAT China
ASAT's 560,000 square foot state-of-the-art facility is one of the largest and most advanced semiconductor subcontract assembly and test manufacturing facilities in China. Strategically located in Dongguan, China, about 90 minutes from Hong Kong, the facility offers higher productivity, improved efficiency, and close proximity to ASAT's key end users. ASAT has invested in the latest generation ERP systems, which deliver better real-time visibility and control of the Company's manufacturing process across its different manufacturing operations. In addition, ASAT offers production lines for the most advanced packaging technologies, including its leading quad flat no-lead (QFN) technology with its Leadless Plastic Chip Carrier (LPCC), fine pitch BGA, Flip Chip, Thin Array Plastic Package (TAPP®), and enhanced leaded packages. ASAT's China facility is ready to meet the growing demand for smaller, faster and more cost effective high-performance devices.